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Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.

Serial Communication Controllers

Available Parts 2,400+

Part RoHS Manufacturer Description Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Maximum Data Transfer Rate Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Additional Features Boundary Scan Peripherals External Data Bus Width Data Encoding or Decoding Method Communication Protocol Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) No. of Timers RAM Bytes Technology Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Drive Interface Standard Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines
FT4232HL-REEL by FTDI

FT4232HL-REEL

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1.98 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.62 V

85 Cel

1.5 MBps

-40 Cel

QUAD

1.6 mm

10 mm

YES

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

10 mm

CMOS

1.8 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-PQFP-G64

3

Not Qualified

YES

8

MCP2518FDT-E/SL by Microchip Technology

MCP2518FDT-E/SL

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, CAN

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

SOP14,.24

2.7 V

125 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

1.75 mm

3.9 mm

NO

SYNC; BIT ;BYTE

40 MHz

30

260

8.65 mm

CMOS

20 mA

3.3 V

1

SPI

1.27 mm

R-PDSO-G14

YES

e3

MCP2515-I/ST by Microchip Technology

MCP2515-I/ST

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, CAN

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

0

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

4.5 V

85 Cel

.125 MBps

-40 Cel

Matte Tin (Sn)

DUAL

1.2 mm

14

4.4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

40

260

6.5 mm

CMOS

10 mA

5 V

1

SPI

.65 mm

R-PDSO-G20

1

YES

e3

0

LAN9500AI-ABZJ by Microchip Technology

LAN9500AI-ABZJ

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Bus Compatibility: PCI; USB;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

32

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

3 V

85 Cel

60 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

7168

8 mm

YES

0

NRZI

25 MHz

8 mm

CMOS

3.3 V

4

PCI; USB

.5 mm

S-XQCC-N56

YES

11

MCP2515-I/SO by Microchip Technology

MCP2515-I/SO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, CAN

INDUSTRIAL

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

0

SMALL OUTLINE

SOP18,.4

4.5 V

85 Cel

.125 MBps

-40 Cel

Matte Tin (Sn) - annealed

DUAL

2.65 mm

14

7.5 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

40

260

11.55 mm

CMOS

10 mA

5 V

1

SPI

1.27 mm

R-PDSO-G18

1

YES

e3

0

LAN9500AI-ABZJ-TR by Microchip Technology

LAN9500AI-ABZJ-TR

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC56,.31SQ,20;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

32

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

3 V

85 Cel

60 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

7168

8 mm

YES

0

NRZI

25 MHz

8 mm

CMOS

3.3 V

4

PCI; USB

.5 mm

S-XQCC-N56

YES

11

MCP2518FDT-E/QBB by Microchip Technology

MCP2518FDT-E/QBB

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVQCCN; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, CAN

AUTOMOTIVE

NO LEAD

14

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC14,.12,25

2.7 V

125 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

.9 mm

3 mm

NO

SYNC; BIT ;BYTE

40 MHz

30

260

4.5 mm

CMOS

20 mA

3.3 V

1

SPI

.65 mm

R-PDSO-N14

YES

e3

MCP2515T-I/ST by Microchip Technology

MCP2515T-I/ST

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, CAN

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

0

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

4.5 V

85 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

1.2 mm

14

4.4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

260

6.5 mm

CMOS

10 mA

5 V

1

SPI

.65 mm

R-PDSO-G20

1

YES

e3

0

MCP2518FDT-H/QBB by Microchip Technology

MCP2518FDT-H/QBB

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVQCCN; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, CAN

AUTOMOTIVE

NO LEAD

14

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC14,.12,25

2.7 V

150 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

.9 mm

3 mm

NO

SYNC; BIT ;BYTE

40 MHz

30

260

4.5 mm

CMOS

20 mA

3.3 V

1

SPI

.65 mm

R-PDSO-N14

YES

e3

FT4232HL-TRAY by FTDI

FT4232HL-TRAY

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1.98 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.62 V

85 Cel

1.5 MBps

-40 Cel

QUAD

1.6 mm

10 mm

YES

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

10 mm

CMOS

1.8 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-PQFP-G64

3

Not Qualified

YES

8

MCP2515-E/SO by Microchip Technology

MCP2515-E/SO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, CAN

AUTOMOTIVE

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

0

SMALL OUTLINE

SOP18,.4

4.5 V

125 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

2.65 mm

14

7.5 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

11.55 mm

CMOS

10 mA

5 V

1

SPI

1.27 mm

R-PDSO-G18

1

YES

e3

0

MCP2518FDT-E/QBBVAO by Microchip Technology

MCP2518FDT-E/QBBVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVSON; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100; TS 16949

0

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC14,.18X.12,30

2.7 V

125 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

.9 mm

3 mm

NO

0

SYNC; BIT ;BYTE

40 MHz

30

260

4.5 mm

CMOS

20 mA

3.3 V

1

SPI

.65 mm

R-PDSO-N14

YES

e3

MCP2518FDT-H/SL by Microchip Technology

MCP2518FDT-H/SL

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, CAN

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

SOP14,.24

2.7 V

150 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

1.75 mm

3.9 mm

NO

SYNC; BIT ;BYTE

40 MHz

30

260

8.65 mm

CMOS

20 mA

3.3 V

1

SPI

1.27 mm

R-PDSO-G14

YES

e3

FT4232HQ-REEL by FTDI

FT4232HQ-REEL

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HQCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

64

HQCCN

SQUARE

UNSPECIFIED

YES

1.98 V

CHIP CARRIER, HEAT SINK/SLUG

LCC64,.35SQ,20

1.62 V

85 Cel

1.5 MBps

-40 Cel

QUAD

1 mm

9 mm

YES

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

9 mm

CMOS

1.8 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-XQCC-N64

3

Not Qualified

YES

8

MCP2518FDT-E/SLVAO by Microchip Technology

MCP2518FDT-E/SLVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100; TS 16949

0

SMALL OUTLINE

SOP14,.24

2.7 V

125 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

1.75 mm

3.9 mm

NO

0

SYNC; BIT ;BYTE

40 MHz

30

260

8.65 mm

CMOS

20 mA

3.3 V

1

SPI

1.27 mm

R-PDSO-G14

YES

e3

MCP2515-E/ST by Microchip Technology

MCP2515-E/ST

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

4.5 V

125 Cel

.125 MBps

-40 Cel

Matte Tin (Sn)

DUAL

1.2 mm

4.4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

40

260

6.5 mm

CMOS

5 V

1

CAN, SPI

.65 mm

R-PDSO-G20

1

Not Qualified

YES

e3

LAN9514-JZX by Microchip Technology

LAN9514-JZX

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

0

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

70 Cel

60 MBps

0 Cel

MATTE TIN

QUAD

1 mm

9 mm

YES

0

SYNC; BIT ;BYTE

25 MHz

40

260

9 mm

CMOS

1.8 V

1

Serial IO/Communication Controllers

USB

.5 mm

S-PQCC-N64

1

Not Qualified

YES

e3

8

FT4232HL by FTDI

FT4232HL

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1.98 V

0

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.62 V

85 Cel

1.5 MBps

-40 Cel

QUAD

1.6 mm

10 mm

YES

0

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

10 mm

CMOS

1.8 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-PQFP-G64

3

YES

8

MCP2515T-I/ML by Microchip Technology

MCP2515T-I/ML

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, CAN

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

8

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

4.5 V

85 Cel

.125 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

14

4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

260

4 mm

CMOS

10 mA

5 V

1

SPI

.5 mm

S-PQCC-N20

1

YES

e3

0

MCP2518FDT-H/SLVAO by Microchip Technology

MCP2518FDT-H/SLVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100; TS 16949

SMALL OUTLINE

SOP14,.24

2.7 V

150 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

1.75 mm

3.9 mm

NO

SYNC; BIT ;BYTE

40 MHz

30

260

8.65 mm

CMOS

20 mA

3.3 V

1

SPI

1.27 mm

R-PDSO-G14

YES

e3

MCP2515-I/P by Microchip Technology

MCP2515-I/P

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, CAN

INDUSTRIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

8

0

IN-LINE

DIP18,.3

4.5 V

85 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

5.334 mm

14

7.62 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

22.86 mm

CMOS

10 mA

5 V

1

SPI

2.54 mm

R-PDIP-T18

YES

e3

0

LAN9514I-JZX by Microchip Technology

LAN9514I-JZX

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

0

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

85 Cel

60 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

9 mm

YES

0

SYNC; BIT ;BYTE

25 MHz

40

260

9 mm

CMOS

1.8 V

1

Serial IO/Communication Controllers

USB

.5 mm

S-PQCC-N64

1

Not Qualified

YES

e3

8

MCP2518FDT-H/QBBVAO by Microchip Technology

MCP2518FDT-H/QBBVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVSON; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, CAN

AUTOMOTIVE

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100; TS 16949

0

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC14,.18X.12,30

2.7 V

150 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

.9 mm

3 mm

NO

0

SYNC; BIT ;BYTE

40 MHz

30

260

4.5 mm

CMOS

20 mA

3.3 V

1

SPI

.65 mm

R-PDSO-N14

YES

e3

FT4232H-56Q-REEL by FTDI

FT4232H-56Q-REEL

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HQCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

56

HQCCN

SQUARE

UNSPECIFIED

YES

1.98 V

CHIP CARRIER, HEAT SINK/SLUG

LCC56,.31SQ,20

1.62 V

85 Cel

1.5 MBps

-40 Cel

QUAD

1 mm

8 mm

YES

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

8 mm

CMOS

1.8 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-XQCC-N56

3

YES

8

LAN9512I-JZX by Microchip Technology

LAN9512I-JZX

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

85 Cel

60 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

9 mm

YES

0

SYNC; BIT ;BYTE

25 MHz

9 mm

CMOS

1.8 V

1

USB

.5 mm

S-PQCC-N64

3

Not Qualified

YES

e3

8

MCP2515-I/ML by Microchip Technology

MCP2515-I/ML

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, CAN

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

8

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

4.5 V

85 Cel

.125 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

14

4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

40

260

4 mm

CMOS

10 mA

5 V

1

SPI

.5 mm

S-PQCC-N20

1

YES

e3

0

SJA1000T/N1,118 by NXP Semiconductors

SJA1000T/N1,118

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

AUTOMOTIVE

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

SMALL OUTLINE

4.5 V

125 Cel

.125 MBps

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.65 mm

7.5 mm

NO

8

NRZ

24 MHz

30

260

17.9 mm

CMOS

5 V

2

1.27 mm

R-PDSO-G28

1

Not Qualified

YES

e4

FT4232HQ-TRAY by FTDI

FT4232HQ-TRAY

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HQCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

64

HQCCN

SQUARE

UNSPECIFIED

YES

1.98 V

CHIP CARRIER, HEAT SINK/SLUG

LCC64,.35SQ,20

1.62 V

85 Cel

1.5 MBps

-40 Cel

QUAD

1 mm

9 mm

YES

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

9 mm

CMOS

1.8 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-XQCC-N64

3

Not Qualified

YES

8

LAN7500I-ABZJ by Microchip Technology

LAN7500I-ABZJ

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.26 V

TS 16949

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

1.14 V

85 Cel

125 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

8 mm

YES

0

SYNC; BIT ;BYTE

25 MHz

260

8 mm

CMOS

1.2 V

4

USB

.5 mm

S-PQCC-N56

3

YES

e3

FT4232H-56Q-TRAY by FTDI

FT4232H-56Q-TRAY

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HQCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

NO LEAD

56

HQCCN

SQUARE

UNSPECIFIED

YES

1.98 V

CHIP CARRIER, HEAT SINK/SLUG

LCC56,.31SQ,20

1.62 V

85 Cel

1.5 MBps

-40 Cel

QUAD

1 mm

8 mm

YES

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

8 mm

CMOS

1.8 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-XQCC-N56

3

YES

8

WGI210ITSLJXT by Intel

WGI210ITSLJXT

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: QCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

NO LEAD

64

QCCN

SQUARE

UNSPECIFIED

YES

0.9

CHIP CARRIER

LCC64,.35SQ,20

85 Cel

-40 Cel

QUAD

I2C

CMOS

.9 V

Serial IO/Communication Controllers

PCI

.5 mm

S-PQCC-N64

Not Qualified

YES

LAN91C111I-NU by Microchip Technology

LAN91C111I-NU

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: TFQFP; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

GULL WING

128

TFQFP

SQUARE

PLASTIC/EPOXY

YES

3.63 V

TS 16949

16

FLATPACK, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

2.97 V

85 Cel

12.5 MBps

-40 Cel

MATTE TIN

QUAD

1.2 mm

14 mm

NO

32

NRZ; BIPH-LEVEL(MANCHESTER)

SYNC, BIT, BYTE, ETHERNET

25 MHz

260

14 mm

CMOS

140 mA

3.3 V

4

680X0; 683XX

.4 mm

S-PQFP-G128

3

Not Qualified

YES

e3

MCP25625-E/SS by Microchip Technology

MCP25625-E/SS

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

0

SMALL OUTLINE, SHRINK PITCH

2.7 V

125 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

2 mm

5.3 mm

NO

0

CAN

25 MHz

40

260

10.2 mm

CMOS

10 mA

4.5 V

1

SPI

.65 mm

R-PDSO-G28

2

YES

MC68360AI25L by NXP Semiconductors

MC68360AI25L

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 240; Package Code: QFP; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

240

QFP

SQUARE

PLASTIC/EPOXY

YES

32

FLATPACK

85 Cel

1.25 MBps

-40 Cel

TIN

QUAD

YES

32

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC

25 MHz

40

260

CMOS

68000

S-PQFP-G240

3

YES

e3

ENC28J60-I/SS by Microchip Technology

ENC28J60-I/SS

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

8

TS 16949

3.3

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

3.1 V

85 Cel

1.25 MBps

-40 Cel

MATTE TIN

DUAL

2 mm

8192

5.3 mm

NO

SYNC; BIT ;BYTE

25 MHz

260

10.2 mm

CMOS

180 mA

3.3 V

1

Serial IO/Communication Controllers

SPI

.65 mm

R-PDSO-G28

1

Not Qualified

YES

e3

MCP25625-E/ML by Microchip Technology

MCP25625-E/ML

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: 1 mm;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

NO LEAD

28

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

TS 16949

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

125 Cel

.125 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

6 mm

NO

0

CAN

25 MHz

40

260

6 mm

CMOS

10 mA

4.5 V

1

SPI

.65 mm

S-PQCC-N28

1

YES

e3

ENC28J60-I/ML by Microchip Technology

ENC28J60-I/ML

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

NO LEAD

28

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

8

TS 16949

0

3.3

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

LCC28,.24SQ,25

3.1 V

85 Cel

1.25 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

8192

6 mm

NO

0

SYNC; BIT ;BYTE

25 MHz

40

260

6 mm

CMOS

180 mA

3.3 V

1

Serial IO/Communication Controllers

SPI

.65 mm

S-PQCC-N28

1

Not Qualified

YES

e3

LAN8700IC-AEZG-TR by Microchip Technology

LAN8700IC-AEZG-TR

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

TS 16949

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.24SQ,20

85 Cel

12.5 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

6 mm

IT ALSO HAS IEEE802.3AB NETWORK PROTOCOL

NO

0

NRZI; BIPH-LEVEL(MANCHESTER)

ASYNC, BIT; SYNC, BYTE

25 MHz

6 mm

CMOS

41.3 mA

1.8 V

4

.5 mm

S-PQCC-N36

YES

e3

ENC28J60-I/SO by Microchip Technology

ENC28J60-I/SO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

8

TS 16949

0

3.3

SMALL OUTLINE

SOP28,.4

3.1 V

85 Cel

1.25 MBps

-40 Cel

Matte Tin (Sn)

DUAL

2.65 mm

8192

7.5 mm

NO

0

SYNC; BIT ;BYTE

25 MHz

40

250

17.9 mm

CMOS

180 mA

3.3 V

1

Serial IO/Communication Controllers

SPI

1.27 mm

R-PDSO-G28

1

Not Qualified

YES

e3

DP83816AVNG-EX/NOPB by Texas Instruments

DP83816AVNG-EX/NOPB

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

OTHER

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

FLATPACK, LOW PROFILE, FINE PITCH

3 V

85 Cel

12.5 MBps

0 Cel

MATTE TIN

QUAD

1.6 mm

20 mm

NO

32

NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

ASYNC, BIT; SYNC, BYTE; ETHERNET

30

260

20 mm

CMOS

3.3 V

7

PCI

.5 mm

S-PQFP-G144

3

YES

e3

LAN9512-JZX by Microchip Technology

LAN9512-JZX

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

0

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

3 V

70 Cel

60 MBps

0 Cel

MATTE TIN

QUAD

1 mm

9 mm

YES

0

SYNC; BIT ;BYTE

25 MHz

260

9 mm

CMOS

1.8 V

1

Serial IO/Communication Controllers

USB

.5 mm

S-PQCC-N64

1

Not Qualified

YES

e3

8

MCP2517FD-H/SL by Microchip Technology

MCP2517FD-H/SL

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Clock Frequency: 40 MHz;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

TS 16949

0

SMALL OUTLINE

SOP14,.25

2.7 V

150 Cel

1 MBps

-40 Cel

MATTE TIN

DUAL

1.75 mm

2048

3.9 mm

NO

0

CAN FD

40 MHz

30

260

8.65 mm

CMOS

20 mA

1

SPI

1.27 mm

R-PDSO-G14

YES

e3

2

MCP25625T-E/ML by Microchip Technology

MCP25625T-E/ML

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE; Length: 6 mm;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

NO LEAD

28

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

TS 16949

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

125 Cel

.125 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

6 mm

NO

0

CAN

25 MHz

40

260

6 mm

CMOS

10 mA

4.5 V

1

SPI

.65 mm

S-PQCC-N28

1

YES

e3

MCP2515-I/STVAO by Microchip Technology

MCP2515-I/STVAO

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, CAN; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, CAN

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

AEC-Q100

0

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

4.5 V

85 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

1.2 mm

14

4.4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

6.5 mm

CMOS

10 mA

5 V

1

SPI

.65 mm

R-PDSO-G20

YES

e3

0

ENC624J600-I/PT by Microchip Technology

ENC624J600-I/PT

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Maximum Data Transfer Rate: 12.5 MBps;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

TS 16949

16

FLATPACK, THIN PROFILE, FINE PITCH

3 V

85 Cel

12.5 MBps

-40 Cel

QUAD

1.2 mm

12288

10 mm

NO

16

25 MHz

10 mm

CMOS

117 mA

3.3 V

SPI

.5 mm

S-PQFP-G64

YES

FT4232HAQ-TRAY by FTDI

FT4232HAQ-TRAY

FTDI

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC64,.35SQ,20;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1.32 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

1.08 V

105 Cel

60 MBps

-40 Cel

QUAD

.8 mm

9 mm

YES

ASYNC, BIT; SYNC, BYTE

12 MHz

40

260

9 mm

CMOS

1.2 V

4

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

.5 mm

S-XQCC-N64

3

YES

8

LAN8700IC-AEZG by Microchip Technology

LAN8700IC-AEZG

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, LAN; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.24SQ,20

3 V

85 Cel

12.5 MBps

-40 Cel

MATTE TIN

QUAD

1 mm

6 mm

NO

0

NRZI; BIPH-LEVEL(MANCHESTER)

ASYNC, BIT; SYNC, BYTE

25 MHz

260

6 mm

CMOS

41.3 mA

1.8 V

4

.5 mm

S-PQCC-N36

3

Not Qualified

YES

e3

MCP2515-I/STRB4 by Microchip Technology

MCP2515-I/STRB4

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

0

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

4.5 V

85 Cel

.125 MBps

-40 Cel

MATTE TIN

DUAL

1.2 mm

4.4 mm

NO

0

NRZ

SYNC; BIT ;BYTE

40 MHz

6.5 mm

CMOS

10 mA

5 V

1

SPI

.65 mm

R-PDSO-G20

YES

e3