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BALL Other Function uPs,uCs & Peripheral ICs 1,582

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XA7Z020-1CLG400Q by Xilinx

XA7Z020-1CLG400Q

Xilinx

XA7Z020-1CLG400Q by Xilinx is an automotive-grade microprocessor circuit with 400 terminals in a low-profile grid array package. Operating b/w -40 to 125°C, it features power supplies of 1V and 1.8V, making it ideal for automotive applications requiring high-performance computing capabilities.

S-PBGA-B400

e1

17 mm

3

400

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

N

17 mm

MICROPROCESSOR CIRCUIT

XA7Z020-1CLG484Q by Xilinx

XA7Z020-1CLG484Q

Xilinx

XA7Z020-1CLG484Q by Xilinx is a MICROPROCESSOR CIRCUIT with 484 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Features include 1.8V power supply, 0.8mm terminal pitch, and TIN SILVER COPPER finish.

S-PBGA-B484

e1

19 mm

3

484

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

N

19 mm

MICROPROCESSOR CIRCUIT

XA7Z030-1FBG484I by Xilinx

XA7Z030-1FBG484I

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Ultraviolet Erasable: N;

S-PBGA-B484

e1

23 mm

4

484

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

250

1,1.8

Not Qualified

AEC-Q100

2.54 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

N

23 mm

MICROPROCESSOR CIRCUIT

XA7Z030-1FBG484Q by Xilinx

XA7Z030-1FBG484Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B484

e1

23 mm

4

484

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

250

1,1.8

Not Qualified

AEC-Q100

2.54 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

N

23 mm

MICROPROCESSOR CIRCUIT

TMS320DM6446BZWTA by Texas Instruments

TMS320DM6446BZWTA

Texas Instruments

TMS320DM6446BZWTA by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16mm width, and 48-bit external data bus width. Ideal for industrial applications, it features a max operating temperature of 105°C and supports I2C, SPI, UART, and USB bus compatibility.

32

I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TCI6630K2LCMSA2 by Texas Instruments

TCI6630K2LCMSA2

Texas Instruments

TCI6630K2LCMSA2 by Texas Instruments is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0.902V to 0.997V and can withstand peak reflow temperature of 245°C for up to 30s. Ideal for high-performance computing applications requiring advanced processing capabilities.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LCMS by Texas Instruments

TCI6630K2LCMS

Texas Instruments

TCI6630K2LCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for high-performance computing applications requiring advanced processing capabilities.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LDCMSA2 by Texas Instruments

TCI6630K2LDCMSA2

Texas Instruments

TCI6630K2LDCMSA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. This IC is suitable for applications requiring high-performance processing capabilities in electronic systems.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LDCMSA by Texas Instruments

TCI6630K2LDCMSA

Texas Instruments

Texas Instruments TCI6630K2LDCMSA is a CMOS MICROPROCESSOR CIRCUIT with 900 BALL terminals in a GRID ARRAY package. It operates b/w 0.902V to 0.997V, with a peak reflow temperature of 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LSCMSA2 by Texas Instruments

TCI6630K2LSCMSA2

Texas Instruments

TCI6630K2LSCMSA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 900 terminals in a GRID ARRAY package style, suitable for surface mount applications. Operating b/w 0.902V to 0.997V, it offers high performance in various electronic systems.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LSCMSA by Texas Instruments

TCI6630K2LSCMSA

Texas Instruments

TCI6630K2LSCMSA by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. This IC is suitable for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMS2 by Texas Instruments

TCI6630K2LXCMS2

Texas Instruments

TCI6630K2LXCMS2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates on a supply voltage range of 0.902V to 0.997V, making it suitable for high-performance computing applications requiring advanced CMOS technology and surface mount compatibility. With a peak reflow temperature of 245°C, this device offers reliable performance in demanding environments.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMSA2 by Texas Instruments

TCI6630K2LXCMSA2

Texas Instruments

Texas Instruments TCI6630K2LXCMSA2 is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages b/w 0.902V to 0.997V, utilizing CMOS technology. Ideal for applications requiring high-performance computing in compact form factors.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMSA by Texas Instruments

TCI6630K2LXCMSA

Texas Instruments

TCI6630K2LXCMSA by Texas Instruments is a microprocessor circuit with a max supply voltage of 0.997V and a min supply voltage of 0.902V. It is used in applications requiring high-performance processing capabilities.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMS by Texas Instruments

TCI6630K2LXCMS

Texas Instruments

TCI6630K2LXCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TMS320DM6446AZWTA by Texas Instruments

TMS320DM6446AZWTA

Texas Instruments

TMS320DM6446AZWTA by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16mm width, and 48-bit external data bus width. Ideal for industrial applications, it features I2C, SPI, UART, USB compatibility and operates in temperatures ranging from -40 to 105°C.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM6446AZWT by Texas Instruments

TMS320DM6446AZWT

Texas Instruments

TMS320DM6446AZWT by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16384 RAM words, and 48-bit external data bus width. Ideal for applications requiring MICROPROCESSOR CIRCUIT technology, such as I2C, SPI, UART, and USB bus compatibility in a compact GRID ARRAY package style.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM6443AZWT by Texas Instruments

TMS320DM6443AZWT

Texas Instruments

TMS320DM6443AZWT by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16mm width, and 48-bit external data bus width. Ideal for applications requiring MICROPROCESSOR CIRCUIT technology, such as Ethernet, I2C, SPI, UART, and USB interfaces in a compact GRID ARRAY package style.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM335ZCE135 by Texas Instruments

TMS320DM335ZCE135

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM335ZCE270 by Texas Instruments

TMS320DM335ZCE270

Texas Instruments

TMS320DM335ZCE270 by Texas Instruments is a 32-bit microprocessor with 337 terminals, operating at temperatures from 0 to 85°C. It supports I2C, SPI, UART, and USB buses and has a supply voltage range of 1.235V to 1.365V. Ideal for applications requiring high-performance computing in compact spaces.

I2C; SPI; UART; USB

32

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

Not Qualified

1.3 mm

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM368ZCEDZ by Texas Instruments

DM368ZCEDZ

Texas Instruments

The Texas Instruments DM368ZCEDZ is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.28V to 1.42V. This IC is ideal for industrial applications requiring a low profile, fine pitch GRID ARRAY package style.

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM368ZCEZ by Texas Instruments

DM368ZCEZ

Texas Instruments

The Texas Instruments DM368ZCEZ is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it suitable for various applications requiring low profile, fine pitch GRID ARRAY packages.

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM6446ANB6C2127VC by Texas Instruments

DM6446ANB6C2127VC

Texas Instruments

DM6446ANB6C2127VC by Texas Instruments is a microprocessor circuit with a package style of grid array, low profile, fine pitch. It operates at a max supply voltage of 1.26V and has a min operating temperature of 0°C. This IC is commonly used in various applications requiring high-performance processing capabilities.

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

DM6446AZWTKEDACOM by Texas Instruments

DM6446AZWTKEDACOM

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

DM6446GB6C0121MV by Texas Instruments

DM6446GB6C0121MV

Texas Instruments

DM6446GB6C0121MV by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates b/w 0-85 °C, with supply voltage range of 1.14-1.26 V. Ideal for applications requiring low profile and fine pitch technology.

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

DM8147SCIS0 by Texas Instruments

DM8147SCIS0

Texas Instruments

The Texas Instruments DM8147SCIS0 is a MICROPROCESSOR CIRCUIT with 684 terminals in a GRID ARRAY package. It operates b/w 0-90 °C, with a supply voltage range of 3.14-3.47 V. Suitable for applications requiring ETHERNET, I2C, SPI, UART, USB compatibility at speeds up to 1000 rpm.

IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY

ETHERNET; I2C; SPI; UART; USB

48

S-PBGA-B684

e1

23 mm

4

684

90 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.06 mm

1000 rpm

3.47 V

3.14 V

3.3 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

23 mm

MICROPROCESSOR CIRCUIT

OMAPL132EZWT2 by Texas Instruments

OMAPL132EZWT2

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

200 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL132EZWTA2E by Texas Instruments

OMAPL132EZWTA2E

Texas Instruments

OMAPL132EZWTA2E by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at speeds up to 200 rpm and has a low profile GRID ARRAY package style. Ideal for industrial applications requiring a supply voltage range of 1.14V to 1.32V and operating temperatures from -40°C to 105°C.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

200 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL132EZWTA2R by Texas Instruments

OMAPL132EZWTA2R

Texas Instruments

OMAPL132EZWTA2R by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at 200 rpm speed and has a max supply voltage of 1.32 V. This low-profile, fine-pitch GRID ARRAY package is ideal for industrial applications requiring high performance in a compact form factor.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

200 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL132EZWTA2 by Texas Instruments

OMAPL132EZWTA2

Texas Instruments

OMAPL132EZWTA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at speeds up to 200 rpm and has a low profile GRID ARRAY package style. Ideal for industrial applications, it has a wide temperature range from -40 to 105 °C.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

200 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL138BZWTRB by Texas Instruments

OMAPL138BZWTRB

Texas Instruments

OMAPL138BZWTRB by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-90°C, with supply voltage range of 1.25-1.35V. This SQUARE package has 361 terminals and is ideal for applications requiring low profile, fine pitch ICs in surface mount configurations.

IT ASLO OPERATES IN 0.95V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.35 V

1.25 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL138CZWTA3RW by Texas Instruments

OMAPL138CZWTA3RW

Texas Instruments

OMAPL138CZWTA3RW by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature grade range from -40 to 105 °C and has a low profile GRID ARRAY package style. With 361 terminals, it features a supply voltage range of 1.14V to 1.32V, making it ideal for various embedded applications requiring high performance and reliability.

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZCE3 by Texas Instruments

OMAPL138EZCE3

Texas Instruments

OMAPL138EZCE3 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates b/w 0-90 °C, suitable for applications requiring low power consumption and high processing speed like IoT devices and embedded systems.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

13 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZCE4 by Texas Instruments

OMAPL138EZCE4

Texas Instruments

OMAPL138EZCE4 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates b/w 0-90 °C, with a supply voltage range of 1.25-1.35 V. Ideal for applications requiring I2C, SPI, UART, or USB bus compatibility in a compact GRID ARRAY package style.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

13 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZCEA3E by Texas Instruments

OMAPL138EZCEA3E

Texas Instruments

OMAPL138EZCEA3E by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature grade range from -40 to 105 °C and has a low profile GRID ARRAY package style. With a max supply voltage of 1.35 V, it is suitable for various applications requiring high-performance processing capabilities.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

S-PBGA-B361

e1

13 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.35 V

1.25 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZCEA3R by Texas Instruments

OMAPL138EZCEA3R

Texas Instruments

OMAPL138EZCEA3R by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates in an INDUSTRIAL temperature grade range of -40 to 105 °C, making it suitable for various applications requiring high-speed processing and reliable performance. With compatibility for I2C, SPI, UART, and USB buses, this device is ideal for industrial automation systems and embedded computing solutions.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

13 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZCEA3 by Texas Instruments

OMAPL138EZCEA3

Texas Instruments

The Texas Instruments OMAPL138EZCEA3 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width, operating at up to 50 MHz. It features a GRID ARRAY package style with 361 terminals and is suitable for industrial applications requiring I2C, SPI, UART, and USB bus compatibility.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

13 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZCED4E by Texas Instruments

OMAPL138EZCED4E

Texas Instruments

OMAPL138EZCED4E by Texas Instruments is a low-profile, fine-pitch microprocessor circuit with a max clock frequency of 50 MHz. It is suitable for industrial applications and supports I2C, SPI, UART, and USB bus compatibility.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

13 mm

3

361

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZWT3 by Texas Instruments

OMAPL138EZWT3

Texas Instruments

OMAPL138EZWT3 by Texas Instruments is a low-profile, fine-pitch microprocessor circuit with 361 terminals. It operates at a max clock frequency of 50 MHz and has a data bus width of 32. This versatile IC is compatible with I2C, SPI, UART, and USB buses, making it suitable for various applications requiring high-speed processing.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

16 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZWT4 by Texas Instruments

OMAPL138EZWT4

Texas Instruments

The Texas Instruments OMAPL138EZWT4 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates b/w 0 to 90 °C, suitable for applications requiring I2C, SPI, UART, USB compatibility in a PLASTIC/EPOXY package style.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

16 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZWTA3E by Texas Instruments

OMAPL138EZWTA3E

Texas Instruments

OMAPL138EZWTA3E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It is ideal for industrial applications requiring I2C, SPI, UART, and USB bus compatibility. This low-profile IC operates b/w -40 to 105 °C with a supply voltage range of 1.25V to 1.35V.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZWTA3 by Texas Instruments

OMAPL138EZWTA3

Texas Instruments

OMAPL138EZWTA3 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates in an INDUSTRIAL temperature grade range of -40 to 105 °C, making it suitable for applications requiring high-speed processing in harsh environments. With I2C, SPI, UART, and USB bus compatibility, this device is ideal for various embedded systems and industrial automation solutions.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZWTA4 by Texas Instruments

OMAPL138EZWTA4

Texas Instruments

OMAPL138EZWTA4 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.25V to 1.35V, making it ideal for industrial applications requiring high performance in a compact GRID ARRAY package.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.35 V

1.25 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZWTD4E by Texas Instruments

OMAPL138EZWTD4E

Texas Instruments

OMAPL138EZWTD4E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates in an INDUSTRIAL temperature grade range of -40 to 90 °C, suitable for applications requiring high-speed processing and connectivity via I2C, SPI, UART, and USB interfaces.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

16 mm

3

361

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

SN3490586 by Texas Instruments

SN3490586

Texas Instruments

SN3490586 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates b/w 0-85 °C and has a supply voltage range of 1.15-1.25 V, making it ideal for low-power applications requiring high performance.

IT ASLO OPERATES IN 1V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.25 V

1.15 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMSDM6446AZWT-COM by Texas Instruments

TMSDM6446AZWT-COM

Texas Instruments

TMSDM6446AZWT-COM by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates b/w 0-85 °C with supply voltage range of 1.14-1.26 V, suitable for applications requiring low profile and fine pitch components.

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TNETV1647GSTZWT by Texas Instruments

TNETV1647GSTZWT

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;

IT ASLO OPERATES IN 1V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.25 V

1.15 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TNETV6446AINZWT8 by Texas Instruments

TNETV6446AINZWT8

Texas Instruments

TNETV6446AINZWT8 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.14-1.26 V, making it suitable for various applications requiring low profile, fine pitch GRID ARRAY package style.

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT