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Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.

Microprocessors

Available Parts 2,400+

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Part RoHS Manufacturer Description Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines
AM3358BZCZA100 by Texas Instruments

AM3358BZCZA100

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.378 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.272 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.325 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

1000 rpm

YES

e1

MIMXRT1062DVL6B by NXP Semiconductors

MIMXRT1062DVL6B

NXP Semiconductors

MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

MICROCONTROLLER, RISC

TIN SILVER COPPER

40

260

3

e1

MIMXRT1062DVJ6B by NXP Semiconductors

MIMXRT1062DVJ6B

NXP Semiconductors

MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 260; JESD-609 Code: e2;

MICROCONTROLLER, RISC

TIN SILVER

40

260

3

e2

MIMXRT1062DVL6A by NXP Semiconductors

MIMXRT1062DVL6A

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

MICROCONTROLLER, RISC

TIN SILVER COPPER

40

260

3

e1

MIMXRT1062DVJ6A by NXP Semiconductors

MIMXRT1062DVJ6A

NXP Semiconductors

MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e2;

MICROCONTROLLER, RISC

TIN SILVER

40

260

3

e2

AM3352BZCZD80 by Texas Instruments

AM3352BZCZD80

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.326 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.21 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.26 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

800 rpm

YES

e1

AM3352BZCZ100 by Texas Instruments

AM3352BZCZ100

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC

OTHER

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.378 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.272 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.325 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

1000 rpm

YES

e1

MIMXRT1176DVMAA by NXP Semiconductors

MIMXRT1176DVMAA

NXP Semiconductors

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;

MICROPROCESSOR, RISC

40

260

3

AM3358BZCZ100 by Texas Instruments

AM3358BZCZ100

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC

OTHER

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.378 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.272 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.325 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

1000 rpm

YES

e1

ATSAMA5D31A-CUR by Microchip Technology

ATSAMA5D31A-CUR

Microchip Technology

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

8

26

32

1.2

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.08 V

85 Cel

1

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

48 MHz

15 mm

CMOS

1.2 V

39

10

Microprocessors

.8 mm

FLOATING POINT

S-PBGA-B324

Not Qualified

536 rpm

YES

e1

ATSAMA5D35A-CUR by Microchip Technology

ATSAMA5D35A-CUR

Microchip Technology

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

8

26

32

1.2

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.08 V

85 Cel

1

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

48 MHz

15 mm

CMOS

1.2 V

39

10

Microprocessors

.8 mm

FLOATING POINT

S-PBGA-B324

Not Qualified

536 rpm

YES

e1

MIMXRT1062XVN5B by NXP Semiconductors

MIMXRT1062XVN5B

NXP Semiconductors

MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

MICROPROCESSOR

40

260

3

MIMXRT1176AVM8A by NXP Semiconductors

MIMXRT1176AVM8A

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.95 V

8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

1.71 V

125 Cel

-40 Cel

BOTTOM

1.52 mm

2097152

14 mm

YES

48 MHz

40

260

14 mm

CMOS

850 mA

1.8 V

32

1

.8 mm

FLOATING-POINT

S-PBGA-B289

3

800 rpm

YES

AM3352BZCZA100 by Texas Instruments

AM3352BZCZA100

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.378 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.272 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.325 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

1000 rpm

YES

e1

ATSAMA5D36A-CU by Microchip Technology

ATSAMA5D36A-CU

Microchip Technology

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

8

26

32

1.2

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.08 V

85 Cel

1

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm