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Telecom - Encryption ICs

Telecom Encryption ICs are electronic components used in telecommunications systems to provide secure communication and protect sensitive data from unauthorized access. Encryption ICs are designed to provide high levels of security for data transmitted over telecommunications networks, preventing interception and eavesdropping by unauthorized parties.

Telecom Encryption ICs use various encryption algorithms, such as Advanced Encryption Standard (AES) and Rivest–Shamir–Adleman (RSA), to encrypt and decrypt data transmitted over the network. These algorithms use complex mathematical formulas and keys to scramble and unscramble the data, making it unintelligible to anyone without the decryption key.

Some common features of Telecom Encryption ICs include:

1. High-level encryption: Encryption ICs provide high levels of encryption to ensure the security and integrity of data transmitted over the network.

2. Key management: Encryption ICs manage the encryption keys used to encrypt and decrypt data, ensuring that the keys are protected and not compromised.

3. Authentication: Encryption ICs can also provide authentication features to ensure that only authorized parties have access to the data.

4. Compatibility: Encryption ICs are designed to be compatible with various communication protocols and networks, enabling them to be integrated into a wide range of telecommunications systems.

Telecom Encryption ICs are used in a variety of applications, including secure messaging systems, mobile devices, and financial transactions. They are also used in government and military communications systems to ensure the secure transmission of sensitive information.

Telecom - Encryption ICs

Available Parts 40

Part RoHS Manufacturer Description Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length
HCS300-I/SN by Microchip Technology

HCS300-I/SN

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

2.5 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

HCS365/P by Microchip Technology

HCS365/P

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

TS 16949

5 mA

5 V

IN-LINE

DIP8,.3

2.54 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDIP-T8

5.334 mm

7.62 mm

Not Qualified

e3

9.271 mm

HCS365I/SM by Microchip Technology

HCS365I/SM

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

2.03 mm

5.21 mm

Not Qualified

e3

40

260

5.28 mm

HCS301T/SN by Microchip Technology

HCS301T/SN

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

12 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

HCS301-I/SN by Microchip Technology

HCS301-I/SN

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

12 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

HCS300-I/SNVAO by Microchip Technology

HCS300-I/SNVAO

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

2.5 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

HCS300T/SN by Microchip Technology

HCS300T/SN

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

2.5 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

HCS101-I/SN by Microchip Technology

HCS101-I/SN

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

2 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

HCS300/P by Microchip Technology

HCS300/P

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

TS 16949

2.5 mA

5 V

IN-LINE

DIP8,.3

2.54 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDIP-T8

5.33 mm

7.62 mm

Not Qualified

e3

9.271 mm

HCS300T-I/SN by Microchip Technology

HCS300T-I/SN

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

2.5 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

HCS300T-I/SNVAO by Microchip Technology

HCS300T-I/SNVAO

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

2.5 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

HCS101/P by Microchip Technology

HCS101/P

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

2.54 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDIP-T8

4.32 mm

7.62 mm

Not Qualified

e3

9.46 mm

HCS101/SN by Microchip Technology

HCS101/SN

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G8

3

1.75 mm

3.9116 mm

Not Qualified

e3

40

260

4.9 mm

HCS300-I/P by Microchip Technology

HCS300-I/P

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

TS 16949

2.5 mA

5 V

IN-LINE

DIP8,.3

2.54 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDIP-T8

5.33 mm

7.62 mm

Not Qualified

e3

9.271 mm

HCS300/SN by Microchip Technology

HCS300/SN

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

2.5 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

HCS101-I/P by Microchip Technology

HCS101-I/P

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

TS 16949

2 mA

5 V

IN-LINE

DIP8,.3

2.54 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDIP-T8

5.334 mm

7.62 mm

Not Qualified

e3

9.271 mm

HCS101T-I/SN by Microchip Technology

HCS101T-I/SN

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G8

3

1.75 mm

3.9 mm

Not Qualified

e3

40

260

4.9 mm

HCS365I/P by Microchip Technology

HCS365I/P

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDIP-T8

4.32 mm

7.62 mm

Not Qualified

e3

9.46 mm

HCS515-I/SL by Microchip Technology

HCS515-I/SL

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

2 mA

5 V

5

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e3

40

260

8.65 mm

HCS362-I/SN by Microchip Technology

HCS362-I/SN

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

1.2 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G8

3

1.75 mm

3.9 mm

Not Qualified

e3

40

260

4.9 mm

HCS362-I/SNVAO by Microchip Technology

HCS362-I/SNVAO

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

1.2 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

e3

30

260

4.9 mm

HCS200/SN by Microchip Technology

HCS200/SN

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

12 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

HCS301/SN by Microchip Technology

HCS301/SN

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

12 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

HCS512-I/SO by Microchip Technology

HCS512-I/SO

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

10 mA

5 V

5

SMALL OUTLINE

SOP18,.4

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G18

1

2.65 mm

7.5 mm

Not Qualified

e3

260

11.55 mm

HCS512T-I/SO by Microchip Technology

HCS512T-I/SO

Microchip Technology

DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

INDUSTRIAL

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

10 mA

5 V

5

SMALL OUTLINE

SOP18,.4

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G18

2

2.65 mm

7.5 mm

Not Qualified

e3

40

260

11.55 mm

TMS7500NL by Texas Instruments

TMS7500NL

Texas Instruments

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; Package Code: DIP; Minimum Operating Temperature: 0 Cel; Qualification: Not Qualified;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

THROUGH-HOLE

DIP

PLASTIC/EPOXY

NO

MOS

IN-LINE

DIP(UNSPEC)

Telecom Encryption Circuits

70 Cel

0 Cel

DUAL

Not Qualified

TMS75C00FNL by Texas Instruments

TMS75C00FNL

Texas Instruments

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; Package Code: QCCJ; Qualification: Not Qualified; Package Equivalence Code: LDCC(UNSPEC);

DATA ENCRYPTION CIRCUIT

COMMERCIAL

J BEND

QCCJ

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LDCC(UNSPEC)

Telecom Encryption Circuits

70 Cel

0 Cel

QUAD

Not Qualified

TMS75C00NL by Texas Instruments

TMS75C00NL

Texas Instruments

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; Package Code: DIP; Package Equivalence Code: DIP(UNSPEC); Surface Mount: NO;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

THROUGH-HOLE

DIP

PLASTIC/EPOXY

NO

CMOS

IN-LINE

DIP(UNSPEC)

Telecom Encryption Circuits

70 Cel

0 Cel

DUAL

Not Qualified

ADSP-2141LKS-E1 by Analog Devices

ADSP-2141LKS-E1

Analog Devices

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, FINE PITCH

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G208

4.1 mm

28 mm

Not Qualified

e0

28 mm

ADSP-2141L by Analog Devices

ADSP-2141L

Analog Devices

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, FINE PITCH

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G208

4.1 mm

28 mm

Not Qualified

e0

28 mm

ADSP-2141LKS-N1 by Analog Devices

ADSP-2141LKS-N1

Analog Devices

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, FINE PITCH

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G208

4.1 mm

28 mm

Not Qualified

e0

28 mm

ST19NP18ER28PVMT by STMicroelectronics

ST19NP18ER28PVMT

STMicroelectronics

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Telecom Encryption Circuits

.635 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G28

3

Not Qualified

e3

30

260

ST19NP18ER28PVMO by STMicroelectronics

ST19NP18ER28PVMO

STMicroelectronics

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Telecom Encryption Circuits

.635 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G28

3

Not Qualified

e3

30

260

ST19NP18ER28PVMK by STMicroelectronics

ST19NP18ER28PVMK

STMicroelectronics

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Telecom Encryption Circuits

.635 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G28

3

Not Qualified

e3

30

260

ST19NP18ER28PVMX by STMicroelectronics

ST19NP18ER28PVMX

STMicroelectronics

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Telecom Encryption Circuits

.635 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G28

3

Not Qualified

e3

30

260

VMS115 by NXP Semiconductors

VMS115

NXP Semiconductors

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

.65 mm

70 Cel

0 Cel

QUAD

R-PQFP-G100

3.4 mm

14 mm

Not Qualified

20 mm

VMS113 by NXP Semiconductors

VMS113

NXP Semiconductors

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

CHIP CARRIER

1.27 mm

70 Cel

0 Cel

QUAD

S-PQCC-J44

4.57 mm

16.5862 mm

Not Qualified

16.5862 mm

DS2160 by Maxim Integrated

DS2160

Maxim Integrated

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

5 V

5

IN-LINE

DIP24,.6

Telecom Encryption Circuits

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T24

Not Qualified

e0

DS2160Q by Maxim Integrated

DS2160Q

Maxim Integrated

DATA ENCRYPTION CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

DATA ENCRYPTION CIRCUIT

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CMOS

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Telecom Encryption Circuits

1.27 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-J28

Not Qualified

e0

HS1-3447-8 by Renesas Electronics

HS1-3447-8

Renesas Electronics

DATA ENCRYPTION CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;

DATA ENCRYPTION CIRCUIT

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC

NO

CMOS

38535Q/M;38534H;883B

4.6/6,4.6/7.8

IN-LINE

DIP16,.4

Telecom Encryption Circuits

2.54 mm

DUAL

R-XDIP-T16

Not Qualified