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LAN9730I-ABZJ-TR

Microchip Technology

LAN9730I-ABZJ-TR by Microchip Technology

LAN9730I-ABZJ-TR by Microchip Technology is a Serial Communication Controller with 60 MBps data transfer rate, suitable for Ethernet communication. It operates b/w -40 to 85 °C and supports low power mode. The chip carrier package has 56 terminals in a square shape, making it ideal for industrial applications requiring high-speed connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Prism Electronics

USA . 775 parts In-Stock

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775

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 16,088 parts In-Stock

1+ parts

$6.090

100+ parts

$5.010

1k+ parts

$4.860

10k+ parts

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16,088

$6.090

$5.010

$4.860

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Andel Nordic

Denmark . 1,358 parts In-Stock

1+ parts

$10.743

100+ parts

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1k+ parts

$10.313

10k+ parts

$10.313

1,358

$10.743

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$10.313

$10.313

Corohmni

South Africa . 1,106 parts In-Stock

1+ parts

$27.778

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1,106

$27.778

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QUARKTWIN TECHNOLOGY LTD

USA . 29,143 parts In-Stock

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29,143

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Kepictronics

USA . 26,317 parts In-Stock

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26,317

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Perfect Parts

USA . 6,720 parts In-Stock

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6,720

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Continental Prestige Electronics

USA . 4,257 parts In-Stock

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4,257

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 2,443 parts In-Stock

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2,443

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Lixinc

USA . 2,134 parts In-Stock

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2,134

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RGB Technical Solutions

Ukraine . 1,143 parts In-Stock

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1,143

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Experience seamless and reliable communication with the Microchip Technology LAN9730I-ABZJ-TR. This high-quality Serial Communication Controller offers unparalleled performance and versatility. From its durable construction to its advanced technology, this product is designed to meet your connectivity needs with ease. Whether you're looking to enhance your Ethernet capabilities or streamline your data transfer processes, the LAN9730I-ABZJ-TR delivers exceptional value and benefits that will take your projects to the next level. Trust in Microchip Technology for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly of the product onto circuit boards, saving space and increasing reliability.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage tolerance ensures the product's stability and performance even in high voltage environments.

Screening Level: TS 16949

Meeting the TS 16949 screening level indicates that the product has undergone rigorous quality testing and meets automotive industry standards for reliability.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making it easy to integrate into different electronic systems.

No. of Terminals: 56

With a high number of terminals, the product can support complex communication and control functions, making it versatile for various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier package style with heat sink/slug and very thin profile design allows for efficient heat dissipation and space-saving installation.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage requirement ensures energy efficiency and reliable operation even in low voltage conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures the product can perform reliably in a wide range of environmental conditions.

Maximum Data Transfer Rate: 60 MBps

The high data transfer rate enables fast and efficient communication between devices, ideal for high-speed data processing applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance ensures the product can operate effectively in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and reliable electrical connections for long-term performance.

Terminal Position: QUAD

The quad terminal position layout simplifies the connection and integration of the product into electronic systems.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a compact and slim design, suitable for applications with limited space.

Width: 7 mm

The narrow width of the product makes it suitable for compact electronic devices and systems.

Boundary Scan: YES

Having boundary scan capability enables efficient testing and debugging of the product during manufacturing and maintenance processes.

Data Encoding or Decoding Method: NRZI; BIPH-LEVEL(MANCHESTER)

The use of advanced data encoding and decoding methods enhances data transmission reliability and error correction capabilities.

Communication Protocol: SYNC, BIT, BYTE, ETHERNET

Support for multiple communication protocols enables seamless integration with different network and communication systems, enhancing connectivity options.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency allows for fast and efficient data processing and communication.

Length: 7 mm

The compact length of the product makes it suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

The product's peripheral IC type enables it to function as a serial I/O and communication controller, suitable for LAN connectivity and data transfer.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption, high speed processing, and reliable performance.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the installation and soldering process, reducing assembly time and ensuring reliable connections.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage requirement ensures compatibility with standard power sources, making the product easy to integrate into existing systems.

No. of Serial I/Os: 4

The multiple serial I/O ports offer flexibility in connecting and controlling different devices, enhancing the product's functionality.

Bus Compatibility: PCI; USB

Compatibility with PCI and USB bus systems enables seamless integration with a wide range of computer and electronic devices, expanding connectivity options.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for dense packaging and efficient use of space on circuit boards, ideal for compact electronic devices.

Low Power Mode: YES

The low power mode feature helps to reduce energy consumption and heat generation, extending the product's lifespan and efficiency.

No. of I/O Lines: 11

The presence of multiple I/O lines enables versatile input and output configurations, enhancing the product's connectivity and functionality.

Technical Specifications

Serial Communication Controllers LAN9730I-ABZJ-TR attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Boundary Scan:

YES

Bus Compatibility:

PCI; USB

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC, BIT, BYTE, ETHERNET

Data Encoding or Decoding Method:

NRZI; BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

60 MBps

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

No. of I/O Lines:

11

No. of Serial I/Os:

4

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.27SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LAN9730I-ABZJ-TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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