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EEPROM

EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.

EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.

One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.

EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.

One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.

EEPROM

Available Parts 2,400+

Part RoHS Manufacturer Description Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling
DS24B33S+T&R by Analog Devices

DS24B33S+T&R

Analog Devices

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

ASYNCHRONOUS

4096 words

3/5

1

SMALL OUTLINE

SOP8,.3

EEPROMs

1.27 mm

85 Cel

4KX1

4K

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G8

1

5.25 V

2.13 mm

50000 Write/Erase Cycles

5.285 mm

Not Qualified

1-WIRE

4096 bit

2.8 V

e3

30

260

5.31 mm

DS24B33S+ by Analog Devices

DS24B33S+

Analog Devices

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

ASYNCHRONOUS

4096 words

3/5

1

SMALL OUTLINE

SOP8,.3

EEPROMs

1.27 mm

85 Cel

4KX1

4K

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G8

1

5.25 V

2.13 mm

50000 Write/Erase Cycles

5.285 mm

Not Qualified

1-WIRE

4096 bit

2.8 V

e3

30

260

5.31 mm

24AA02E48T-I/OT by Microchip Technology

24AA02E48T-I/OT

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

EEPROM

INDUSTRIAL

5

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

3 mA

256 words

5

1.8/5

8

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP5/6,.11,37

EEPROMs

200

.95 mm

85 Cel

OPEN-DRAIN

256X8

256

-40 Cel

MATTE TIN

1010XXXR

DUAL

1

HARDWARE

R-PDSO-G5

1

5.5 V

1.45 mm

1000000 Write/Erase Cycles

.4 MHz

1.55 mm

Not Qualified

5 ms

I2C

2048 bit

2.5 V

ALSO OPERATES AT 1.7V TO 2.5V @0.1MHZ

e3

40

260

.000001 Amp

2.9 mm

5

XCF01SVOG20C by Xilinx

XCF01SVOG20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;

CONFIGURATION MEMORY

INDUSTRIAL

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

10 mA

1048576 words

3.3

1.8/3.3,3.3

1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

Flash Memories

20

.65 mm

85 Cel

1MX1

1M

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G20

3

3.6 V

1.19 mm

20000 Write/Erase Cycles

4.4 mm

Not Qualified

1048576 bit

3 V

IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL

e3

30

260

NOR TYPE

.001 Amp

6.5024 mm

24LC64-I/SN by Microchip Technology

24LC64-I/SN

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

8192 words

4.5

3/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

85 Cel

OPEN-DRAIN

8KX8

8K

-40 Cel

Matte Tin (Sn)

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

65536 bit

2.5 V

DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED

e3

30

260

.000001 Amp

4.9 mm

4.5

24LC256-I/SM by Microchip Technology

24LC256-I/SM

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 4.5;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

32768 words

4.5

3/5

8

SMALL OUTLINE

SOP8,.3

EEPROMs

200

1.27 mm

85 Cel

NO

OPEN-DRAIN

32KX8

32K

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

2.03 mm

1000000 Write/Erase Cycles

.4 MHz

5.25 mm

Not Qualified

5 ms

I2C

262144 bit

2.5 V

e3

40

260

.0000015 Amp

5.26 mm

4.5

24LC256-I/SN by Microchip Technology

24LC256-I/SN

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

32768 words

4.5

3/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

85 Cel

NO

OPEN-DRAIN

32KX8

32K

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

262144 bit

2.5 V

e3

30

260

.000005 Amp

4.9 mm

4.5

DS2431P/TR by Dallas Semiconductor

DS2431P/TR

Dallas Semiconductor

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Surface Mount: YES;

EEPROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

1024 words

3.3

3/5

1

SMALL OUTLINE

SOC6,.17

EEPROMs

40

1.27 mm

85 Cel

NO

OPEN-DRAIN

1KX1

1K

-40 Cel

NO

Matte Tin (Sn)

DUAL

HARDWARE

R-PDSO-C6

1

5.25 V

1.5 mm

50000 Write/Erase Cycles

3.76 mm

Not Qualified

1-WIRE

1024 bit

2.8 V

MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS

e3

30

260

3.94 mm

NO

DS2431P/T&R by Maxim Integrated

DS2431P/T&R

Maxim Integrated

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;

EEPROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

1024 words

3.3

3/5

1

SMALL OUTLINE

SOC6,.17

EEPROMs

10

1.27 mm

85 Cel

1KX1

1K

-40 Cel

TIN LEAD

DUAL

R-PDSO-C6

1

5.25 V

1.5 mm

50000 Write/Erase Cycles

3.76 mm

Not Qualified

1-WIRE

1024 bit

2.8 V

MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS

e0

20

240

3.94 mm

DS2431P+T&R by Analog Devices

DS2431P+T&R

Analog Devices

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Power Supplies (V): 3/5;

EEPROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

1024 words

3.3

3/5

1

SMALL OUTLINE

SOC6,.17

EEPROMs

40

1.27 mm

85 Cel

NO

OPEN-DRAIN

1KX1

1K

-40 Cel

NO

Matte Tin (Sn) - annealed

DUAL

HARDWARE

R-PDSO-C6

1

5.25 V

1.5 mm

50000 Write/Erase Cycles

3.76 mm

Not Qualified

1-WIRE

1024 bit

2.8 V

MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS

e3

30

260

3.94 mm

NO

24LC16BT-I/OT by Microchip Technology

24LC16BT-I/OT

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

EEPROM

INDUSTRIAL

5

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

2048 words

5

2/5

8

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP5/6,.11,37

EEPROMs

200

.95 mm

85 Cel

2KX8

2K

-40 Cel

MATTE TIN

1010MMMR

DUAL

1

HARDWARE

R-PDSO-G5

1

5.5 V

1.45 mm

1000000 Write/Erase Cycles

.4 MHz

1.63 mm

Not Qualified

5 ms

I2C

16384 bit

2.5 V

e3

260

.000001 Amp

2.95 mm

5

24AA025E48T-I/OT by Microchip Technology

24AA025E48T-I/OT

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e3;

EEPROM

INDUSTRIAL

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

3 mA

256 words

5

1.8/5

8

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

EEPROMs

200

.95 mm

85 Cel

OPEN-DRAIN

256X8

256

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

R-PDSO-G6

1

5.5 V

1.45 mm

1000000 Write/Erase Cycles

.4 MHz

1.55 mm

Not Qualified

5 ms

I2C

2048 bit

2.5 V

1.7V TO 2.5V @ 0.1MHz

e3

260

.000001 Amp

2.9 mm

5

25LC256-I/SN by Microchip Technology

25LC256-I/SN

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

6 mA

32768 words

5

2/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

85 Cel

NO

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

10 MHz

3.9 mm

Not Qualified

5 ms

SPI

262144 bit

2.5 V

e3

30

260

.000001 Amp

4.9 mm

2.5

AT25256B-SSHL-B by Microchip Technology

AT25256B-SSHL-B

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

10 mA

32768 words

5

2/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

100

1.27 mm

85 Cel

3-STATE

32KX8

32K

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

20 MHz

3.9 mm

Not Qualified

5 ms

SPI

262144 bit

4.5 V

ALSO OPERATES AT 2.5V TO 5.5V @10MHZ AND 1.8V TO 5.5V @5MHZ

e4

.000005 Amp

4.9 mm

5

XCF32PVOG48C by Xilinx

XCF32PVOG48C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words Code: 32M;

CONFIGURATION MEMORY

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

40 mA

33554432 words

1.8

1.5/3.3,1.8

1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

20

.5 mm

85 Cel

32MX1

32M

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G48

3

2 V

1.2 mm

20000 Write/Erase Cycles

12 mm

Not Qualified

33554432 bit

1.65 V

IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL

e3

30

260

NOR TYPE

.001 Amp

18.45 mm

DS2431P-A1+T by Analog Devices

DS2431P-A1+T

Analog Devices

EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Endurance: 50000 Write/Erase Cycles;

EEPROM

AUTOMOTIVE

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

1024 words

5

5

1

SMALL OUTLINE

SOC6,.17

EEPROMs

10

1.27 mm

125 Cel

1KX1

1K

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-C6

1

5.25 V

1.5 mm

50000 Write/Erase Cycles

3.76 mm

Not Qualified

1-WIRE

1024 bit

4.5 V

e3

30

260

3.94 mm

25LC256T-I/SN by Microchip Technology

25LC256T-I/SN

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Current: 6 mA;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

6 mA

32768 words

4.5

2/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

85 Cel

NO

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

10 MHz

3.9 mm

Not Qualified

5 ms

SPI

262144 bit

2.5 V

e3

30

260

.000001 Amp

4.9 mm

2.5

CAT24C256WI-GT3 by Onsemi

CAT24C256WI-GT3

Onsemi

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

32768 words

5

2/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

100

1.27 mm

85 Cel

32KX8

32K

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

262144 bit

1.8 V

100 YEAR DATA RETENTION

e4

40

260

.000001 Amp

4.9 mm

XCF02SVOG20C by Xilinx

XCF02SVOG20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e3;

CONFIGURATION MEMORY

INDUSTRIAL

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

10 mA

2097152 words

3.3

1.8/3.3,3.3

1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

Flash Memories

20

.65 mm

85 Cel

2MX1

2M

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G20

3

3.6 V

1.19 mm

20000 Write/Erase Cycles

4.4 mm

Not Qualified

2097152 bit

3 V

IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL

e3

30

260

NOR TYPE

.001 Amp

6.5024 mm

CAT24M01WI-GT3 by Onsemi

CAT24M01WI-GT3

Onsemi

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

131072 words

3.3

3/5

8

SMALL OUTLINE

SOP8,.25

1

EEPROMs

100

1.27 mm

85 Cel

128KX8

128K

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

1010DDMR

DUAL

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

1 MHz

3.9 mm

Not Qualified

5 ms

SPI

1048576 bit

1.8 V

IT ALSO OPERATES AT 0.4MHZ

e4

40

260

.000002 Amp

4.9 mm

DS2431P-A1+ by Analog Devices

DS2431P-A1+

Analog Devices

EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; No. of Functions: 1;

EEPROM

AUTOMOTIVE

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

1024 words

5

5

1

SMALL OUTLINE

SOC6,.17

EEPROMs

10

1.27 mm

125 Cel

1KX1

1K

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-C6

1

5.25 V

1.5 mm

50000 Write/Erase Cycles

3.76 mm

Not Qualified

1-WIRE

1024 bit

4.5 V

e3

30

260

3.94 mm

DS2431P by Maxim Integrated

DS2431P

Maxim Integrated

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Serial Bus Type: 1-WIRE;

EEPROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

1024 words

3.3

3/5

1

SMALL OUTLINE

SOC6,.17

EEPROMs

10

1.27 mm

85 Cel

1KX1

1K

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-C6

1

5.25 V

1.5 mm

50000 Write/Erase Cycles

3.76 mm

Not Qualified

1-WIRE

1024 bit

2.8 V

MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS

e0

20

240

3.94 mm

DS2431P+ by Analog Devices

DS2431P+

Analog Devices

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

EEPROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

1024 words

3.3

3/5

1

SMALL OUTLINE

SOC6,.17

EEPROMs

40

1.27 mm

85 Cel

NO

OPEN-DRAIN

1KX1

1K

-40 Cel

NO

Matte Tin (Sn) - annealed

DUAL

HARDWARE

R-PDSO-C6

1

5.25 V

1.5 mm

50000 Write/Erase Cycles

3.76 mm

Not Qualified

1-WIRE

1024 bit

2.8 V

MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS

e3

30

260

3.94 mm

NO

AT25256B-SSHL-T by Microchip Technology

AT25256B-SSHL-T

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

10 mA

32768 words

5

2/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

100

1.27 mm

85 Cel

3-STATE

32KX8

32K

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

3

5.5 V

1.75 mm

1000000 Write/Erase Cycles

20 MHz

3.9 mm

Not Qualified

5 ms

SPI

262144 bit

4.5 V

ALSO OPERATES AT 2.5V TO 5.5V @10MHZ AND 1.8V TO 5.5V @5MHZ

e4

40

260

.000005 Amp

4.925 mm

5

DS24B33Q+T&R by Analog Devices

DS24B33Q+T&R

Analog Devices

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: HVSON; Package Shape: SQUARE; Length: 3 mm;

EEPROM

INDUSTRIAL

6

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

4096 words

4.5

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.95 mm

85 Cel

4KX1

4K

-40 Cel

DUAL

S-PDSO-N6

5.25 V

.8 mm

3 mm

1-WIRE

4096 bit

2.8 V

NOT SPECIFIED

NOT SPECIFIED

3 mm

93LC56BT-I/OT by Microchip Technology

93LC56BT-I/OT

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, SHRINK PITCH;

EEPROM

INDUSTRIAL

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

2 mA

128 words

3

YES

16

SMALL OUTLINE, SHRINK PITCH

TSOP6,.11,37

200

.95 mm

85 Cel

NO

TOTEM POLE

128X16

128

-40 Cel

MATTE TIN

YES

DUAL

1

SOFTWARE

R-PDSO-G6

1

5.5 V

1.45 mm

1000000 Write/Erase Cycles

2 MHz

1.55 mm

Not Qualified

6 ms

MICROWIRE

2048 bit

2.5 V

e3

260

.000001 Amp

2.9 mm

24LC16B-I/SN by Microchip Technology

24LC16B-I/SN

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

2048 words

5

8

SMALL OUTLINE

SOP8,.23

200

1.27 mm

85 Cel

2KX8

2K

-40 Cel

MATTE TIN

1010MMMR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

16384 bit

2.5 V

e3

30

260

.000001 Amp

4.9 mm

5

M24M02-DRMN6TP by STMicroelectronics

M24M02-DRMN6TP

STMicroelectronics

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 40;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

262144 words

2.5

2/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

40

1.27 mm

85 Cel

256KX8

256K

-40 Cel

NICKEL PALLADIUM GOLD

1010DMMR

DUAL

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

1 MHz

3.9 mm

Not Qualified

10 ms

I2C

2097152 bit

1.8 V

e4

30

260

.000002 Amp

4.9 mm

XCF04SVO20C by Xilinx

XCF04SVO20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;

CONFIGURATION MEMORY

INDUSTRIAL

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

10 mA

4194304 words

3.3

1.8/3.3,3.3

1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

Flash Memories

.65 mm

85 Cel

4MX1

4M

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

3

3.6 V

1.19 mm

33 MHz

4.4 mm

Not Qualified

4194304 bit

3 V

IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL

e0

30

240

NOR TYPE

.001 Amp

6.5024 mm

DS2430AP/T&R by Maxim Integrated

DS2430AP/T&R

Maxim Integrated

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Technology: MOS;

EEPROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

MOS

C BEND

SERIAL

ASYNCHRONOUS

256 words

5

3/5

1

SMALL OUTLINE

SOC6,.17

EEPROMs

1.27 mm

85 Cel

256X1

256

-40 Cel

TIN LEAD

DUAL

R-PDSO-C6

1

6 V

1.5 mm

100000 Write/Erase Cycles

.0163 MHz

3.76 mm

Not Qualified

10 ms

1-WIRE

256 bit

2.8 V

MICROLAN COMPATIBLE

e0

3.94 mm

DS2430AP+T&R by Analog Devices

DS2430AP+T&R

Analog Devices

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;

EEPROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

MOS

C BEND

SERIAL

ASYNCHRONOUS

256 words

5

3/5

1

SMALL OUTLINE

SOC6,.17

EEPROMs

1.27 mm

85 Cel

256X1

256

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-C6

1

6 V

1.5 mm

100000 Write/Erase Cycles

.0163 MHz

3.76 mm

Not Qualified

10 ms

1-WIRE

256 bit

2.8 V

MICROLAN COMPATIBLE

e3

30

260

3.94 mm

24AA025E48-I/SN by Microchip Technology

24AA025E48-I/SN

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

3 mA

256 words

5

1.8/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

85 Cel

OPEN-DRAIN

256X8

256

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

2048 bit

2.5 V

ALSO OPERATES AT 1.7V TO 2.5V @0.1MHZ

e3

30

260

.000001 Amp

4.9 mm

5

DS28EC20P+T by Analog Devices

DS28EC20P+T

Analog Devices

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Organization: 20KX1;

EEPROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

.9 mA

20480 words

5

1

SMALL OUTLINE

SOC6,.17

EEPROMs

40

1.27 mm

85 Cel

20KX1

2K

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-C6

1

5.25 V

1.5 mm

200000 Write/Erase Cycles

3.76 mm

Not Qualified

1-WIRE

20480 bit

4 V

e3

30

260

3.94 mm

25LC1024-I/SM by Microchip Technology

25LC1024-I/SM

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Screening Level: AEC-Q100;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

10 mA

131072 words

5

3/5

8

SMALL OUTLINE

SOP8,.3

Flash Memories

200

1.27 mm

85 Cel

128KX8

128K

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

1

5.5 V

2.03 mm

1000000 Write/Erase Cycles

20 MHz

5.25 mm

Not Qualified

6 ms

SPI

1048576 bit

4.5 V

200 YEARS OF DATA RETENTION; 1000000 ENDURANCE CYCLES/WORD

e3

40

260

NOR TYPE

.000012 Amp

5.26 mm

5

DS24B33+T&R by Analog Devices

DS24B33+T&R

Analog Devices

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; No. of Words: 4096 words;

EEPROM

INDUSTRIAL

3

TO-92

ROUND

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

ASYNCHRONOUS

4096 words

3/5

1

CYLINDRICAL

SIP3,.1,50

EEPROMs

1.27 mm

85 Cel

4KX1

4K

-40 Cel

Matte Tin (Sn) - annealed

BOTTOM

O-PBCY-T3

5.25 V

50000 Write/Erase Cycles

Not Qualified

1-WIRE

4096 bit

2.8 V

e3

20

250

24LC256T-I/SN by Microchip Technology

24LC256T-I/SN

Microchip Technology

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 4.9 mm;

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

32768 words

4.5

3/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

85 Cel

NO

OPEN-DRAIN

32KX8

32K

-40 Cel

MATTE TIN

1010DDDR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

262144 bit

2.5 V

e3

30

260

.000005 Amp

4.9 mm

4.5