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SPC5200CBV400B

NXP Semiconductors

SPC5200CBV400B by NXP Semiconductors

NXP Semiconductors' SPC5200CBV400B is a 32-bit microprocessor with integrated cache and a max clock frequency of 66 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade.

Median Price

$60.530

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

SPC5200CBV400B by NXP Semiconductors
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Arrow

USA . 207 parts In-Stock

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$60.530

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$44.860

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Verical

USA . 207 parts In-Stock

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$60.530

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207

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Digiode

USA . 3,295 parts In-Stock

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$44.707

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Nova Conductors

Japan . 15 parts In-Stock

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$48.572

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Bristol Electronics

USA . 2 parts In-Stock

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$54.000

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Chip Stock

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Anansix

USA . 1,491 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,202 parts In-Stock

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Vyrian

USA . 632 parts In-Stock

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Classic Components Corporation

USA . 366 parts In-Stock

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AZTECH Wire

Italy . 632 parts In-Stock

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$5.681

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Aztec Data Supply Inc.

USA . 4,783 parts In-Stock

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$23.185

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$33.592

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$30.569

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$27.545

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Ampacity Inc.

Singapore . 127 parts In-Stock

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$38.210

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Corphita

USA . 3,272 parts In-Stock

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$42.354

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Continental Prestige Electronics

USA . 282 parts In-Stock

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$48.572

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$47.601

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$47.601

Netroflash

USA . 50 parts In-Stock

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$48.572

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$46.144

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$45.172

50

$48.572

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$46.144

$45.172

Corohmni

South Africa . 27 parts In-Stock

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$63.417

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Vigor

Singapore . 3,026 parts In-Stock

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Microchip USA

USA . 1,796 parts In-Stock

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Lixinc

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UNI Independent Distributors

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Argo Parts USA

USA . 3,659 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 450 parts In-Stock

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Futuretech Components

Singapore . 400 parts In-Stock

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Perfect Parts

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Speed Components Ltd (Excess)

Israel . 36 parts In-Stock

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Overview

Experience unprecedented performance and reliability with the SPC5200CBV400B by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors guarantees the highest quality microprocessors that exceed expectations. The SPC5200CBV400B offers seamless integration with its integrated cache and surface mount capability. With a wide range of applications, this product is perfect for any project. Unlock the true potential of your designs with the SPC5200CBV400B and witness the value and benefits it brings to your customers. Trust NXP Semiconductors for unparalleled innovation and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and resistant to breakage, making the product reliable for long-term use.

Integrated Cache: YES

Integrated cache helps improve processing speed and efficiency, making the product suitable for high-demand applications.

Maximum Supply Voltage: 1.58 V

Higher maximum supply voltage allows for flexibility in power requirements and performance optimization.

Address Bus Width: 32

Wider address bus width allows for efficient data processing and memory access.

Package Shape: SQUARE

Square package shape provides a compact design, saving space in electronic devices.

Maximum Operating Temperature: 85 °C

Higher maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for use in extreme cold environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance for efficient operation.

Maximum Clock Frequency: 66 MHz

High maximum clock frequency enables fast data processing and multitasking capabilities.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor, the product is designed for handling complex computing tasks and operations effectively.

Technical Specifications

Microprocessors SPC5200CBV400B attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

272

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Speed:

400 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SPC5200CBV400B Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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