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TL16C550CFNG4

Texas Instruments

TL16C550CFNG4 by Texas Instruments

TL16C550CFNG4 by Texas Instruments is a Serial Communication Controller with a max data transfer rate of 0.125 MBps. It operates at a max clock frequency of 16 MHz and has a temperature grade of COMMERCIAL. This chip is commonly used for asynchronous, bit communication protocols.

Median Price

$2.270

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$2.270

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50

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Vyrian

USA . 7,198 parts In-Stock

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Digiode

USA . 3,982 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,040 parts In-Stock

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$2.270

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$2.225

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$2.270

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$2.225

Argo Parts USA

USA . 3,956 parts In-Stock

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$2.270

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$2.270

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Semicontronic

India . 1,390 parts In-Stock

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$5.000

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$4.875

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$4.850

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1,390

$5.000

$4.875

$4.850

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Ampacity Inc.

Singapore . 289 parts In-Stock

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$8.000

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289

$8.000

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AZTECH Wire

Italy . 483 parts In-Stock

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$18.340

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One Stop Electronics

USA . 962 parts In-Stock

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$21.000

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Aztec Data Supply Inc.

USA . 1,251 parts In-Stock

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$63.110

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Parana Technologies

USA . 2,327 parts In-Stock

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$72.655

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$6,747.133

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$65.390

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$6,747.133

$65.390

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DigiPath Technology Company

USA . 1,735 parts In-Stock

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$80.002

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$80.002

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ChromeModa Solutions

Germany . 3,167 parts In-Stock

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$81.635

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$66.941

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$81.635

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IDEA Electronic Components Group

UK . 161 parts In-Stock

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$81.635

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$77.553

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$73.472

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$81.635

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Netroflash

USA . 1,000 parts In-Stock

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$2.225

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$2.156

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$2.111

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Microchip USA

USA . 434 parts In-Stock

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Perfect Parts

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Corphita

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Overview

Discover the power of seamless communication with the TL16C550CFNG4 by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. This Serial Communication Controller is designed to revolutionize your connectivity experience. With its versatile applications, it offers endless possibilities for data transfer and enables efficient communication across various devices. Whether you're looking to enhance your IoT devices or streamline your industrial processes, the TL16C550CFNG4 delivers exceptional performance. Say goodbye to connectivity issues and unlock a world of opportunities with this cutting-edge solution. Trust Texas Instruments to bring you unmatched value, benefits, and advantages.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and resistance to external elements, making this product ideal for various environments.

Surface Mount: YES

The surface mount capability allows for easier and more efficient assembly processes, making this product suitable for high-volume production.

Maximum Supply Voltage: 5.25 V

With a higher maximum supply voltage, this product can accommodate a wide range of power supply systems, ensuring compatibility in various applications.

Address Bus Width: 3

The generous address bus width of 3 enables the product to handle a larger amount of memory or peripheral devices, enhancing its capabilities and versatility.

Package Shape: SQUARE

The square package shape offers compactness and ease of integration, allowing for efficient utilization of space on circuit boards or in tight installations.

Power Supplies (V): 3.3/5

The compatibility with both 3.3V and 5V power supplies expands compatibility with different systems, providing flexibility and ease of integration.

No. of Terminals: 44

With 44 terminals available, this product can interface with a variety of external components, enabling more extensive connectivity options.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides high-density mounting and excellent thermal dissipation, making it a suitable choice for applications with limited space and heat dissipation requirements.

Minimum Supply Voltage: 4.75 V

The ability to operate with a low minimum supply voltage allows the product to function reliably even in power-constrained scenarios.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand elevated temperature environments, ensuring continued performance and reliability.

Maximum Data Transfer Rate: 0.125 MBps

The high maximum data transfer rate of 0.125 MBps ensures fast and efficient communication, making this product ideal for time-sensitive applications.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures down to 0°C enables this product to function reliably in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and robust electrical connections, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position is suitable for easy connection and stability, enhancing the product's overall performance and ease of use.

Maximum Seated Height: 4.57 mm

The compact maximum seated height of 4.57 mm saves space and facilitates mounting in space-constrained applications.

Width: 16.585 mm

The product's width of 16.585 mm ensures compatibility and integration within standard board sizes, simplifying design considerations.

Data Encoding or Decoding Method: NRZ

The NRZ (Non-Return-to-Zero) data encoding or decoding method provides efficient and reliable communication, making this product suitable for various data transfer applications.

External Data Bus Width: 8

With an 8-bit external data bus width, this product can handle larger data packets, allowing for faster and more efficient data transfers.

Communication Protocol: ASYNC, BIT

The support for asynchronous and bit-level communication protocols enables compatibility with a wide range of systems, making this product versatile and suitable for diverse applications.

Maximum Clock Frequency: 16 MHz

With a high maximum clock frequency of 16 MHz, this product can handle high-speed data transfer and processing, ensuring optimal performance in demanding scenarios.

Maximum Time At Peak Reflow Temperature (s): 30

The product's ability to withstand elevated temperatures for up to 30 seconds during reflow soldering ensures proper soldering and reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for proper soldering and assembly, ensuring strong electrical connections and long-lasting performance.

Length: 16.585 mm

The product's length of 16.585 mm facilitates compatibility and integration within standard board sizes, simplifying design considerations.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this product is optimized for typical operating temperatures, making it suitable for a wide range of commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The peripheral IC type designates this product as a serial I/O and communication controller, providing extensive functionality for serial communication applications.

Technology: CMOS

The utilization of CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide range of systems, making this product efficient and reliable.

Terminal Form: J BEND

The J bend terminal form allows for secure and reliable connections, minimizing the risk of accidental disconnections or signal disruptions.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility and reliable operation with standard voltage levels, making this product widely applicable.

No. of Serial I/Os: 1

With 1 serial input/output, this product can facilitate data transfer and communication between different devices, enabling seamless integration in various systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch provides convenient compatibility with standard connectors and sockets, allowing for easy integration and reliable connections.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates a moderate sensitivity to moisture, requiring appropriate handling and storage practices to maintain product integrity.

Technical Specifications

Serial Communication Controllers TL16C550CFNG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY AT 14.9 MHZ

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e4

Length:

16.585 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Trade Compliance

TL16C550CFNG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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