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TL16C552FNR

Texas Instruments

TL16C552FNR by Texas Instruments

TL16C552FNR by Texas Instruments is a Serial Communication Controller with 5V power supply, 8MHz clock frequency, and 0.0625 MBps data transfer rate. It is used in applications requiring asynchronous communication protocol, such as IBM PC-AT bus compatibility and serial I/Os.

Median Price

$14.530

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 257 parts In-Stock

1+ parts

$14.530

100+ parts

$9.877

1k+ parts

$9.115

10k+ parts

-

257

$14.530

$9.877

$9.115

-

Mouser Electronics

USA . 181 parts In-Stock

1+ parts

$14.530

100+ parts

$9.880

1k+ parts

$9.110

10k+ parts

-

181

$14.530

$9.880

$9.110

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,479 parts In-Stock

1+ parts

$10.346

100+ parts

-

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-

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3,479

$10.346

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Vyrian

USA . 2,536 parts In-Stock

1+ parts

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2,536

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-

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Chip Stock

USA . 2,530 parts In-Stock

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2,530

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Microfarads

USA . 319 parts In-Stock

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319

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Bristol Electronics

USA . 252 parts In-Stock

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252

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EMSNET

USA . 147 parts In-Stock

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147

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Prism Electronics

USA . 136 parts In-Stock

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136

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ComSIT Distribution GmbH

Germany . 53 parts In-Stock

1+ parts

-

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53

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,832 parts In-Stock

1+ parts

$9.801

100+ parts

-

1k+ parts

-

10k+ parts

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3,832

$9.801

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-

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Microchip USA

USA . 5,894 parts In-Stock

1+ parts

$23.754

100+ parts

-

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5,894

$23.754

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Parana Technologies

USA . 1,568 parts In-Stock

1+ parts

$57.461

100+ parts

-

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1,568

$57.461

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DigiPath Technology Company

USA . 970 parts In-Stock

1+ parts

$63.272

100+ parts

-

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970

$63.272

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IDEA Electronic Components Group

UK . 1,292 parts In-Stock

1+ parts

$64.563

100+ parts

$61.335

1k+ parts

$58.107

10k+ parts

-

1,292

$64.563

$61.335

$58.107

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ChromeModa Solutions

Germany . 70 parts In-Stock

1+ parts

$64.563

100+ parts

$52.942

1k+ parts

-

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70

$64.563

$52.942

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Lixinc

USA . 7,704 parts In-Stock

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7,704

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A-Z Elektronik GmbH

Germany . 6,296 parts In-Stock

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6,296

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Perfect Parts

USA . 2,112 parts In-Stock

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2,112

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Kepictronics

USA . 500 parts In-Stock

1+ parts

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500

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Unlock fast and reliable data transmission with the TL16C552FNR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and performance. Ideal for a wide range of applications, this serial communication controller offers seamless connectivity and efficiency. Experience the value of enhanced communication protocols and secure data transfer at a competitive price point. Upgrade your systems with the TL16C552FNR and elevate your operations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power supply options and ensures stable operation.

Power Supplies (V): 5

Operating at 5V voltage is common in many electronic devices, making it compatible with a wide range of systems.

Maximum Data Transfer Rate: 0.0625 MBps

The high data transfer rate of 0.0625 MBps allows for fast and efficient communication between devices.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocol enables communication between devices with different clock speeds and timing.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product can operate within standard temperature ranges typically found in office environments.

No. of Serial I/Os: 2

Having 2 serial I/Os allows for multiple devices to be connected simultaneously, increasing the versatility of the product.

Technical Specifications

Serial Communication Controllers TL16C552FNR attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ENHANCED BIDIRECTIONAL PRINTER PORT

Address Bus Width:

3

Boundary Scan:

NO

Bus Compatibility:

IBM PC-AT

Maximum Clock Frequency:

8 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.0625 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

8

No. of Serial I/Os:

2

No. of Terminals:

68

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Trade Compliance

TL16C552FNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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