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HCS365I/P

Microchip Technology

HCS365I/P by Microchip Technology

Microchip Technology's HCS365I/P is a Telecom IC for data encryption circuits. It operates b/w -40 to 85°C, with 8 terminals in an inline package style. The IC has a nominal voltage of 5V and is ideal for industrial applications requiring secure data transmission.

Median Price

$1.830

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 20 parts In-Stock

1+ parts

$1.830

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-

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20

$1.830

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Vyrian

USA . 4,386 parts In-Stock

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-

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4,386

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,153 parts In-Stock

1+ parts

$1.830

100+ parts

-

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2,153

$1.830

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.830

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2,000

$1.830

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Continental Prestige Electronics

USA . 1,452 parts In-Stock

1+ parts

$1.830

100+ parts

-

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$1.793

1,452

$1.830

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$1.793

Aztec Data Supply Inc.

USA . 1,411 parts In-Stock

1+ parts

$7.970

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1,411

$7.970

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AZTECH Wire

Italy . 436 parts In-Stock

1+ parts

$14.500

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436

$14.500

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Corohmni

South Africa . 13 parts In-Stock

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$15.305

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13

$15.305

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Ampacity Inc.

Singapore . 1,586 parts In-Stock

1+ parts

$205.000

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1,586

$205.000

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Kepictronics

USA . 25,889 parts In-Stock

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Fulton Briggs Corp.

USA . 6,975 parts In-Stock

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6,975

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Microchip USA

USA . 1,795 parts In-Stock

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1,795

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Overview

Looking to secure your data with top-notch encryption technology? Look no further than the HCS365I/P by Microchip Technology. With a focus on quality and reliability, Microchip Technology is a trusted manufacturer in the industry. The HCS365I/P falls under the category of Telecom - Encryption ICs, making it ideal for telecommunications applications. This product offers customers value, benefits, and advantages by providing secure data encryption in a compact and durable package. Upgrade your security measures with the HCS365I/P today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Maximum Operating Temperature: 85 °C

This high maximum operating temperature ensures reliable performance even in challenging environments.

Nominal Supply Voltage: 5 V

The 5V supply voltage is a common standard in many applications, making this product compatible with a wide range of systems.

Technical Specifications

Telecom - Encryption ICs HCS365I/P attributes and parameters. Explore more Telecom - Encryption ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.46 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.32 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCS365I/P Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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