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SPC5200CVR400BR2

NXP Semiconductors

SPC5200CVR400BR2 by NXP Semiconductors

NXP Semiconductors' SPC5200CVR400BR2 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 66 MHz. Suitable for industrial applications, it operates b/w -40 to 85 °C, with low power mode and integrated cache for efficient performance.

Median Price

$56.102

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SPC5200CVR400BR2 by NXP Semiconductors
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Nova Conductors

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Ampacity Inc.

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One Stop Electronics

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AZTECH Wire

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South Africa . 777 parts In-Stock

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Overview

Unleash unparalleled performance with the SPC5200CVR400BR2 by NXP Semiconductors, a cutting-edge microprocessor that pushes the boundaries of innovation. Manufactured with precision and expertise, this powerhouse of a chip offers seamless integration, lightning-fast speeds, and unmatched reliability. Ideal for a wide range of applications, from automotive to industrial automation, this microprocessor delivers exceptional value, efficiency, and performance, making it the ultimate choice for tech-savvy customers looking to elevate their projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microprocessor lightweight and durable, ideal for portable devices.

Integrated Cache: YES

With integrated cache, this microprocessor can access frequently used data quickly, improving overall performance.

Surface Mount: YES

Being surface mountable allows for easy installation and replacement, making this microprocessor user-friendly.

Maximum Supply Voltage: 1.58 V

Operating at a maximum supply voltage of 1.58V, this microprocessor offers energy efficiency while maintaining optimal performance.

Address Bus Width: 32

The 32-bit address bus width enables this microprocessor to access a large amount of memory, essential for handling complex tasks.

Screening Level: AEC-Q100

Designed with AEC-Q100 screening level, this microprocessor meets automotive industry standards for reliability and quality.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, making this microprocessor suitable for compact devices.

Bit Size: 32

With a 32-bit architecture, this microprocessor can process data in chunks of 32 bits, enhancing speed and efficiency.

Power Supplies (V): 1.5,3.3

Supporting power supplies of 1.5V and 3.3V, this microprocessor offers versatility for different operating conditions.

No. of Terminals: 272

The 272 terminals provide ample connectivity options, enabling this microprocessor to communicate effectively with other components.

Package Style (Meter): GRID ARRAY

Featuring a grid array package style, this microprocessor offers precise alignment for soldering, ensuring reliable connections.

Minimum Supply Voltage: 1.42 V

With a minimum supply voltage of 1.42V, this microprocessor can operate efficiently even under low power conditions.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85°C ensures the reliability of this microprocessor under various environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning at temperatures as low as -40°C, this microprocessor is suitable for use in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, enhancing the lifespan of this microprocessor.

Terminal Position: BOTTOM

With terminals positioned at the bottom, this microprocessor can be easily integrated into a circuit board layout, enabling efficient routing of connections.

Maximum Seated Height: 2.65 mm

The maximum seated height of 2.65mm ensures a low-profile design, making this microprocessor suitable for slim devices.

Width: 27 mm

With a width of 27mm, this microprocessor offers a compact form factor, ideal for space-constrained applications.

Boundary Scan: YES

Featuring boundary scan capability, this microprocessor allows for efficient testing and debugging during development, reducing time-to-market.

External Data Bus Width: 32

The 32-bit external data bus width enables fast data transfer between the microprocessor and external components, enhancing overall performance.

Maximum Clock Frequency: 66 MHz

Operating at a maximum clock frequency of 66MHz, this microprocessor delivers high-speed processing, suitable for demanding tasks.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40 seconds at peak temperature, this microprocessor ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering of this microprocessor, ensuring strong connections.

Length: 27 mm

Measuring 27mm in length, this microprocessor offers a balanced form factor, suitable for a wide range of device sizes.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this microprocessor is built to withstand harsh operating conditions, making it reliable for industrial applications.

Peripheral IC Type: MICROPROCESSOR

As a microprocessor with peripheral IC functionality, this product offers comprehensive processing capabilities, ideal for multifunctional devices.

Technology: CMOS

Utilizing CMOS technology, this microprocessor delivers low power consumption and high-speed performance, making it energy-efficient.

Terminal Form: BALL

The ball terminal form provides reliable solder joints, ensuring secure connections and long-term durability for this microprocessor.

Nominal Supply Voltage: 1.5 V

Operating at a nominal supply voltage of 1.5V, this microprocessor maintains stable performance while minimizing power consumption.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this microprocessor offers precise spacing for soldering, facilitating easy integration into circuit designs.

Format: FLOATING POINT

Featuring a floating-point format, this microprocessor is capable of handling complex mathematical calculations with high accuracy and speed.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this microprocessor is resistant to moisture, ensuring reliable performance in humid environments.

Speed: 400 rpm

Operating at a speed of 400 rpm, this microprocessor delivers fast processing capabilities, suitable for handling real-time data.

Low Power Mode: YES

With a low power mode option, this microprocessor can optimize energy efficiency when operating in situations with lower power requirements.

Technical Specifications

Microprocessors SPC5200CVR400BR2 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

272

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Speed:

400 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SPC5200CVR400BR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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