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Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.

Flash Memory

Available Parts 2,400+

Part RoHS Manufacturer Description Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling
EPCS4SI8N by Intel

EPCS4SI8N

Intel

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;

CONFIGURATION MEMORY

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

524288 words

3.3

3.3

8

SMALL OUTLINE

Flash Memories

85 Cel

3-STATE

512KX8

512K

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

3

3.6 V

100000 Write/Erase Cycles

40 MHz

Not Qualified

4194304 bit

2.7 V

e4

20

260

.00005 Amp

S25FL128SAGNFI001 by Infineon Technologies

S25FL128SAGNFI001

Infineon Technologies

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Current: 100 mA;

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

2

Flash Memories

20

1.27 mm

85 Cel

32MX4

32M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3

3.6 V

.8 mm

100000 Write/Erase Cycles

133 MHz

6 mm

Not Qualified

500 ms

SPI

BOTTOM

134217728 bit

2.7 V

IT ALSO CONFIGURED AS 256M X 1

e3

30

260

NOR TYPE

.0001 Amp

8 mm

3

XCF04SVOG20C by Xilinx

XCF04SVOG20C

Xilinx

CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Width: 4.4 mm; Peak Reflow Temperature (C): 260;

CONFIGURATION MEMORY

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

10 mA

4194304 words

3.3

1.8/3.3,3.3

1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

Flash Memories

20

.65 mm

85 Cel

4MX1

4M

-40 Cel

Matte Tin (Sn)

DUAL

HARDWARE

R-PDSO-G20

3

3.6 V

1.19 mm

20000 Write/Erase Cycles

33 MHz

4.4 mm

Not Qualified

4194304 bit

3 V

e3

30

260

NOR TYPE

.01 Amp

6.5024 mm

3.3

S29AL016J70TFI020 by Infineon Technologies

S29AL016J70TFI020

Infineon Technologies

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words: 1048576 words;

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

1048576 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e3

260

NOR TYPE

.000005 Amp

18.4 mm

YES

70 ns

3

YES

W25Q64JVSSIQ by Winbond Electronics

W25Q64JVSSIQ

Winbond Electronics

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

18 mA

8388608 words

3.3

8

SMALL OUTLINE

SOP8,.3

1

20

1.27 mm

85 Cel

8MX8

8M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

3

3.6 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.28 mm

SPI

67108864 bit

3 V

2.7V TO 3V @ 104MHZ

e3

30

260

NOR TYPE

.00005 Amp

5.28 mm

3.3

S29AL016J70TFI010 by Infineon Technologies

S29AL016J70TFI010

Infineon Technologies

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Type: NOR TYPE;

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

1048576 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

12 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e3

260

NOR TYPE

.000005 Amp

18.4 mm

YES

70 ns

3

YES

AT45DB321E-SHF-T by Renesas Electronics

AT45DB321E-SHF-T

Renesas Electronics

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 5.24 mm;

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

33554432 words

3

1

SMALL OUTLINE

1.27 mm

85 Cel

32MX1

32M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

3.6 V

2.16 mm

85 MHz

5.24 mm

33554432 bit

2.3 V

e4

260

5.29 mm

3

S25FL256SAGNFI001 by Infineon Technologies

S25FL256SAGNFI001

Infineon Technologies

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp;

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

100 mA

67108864 words

3

3/3.3

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

2

Flash Memories

20

1.27 mm

85 Cel

64MX4

64M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3

3.6 V

.8 mm

100000 Write/Erase Cycles

133 MHz

6 mm

Not Qualified

500 ms

SPI

268435456 bit

2.7 V

IT ALSO CONFIGURED AS 256M X 1

e3

30

260

NOR TYPE

.0001 Amp

8 mm

3

S25FL128SAGMFI001 by Infineon Technologies

S25FL128SAGMFI001

Infineon Technologies

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

4

SMALL OUTLINE

SOP16,.41

2

Flash Memories

20

1.27 mm

85 Cel

3-STATE

32MX4

32M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3

3.6 V

2.65 mm

100000 Write/Erase Cycles

133 MHz

7.5 mm

Not Qualified

500 ms

SPI

134217728 bit

2.7 V

IT ALSO CONFIGURED AS 256M X 1

e3

30

260

NOR TYPE

.0001 Amp

10.3 mm

3

AT25DF321A-SH-T by Renesas Electronics

AT25DF321A-SH-T

Renesas Electronics

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

4194304 words

3

3/3.3

8

SMALL OUTLINE

SOP8,.3

Flash Memories

20

1.27 mm

85 Cel

4MX8

4M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

2.16 mm

100000 Write/Erase Cycles

85 MHz

5.24 mm

Not Qualified

SPI

33554432 bit

2.7 V

e4

260

NOR TYPE

.00001 Amp

5.29 mm

2.7

S25FL128SAGMFIR01 by Infineon Technologies

S25FL128SAGMFIR01

Infineon Technologies

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 20;

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

100 mA

33554432 words