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MCF5328CVM240J

Freescale Semiconductor

MCF5328CVM240J by Freescale Semiconductor

MCF5328CVM240J by Freescale Semiconductor is a 32-bit microprocessor with integrated cache, operating at max 80 MHz. It features a 24-bit address bus width and low power mode, suitable for industrial applications requiring high-speed processing in compact devices. The package style is grid array with dimensions of 17mm x 17mm and terminal pitch of 1mm.

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Overview

Unlock the power of advanced technology with the MCF5328CVM240J microprocessor by Freescale Semiconductor. Designed with precision and expertise, this innovative product offers seamless integration, high performance, and reliability for a wide range of applications. Whether you're looking to enhance your embedded system or optimize your industrial automation processes, the MCF5328CVM240J delivers unmatched value and efficiency. Trust in Freescale Semiconductor to provide cutting-edge solutions that drive success in the ever-evolving world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making it suitable for a wide range of applications.

Integrated Cache: YES

The integrated cache helps improve processing speed and efficiency, making this microprocessor a high-performing choice.

Surface Mount: YES

The surface mount capability allows for easy installation and removal, making it convenient for maintenance and upgrades.

Maximum Supply Voltage: 1.6 V

With a high maximum supply voltage, this microprocessor can handle power fluctuations without compromising performance.

Address Bus Width: 24

The wide address bus width allows for efficient data transfer and processing, enhancing overall system performance.

Package Shape: SQUARE

The square package shape provides a compact design, ideal for space-constrained applications.

Bit Size: 32

The 32-bit architecture allows for faster data processing and multitasking capabilities, making it suitable for demanding tasks.

Power Supplies (V): 1.5,1.8/3.3

Multiple power supply options provide flexibility and compatibility with different systems and environments.

No. of Terminals: 256

The high number of terminals allows for multiple connections and functionalities, enhancing the microprocessor's versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array and low profile package style ensure efficient heat dissipation and space-saving designs, ideal for compact systems.

Minimum Supply Voltage: 1.4 V

With a low minimum supply voltage, this microprocessor offers energy efficiency and helps reduce power consumption.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance even in harsh thermal conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold environments.

Terminal Finish: TIN SILVER COPPER OVER NICKEL

The terminal finish provides corrosion resistance and conductivity, ensuring long-term reliability and performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and enhances connectivity in a variety of system configurations.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for slim and compact designs, suitable for thin devices and applications.

Width: 17 mm

The moderate width provides a balance between space-saving and ease of integration in different system layouts.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging, saving time and resources during development and production.

External Data Bus Width: 32

The wide external data bus width enables fast data transfer between the microprocessor and external devices, enhancing system performance.

Maximum Clock Frequency: 80 MHz

The high maximum clock frequency enables rapid data processing and smooth operation for demanding tasks.

Maximum Time At Peak Reflow Temperature (s): 40

The short maximum time at peak reflow temperature ensures proper soldering and reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for secure soldering and durability in various manufacturing environments.

Length: 17 mm

The moderate length provides flexibility in system design and integration, accommodating different layout requirements.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance across a wide range of operating conditions and environments.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture in this microprocessor offers a streamlined instruction set and high performance for efficient processing.

Technology: CMOS

The CMOS technology used in this microprocessor provides low power consumption and high-speed operation, making it energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form enables secure connections and efficient heat dissipation, ensuring stable performance and longevity.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage provides stable and consistent power delivery, essential for reliable operation and performance.

Terminal Pitch: 1 mm

The fine terminal pitch allows for high-density connections and compact designs, suitable for space-constrained applications.

Format: FIXED POINT

The fixed-point format enhances arithmetic precision and processing speed, making it suitable for numerical calculations and data processing.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures proper handling and storage requirements to prevent damage during manufacturing and deployment.

Speed: 240 rpm

The high rotational speed enables fast data access and processing, ideal for real-time applications and performance-critical tasks.

Low Power Mode: YES

The low power mode feature allows for energy-efficient operation and extended battery life in mobile and battery-powered devices.

Technical Specifications

Microprocessors MCF5328CVM240J attributes and parameters. Explore more Microprocessors devices from Freescale Semiconductor

Specs

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

80 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

240 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER OVER NICKEL

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCF5328CVM240J Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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