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MCF5251CVM140R2

NXP Semiconductors

MCF5251CVM140R2 by NXP Semiconductors

NXP Semiconductors' MCF5251CVM140R2 microprocessor features 32-bit architecture, 140 MHz clock frequency, and 24-bit address bus width. Ideal for industrial applications requiring high-speed processing with a max supply voltage of 1.32 V and operating temperature range from -40 to 85 °C.

Median Price

$22.483

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$22.483

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500

$22.483

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Flip Electronics

USA . 5,000 parts In-Stock

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Vyrian

USA . 4,576 parts In-Stock

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Digiode

USA . 4,032 parts In-Stock

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Anansix

USA . 2,782 parts In-Stock

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Chip Stock

USA . 455 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,900 parts In-Stock

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$3.000

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$3.000

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Semicontronic

India . 4,883 parts In-Stock

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$11.000

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$10.725

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$10.670

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One Stop Electronics

USA . 4,849 parts In-Stock

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$17.000

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Continental Prestige Electronics

USA . 559 parts In-Stock

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$22.483

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$22.034

559

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$22.034

Netroflash

USA . 50 parts In-Stock

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$22.483

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$21.359

10k+ parts

$20.910

50

$22.483

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$21.359

$20.910

Advanced Electronics

New Zealand . 80 parts In-Stock

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$22.679

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$20.865

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$19.551

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Vigor

Singapore . 2,550 parts In-Stock

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$31.070

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Microchip USA

USA . 2,584 parts In-Stock

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$56.766

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Aztec Data Supply Inc.

USA . 3,003 parts In-Stock

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$62.570

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Corohmni

South Africa . 1 parts In-Stock

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$81.972

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Argo Parts USA

USA . 4,954 parts In-Stock

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Corphita

USA . 3,386 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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UNI Independent Distributors

Spain . 399 parts In-Stock

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399

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

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Overview

Elevate your electronic designs with the MCF5251CVM140R2 microprocessor from NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-notch quality and reliability. This versatile processor is perfect for a wide range of applications, offering high performance and efficiency. With integrated cache, low profile package style, and a maximum clock frequency of 140 MHz, this product provides exceptional value and benefits to customers seeking cutting-edge technology. Upgrade your projects with the MCF5251CVM140R2 and experience the difference in performance and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good durability and heat resistance, making this microprocessor suitable for various industrial applications.

Integrated Cache: YES

Integrated cache improves the performance of the microprocessor by allowing faster access to frequently used data, resulting in enhanced overall speed and efficiency.

Maximum Supply Voltage: 1.32 V

Operating within a maximum supply voltage of 1.32V ensures the safety and stability of the microprocessor, preventing overheating or damage.

Address Bus Width: 24

A wider address bus width of 24 bits allows the microprocessor to handle larger memory capacities, enabling it to efficiently process more data at once.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier mounting and soldering of the microprocessor onto circuit boards, making it user-friendly for assembly.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microprocessor can function reliably even in harsh environmental conditions or under heavy workloads.

Speed: 140 rpm

Operating at a speed of 140 rpm ensures quick processing and response times, making this microprocessor efficient for handling tasks that require high performance.

Technical Specifications

Microprocessors MCF5251CVM140R2 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

140 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B225

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

225

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Speed:

140 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

13 mm

Peripheral IC Type:

Trade Compliance

MCF5251CVM140R2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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