Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Chip carriers and sockets are electronic components that are used to connect and secure an integrated circuit (IC) or a microprocessor to a printed circuit board (PCB) in an electronic device.Both sockets and chip carriers serve as an interface between the IC or microprocessor and the PCB, allowing for easy replacement or upgrading of the component without the need for soldering or desoldering. They provide a mechanical and electrical connection between the component and the board, and can also provide heat dissipation and other features, depending on the specific design.A socket is typically a plastic or ceramic component with a series of electrical contacts that match the pins on the IC or microprocessor. The component is inserted into the socket, which holds it securely in place and ensures a reliable electrical connection. Sockets are commonly used in development and testing of electronic devices, where the IC or microprocessor may need to be swapped out frequently.A chip carrier, on the other hand, is a type of package for an IC or microprocessor that provides a more compact form factor. It typically has a square or rectangular shape, and features a grid of pins or contacts on the underside that mate with corresponding pads on the PCB. Chip carriers are commonly used in production of electronic devices, where they provide a reliable and space-efficient way to connect the IC or microprocessor to the PCB.Both sockets and chip carriers allow for easy replacement or upgrading of critical components without the need for specialized tools or expertise.
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1825575-2
TE Connectivity
TE Connectivity's 1825575-2 is a Chip Carrier IC Socket with 8 contacts, BE-CU material, and SN finish. It has a PCB contact row spacing of 17.78mm and mating pitch of 0.1 inch, suitable for DIP8 devices. Ideal for surface mount applications in electronics, it operates b/w -55°C to 125°C with a current rating of 1A.
8
Tin
Beryllium Copper
Round Pin Socket
Surface Mount
0.1 in (2.54 mm)
0.7 in (17.78 mm)
Straight
Rectangular
IC Socket
0.398 in (10.109 mm)
0.22 in (5.588 mm)
1 A
1400 VAC
10 GΩ
-55 °C (-67 °F)
125 °C (257 °F)
DIP8
1825575
110-83-314-41-801101
Preci-dip Sa
110-83-314-41-801101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts, rated at 1A current. It features a PCB contact row spacing of 7.62mm and housing material made of POLYBUTYLENE TEREPHTHALATE. This socket has a mating contact pitch of 0.1 inch and is suitable for applications requiring reliable connections in electronic devices.
14
Gold
Solder
0.3 in (7.62 mm)
Polybutylene Terephthalate (PBT)
0.697 in (17.704 mm)
0.11 in (2.794 mm)
-25 °C (-13 °F)
85 °C (185 °F)
DIP14
110
110-83-316-41-801101
110-83-316-41-801101 by Preci-dip Sa is a DIP16 IC socket with 16 contacts, rated at 1A current. It features a PCB contact row spacing of 7.62mm and mating contact pitch of 0.1 inch, suitable for chip carrier applications. With solder termination and body dimensions of 0.799" length, 0.398" width, and 0.165" depth, it operates b/w -25°C to 85°C temperature range.
16
0.799 in (20.295 mm)
0.165 in (4.191 mm)
DIP16
P2CF-11
Omron
Omron's P2CF-11 is a 11-contact chip carrier IC socket for relays, featuring screw termination and 5A current rating. With dimensions of 2.76" x 1.97" x 1.23", it offers high insulation resistance (1G ohm) and dielectric voltage withstand (2000VAC), ideal for relay applications requiring secure connections.
11
Mixed
Screw
Relay Socket
2.76 inch
1.97 inch
1.23 in (31.242 mm)
5 A
2000 VAC
1 GΩ
RELAY
818-AG11D-ESL-LF
TE Connectivity's 818-AG11D-ESL-LF is a Chip Carrier IC Socket with 18 contacts, rated at 3A current. Featuring rectangular PCB contact pattern with 7.62mm row spacing, it uses solder termination and operates b/w -55°C to 105°C. Ideal for DIP18 devices, this socket has a dielectric voltage of 1000VAC and insulation resistance of 5G ohm.
18
Thermoplastic Polyester
0.9 in (22.86 mm)
0.4 in (10.16 mm)
0.105 in (2.667 mm)
3 A
1000 VAC
5 GΩ
105 °C (221 °F)
DIP18
Standard: UL 94V-0
110-83-314-41-001101
110-83-314-41-001101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts, rated for 1A current. It features Beryllium Copper contact material, Gold mating finish, and Tin termination finish. With a PCB contact row spacing of 7.62mm, it has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for chip carrier IC applications due to its high insulation resistance and durable housing material.
Gold (30)
Polycyclohexyldimethylene Terephthalate (PCT)
e3
Standard: UL 94V-0, Low Profile
110-87-310-41-001101
110-87-310-41-001101 by Preci-dip Sa is a DIP10 IC socket with 10 contacts, rated for 1A current. Featuring Beryllium Copper contact material and Gold Flash finish, it has a PCB row spacing of 7.62mm and operates b/w -55°C to 125°C. Ideal for chip carrier applications requiring high insulation resistance and dielectric voltage withstand capabilities up to 1400VAC.
10
Gold Flash
DIP10
110-87-320-41-001101
110-87-320-41-001101 by Preci-dip Sa is a DIP20 IC socket with 20 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and operates b/w -55°C to 125°C. With a PCB contact row spacing of 7.62mm, it is ideal for applications requiring high insulation resistance and dielectric voltage withstand capabilities up to 1400VAC.
20
DIP20
110-87-328-41-001101
110-87-328-41-001101 by Preci-dip Sa is a DIP28 IC socket with 28 contacts, Beryllium Copper contact material, and Gold Flash finish. It has a PCB contact row spacing of 7.62mm and operates b/w -55°C to 125°C. Ideal for chip carrier applications requiring high insulation resistance and dielectric voltage withstand capabilities.
28
DIP28
110-87-628-41-001101
110-87-628-41-001101 by Preci-dip Sa is a DIP28 IC socket with 28 contacts, rated for 1A current. It features Beryllium Copper contacts with Gold Flash finish and Polycyclohexydimethylene Terephthalate-Polyester housing material. With a temperature range of -55 to 125 °C, it's ideal for chip carrier applications requiring high insulation resistance and dielectric voltage withstand capability up to 1400VAC.
0.6 in (15.24 mm)
110-87-632-41-001101
110-87-632-41-001101 by Preci-dip Sa is a DIP32 IC socket with 32 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and Polycyclohexydimethylene Terephthalate-Polyester housing. With a PCB contact row spacing of 15.24mm, it operates b/w -55°C to 125°C, making it ideal for various electronic applications requiring reliable connections.
32
e4
DIP32
110-87-964-41-001101
110-87-964-41-001101 by Preci-dip Sa is a DIP64 IC socket with 64 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and Tin termination. With a PCB contact row spacing of 22.86mm, it operates b/w -55°C to 125°C, making it ideal for chip carrier applications.
64
DIP64
150-10-308-00-001101
150-10-308-00-001101 by Preci-dip Sa is a DIP8 IC socket with POLYESTER housing and BRASS contacts plated with GOLD. It has 8 contacts for connecting components, ideal for chip carrier applications requiring reliable electrical connections.
Gold (10)
Brass
150-10-316-00-006101
150-10-316-00-006101 by Preci-dip Sa is a DIP16 IC socket with POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing and BRASS contacts plated with GOLD. It has 16 contacts for chip carrier ICs and components, suitable for various electronic applications requiring reliable connections.
150-10-324-00-018101
150-10-324-00-018101 by Preci-dip Sa is a DIP24 IC socket with 24 brass contacts and gold finish. Its housing material is POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. Ideal for chip carrier applications, this socket offers reliable connectivity and durability in electronic devices.
24
DIP24
150-10-640-00-018101
150-10-640-00-018101 by Preci-dip Sa is a DIP40 IC socket with POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing and BRASS contacts. It features 40 gold-plated contacts for superior connectivity. Ideal for chip carrier applications requiring reliable connections in electronic devices.
40
DIP40
150-80-316-00-006101
150-80-316-00-006101 by Preci-dip Sa is a DIP16 IC socket with POLYESTER housing and BRASS contacts. It features 16 contacts with TIN finish for mating and termination. Ideal for chip carrier applications requiring reliable connections in electronic devices.
TIN
150-80-316-00-018101
150-80-316-00-018101 by Preci-dip Sa is a DIP16 IC socket with housing made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. It features 16 brass contacts with Tin finish for mating and termination. Ideal for chip carrier IC applications requiring reliable connections in electronic devices.
150-80-324-00-018101
150-80-324-00-018101 by Preci-dip Sa is a DIP24 IC socket made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing material and BRASS contact material. It has 24 contacts with TIN mating finish and Tin (Sn) termination finish. This IC socket is commonly used for chip carrier applications.
540-88-032-17-400
540-88-032-17-400 by Preci-dip Sa is a PLCC32 IC socket with 32 contacts, bellowed type contact style, and surface mount termination. It has a min operating temperature of -55°C and max of 125°C. Ideal for chip carrier IC applications requiring a mating contact pitch of 0.05" and dielectric voltage withstand of 848VAC.
Phosphor Bronze
9 x 7
Bellowed Type
0.05 in (1.27 mm)
Glass-Filled Polyethylene / Glass-Filled Polyphenylene Sulfide (PE/PPS)
16.95 inch
3.8 in (96.52 mm)
848 VAC
PLCC32
540-88-044-17-400
540-88-044-17-400 by Preci-dip Sa is a PLCC44 IC socket with 44 contacts, rated for 1A current. It features bellowed type contact style, tin finish, and glass-filled polyethylene housing material. This chip carrier socket has a mating pitch of 0.05", operates b/w -55°C to 125°C, and offers high insulation resistance suitable for surface mount applications.
44
11 x 11
22.42 inch
4.6 in (116.84 mm)
PLCC44
150-10-640-00-106161
150-10-640-00-106161 by Preci-dip Sa is a DIP40 IC socket with 40 brass contacts, gold finish, and surface mount termination. It has a contact pitch of 0.1 inch and operates b/w -55°C to 125°C. Ideal for chip carrier ICs, this socket offers high insulation resistance and dielectric voltage withstand capabilities.
0.189 in (4.801 mm)
SD-103-G-22-N
Samtec
SD-103-G-22-N by Samtec is a Chip Carrier IC Socket with 6 contacts, rectangular contact pattern, and body dimensions of 0.3" length, 0.2" width, and 0.175" depth. It has a PCB contact row spacing of 2.54mm and operates b/w -65°C to 125°C, suitable for DIP6 devices with a current rating of 1A.
6
Gold on Nickel
Gold with Nickel Barrier
Rectangle
Glass-Filled Polyester
0.2 in (5.08 mm)
0.175 in (4.445 mm)
-65 °C (-85 °F)
DIP6
With Non-Flush
SD-110-G-22-N
SD-110-G-22-N by Samtec is a Chip Carrier IC Socket with 20 contacts, rated for 1A current. Featuring rectangular contact configuration and body dimensions of 1" length, 0.2" width, and 0.175" depth. It is used in DIP20 devices with a mating pitch of 0.1".
1 in (25.4 mm)
SS-104-G-2-N
SS-104-G-2-N by Samtec is a Chip Carrier IC Socket with 4 contacts, rated at 1A current. It features a rectangular PCB contact pattern, glass-filled polyester housing material, and gold finish with nickel barrier. Ideal for SIP4 devices, it operates b/w -65°C to 125°C and has a mating contact pitch of 0.1 inch.
4
SIP4
SS-104-G-22-N
SS-104-G-22-N by Samtec is a Chip Carrier IC Socket with 4 contacts, rated at 1A current. It features a rectangular PCB contact pattern, glass-filled polyester housing material, and gold finish with nickel barrier. This socket is used on SIP4 devices and operates b/w -65°C to 125°C, making it ideal for various electronic applications.
SS-104-T-2-N
SS-104-T-2-N by Samtec is a Chip Carrier IC Socket with 4 BE-CU contacts, rated for 1A current. It has a rectangular contact pattern, glass-filled polyester housing, and operates b/w -65°C to 125°C. Ideal for SIP4 devices, it features a mating pitch of 0.1", solder termination, and tin finish with nickel barrier.
Tin with Nickel Barrier
SS-104-TT-2-N
SS-104-TT-2-N by Samtec is a Chip Carrier IC Socket with 4 contacts, BE-CU contact material, and SN mating finish. It has a rectangular PCB contact pattern and glass-filled polyester housing. Ideal for SIP4 devices, it operates b/w -65°C to 125°C, making it suitable for various electronic applications.
SS-110-T-22-L
SS-110-T-22-L by Samtec is a Chip Carrier IC & Component Socket with 10 contacts, rated at 1A. It has a rectangular PCB contact pattern and uses BE-CU contact material. Ideal for SIP10 devices, it operates b/w -65°C to 125°C, making it suitable for various electronic applications.
0.145 in (3.683 mm)
SIP10
816-22-057-10-000101
Mill-max Mfg
IC SOCKET; Device Type Used On: SIP57; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 57; Contact Finish (Termination): GOLD OVER NICKEL;
57
Gold over Nickel
Plastic
SIP57
816-22-058-10-001101
IC SOCKET; Device Type Used On: SIP58; Housing Material: PLASTIC; JESD-609 Code: e4; Additional Features: STANDARD: UL 94V-0; Contact Finish (Termination): GOLD OVER NICKEL;
58
SIP58
818-22-012-10-001101
IC SOCKET; Device Type Used On: DIP12; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; No. of Contacts: 12; Contact Finish (Termination): GOLD OVER NICKEL;
12
DIP12
818-22-016-10-000101
IC SOCKET; Device Type Used On: DIP16; Housing Material: PLASTIC; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD OVER NICKEL;
818-22-024-10-002101
IC SOCKET; Device Type Used On: DIP24; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL;
818-22-058-10-001101
IC SOCKET; Device Type Used On: DIP58; Housing Material: PLASTIC; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Additional Features: STANDARD: UL 94V-0;
DIP58
818-22-062-10-000101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 62; Contact Finish (Mating): NOT SPECIFIED;
62
DIP62
818-22-062-10-002101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; Contact Finish (Termination): GOLD OVER NICKEL; No. of Contacts: 62; JESD-609 Code: e4;
818-22-062-10-003101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; Contact Finish (Termination): GOLD OVER NICKEL; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
818-22-062-10-004101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL;
818-22-062-10-005101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; JESD-609 Code: e4; No. of Contacts: 62; Additional Features: STANDARD: UL 94V-0;
818-22-062-10-007101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; Additional Features: STANDARD: UL 94V-0; Contact Finish (Termination): GOLD OVER NICKEL;
818-22-062-10-008101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; JESD-609 Code: e4; No. of Contacts: 62; Contact Finish (Mating): NOT SPECIFIED;
818-22-062-10-009101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; No. of Contacts: 62; Additional Features: STANDARD: UL 94V-0; Contact Finish (Mating): NOT SPECIFIED;
2271390
Phoenix Contact
RELAY SOCKET; Device Type Used On: SIP8; Housing Material: POLYAMIDE; Contact Material: NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED;
Nylon (PA)
SIP8
264-5205-01
3m Electronic Products Division
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
XR2A-3201-N
IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYBUTYLENE TEREPHTHALATE; JESD-609 Code: e4; No. of Contacts: 32; Contact Finish (Mating): NOT SPECIFIED;
DIP Socket, UL 94V-0
2-1571550-8
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: PCT-PLASTIC POLYESTER;
Polycyclohexylene Dimethylene Terephthalate (PCT)
1.2 in (30.48 mm)
0.18 in (4.572 mm)
2271015
RELAY SOCKET; Device Type Used On: SIP1; Housing Material: POLYAMIDE; No. of Contacts: 1; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
1
SIP1
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