Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The NXP Semiconductors P1010NXE5FFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at speeds up to 667 rpm with a temperature range of -40 to 105°C.
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Argo Parts USA
Plastic/Epoxy material provides durability and protection for the microprocessor, ensuring a longer lifespan.
Integrated cache improves the performance of the microprocessor by providing faster access to frequently used instructions and data.
Operating at a maximum supply voltage of 1.05V allows for efficient power consumption and minimizes heat dissipation.
A wider address bus width of 16 allows the microprocessor to access a larger memory space, enhancing overall performance.
The square package shape makes it easier to mount and install the microprocessor on a circuit board, simplifying the production process.
Having a higher number of terminals provides more connectivity options, allowing for greater flexibility in system design.
Operating at a minimum supply voltage of 0.95V ensures stability and reliable performance in low-power applications.
With a high maximum operating temperature of 105°C, this microprocessor can withstand harsh environmental conditions without overheating.
Having 4 external interrupts allows the microprocessor to efficiently handle external events and prioritize tasks for improved performance.
The ability to operate at a minimum temperature of -40°C makes this microprocessor suitable for industrial applications in extreme cold environments.
Microprocessors P1010NXE5FFB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Boundary Scan:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of DMA Channels:
No. of External Interrupts:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
P1010NXE5FFB Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Obsolescence/ EOL - Mult Dev EOL 04/Mar/2021
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
ULN2803A
STMicroelectronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
Zowie Technology
2N2222A
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
FDV304P
Onsemi
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
LL4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM2931Z-5.0RPG
LM2931Z-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V Nominal Output Voltage, 0.1A Max Output Current, and 6V Min Input Voltage. It operates in temperatures ranging from -40 to 125 °C and is ideal for applications requiring stable voltage regulation in electronic circuits.
1N4148
Wuxi Xuyang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
Sensitron Semiconductor
Micro Commercial Components
Small Signal Bipolar Transistors; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-609 Code: e0;
SPC TECHNOLOGY/ MULTICOMP
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
AM3894CCYGA120
Texas Instruments
AM3894CCYGA120 by Texas Instruments is a 32-bit microprocessor with integrated cache and a max clock frequency of 27 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade.
MC7448VU1400ND
NXP Semiconductors
MC7448VU1400ND by NXP Semiconductors is a 32-bit microprocessor with max clock frequency of 1400 MHz. Operating at low power mode, it has a package style of grid array and supports supply voltages ranging from 1.1V to 1.3V. Ideal for applications requiring high-speed processing in compact devices.
P1020NXN2HFB
The NXP Semiconductors P1020NXN2HFB microprocessor features 32-bit architecture, 16-bit address bus width, and integrated cache. Ideal for RISC-based applications, it has a max supply voltage of 1.05 V and supports boundary scan technology.
DM3730CBP100
DM3730CBP100 by Texas Instruments is a microprocessor with integrated cache and surface mount capability. It has an address bus width of 26, on-chip data RAM width of 8, and operates at a max clock frequency of 54 MHz. This processor is commonly used in applications requiring high-speed processing and low power consumption.
MCF54417CMJ250
Freescale Semiconductor
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
MCIMX6X2EVN10AB
MICROPROCESSOR, RISC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Technology: CMOS;
MC68SEC000CFU20
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;
MC7448THX1267ND
The NXP Semiconductors MC7448THX1267ND microprocessor features a 32-bit architecture with 64-bit external data bus width and integrated cache. Operating at a max clock frequency of 200 MHz, it is suitable for industrial applications requiring high-speed processing in low power mode. With a terminal pitch of 1.27 mm and ceramic-metal-sealed co-fired package body material, this processor offers reliable performance in compact designs.
DM3730CUSD100
Texas Instruments DM3730CUSD100 microprocessor features 32-bit architecture, 54 MHz clock frequency, and 423 terminals. Ideal for industrial applications, it offers low power mode, integrated cache, and a wide address bus of 26 bits. With a max supply voltage of 1.2 V, this CMOS technology chip is suitable for high-performance embedded systems.
HW8076502639302SR388
Intel
MICROPROCESSOR;
MPC5200CVR400BR2
NXP Semiconductors' MPC5200CVR400BR2 microprocessor features 32-bit address and external data bus width, with a clock frequency of 35 MHz. Ideal for industrial applications, it operates at temperatures ranging from -40 to 85 °C, offering low power mode and integrated cache for efficient performance.
T1042NXE7MQB
The NXP Semiconductors T1042NXE7MQB microprocessor features a 32-bit architecture with a clock frequency of 133.3 MHz, ideal for high-speed applications. With integrated cache and low power mode, it offers efficient performance at a supply voltage range of 0.97 V to 1.03 V. This square-shaped processor in grid array package is suitable for various RISC-based systems requiring fast data processing.
NUC980DR63YC
Nuvoton Technology
MICROPROCESSOR, RISC;
AM3352BZCZA80
AM3352BZCZA80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and fixed point format processing. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.
AM3517AZERAC
AM3517AZERAC by Texas Instruments is a microprocessor with 16-bit address and data bus width, operating at a max clock frequency of 26 MHz. It features integrated cache, low power mode, and boundary scan capability. Ideal for applications requiring high-speed processing in compact devices like embedded systems and IoT devices.
SAM9X60D1GT-I/4FB
SAM9X60D1GT-I/4FB by Microchip is a microprocessor with 16 DMA channels, 50 MHz clock frequency, and 233 terminals. Ideal for industrial applications, it operates b/w -40 to 85 °C with low power mode and integrated cache for efficient processing. The package style is grid array with a rectangular shape and thin profile.
AM3505AZERA
AM3505AZERA by Texas Instruments is a microprocessor with 16-bit address bus width, 8-bit on-chip data RAM, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C and supports a max clock frequency of 26 MHz. With low power mode and boundary scan capabilities, this CMOS technology-based processor offers high performance in a compact package.
AM3517AZERC
AM3517AZERC by Texas Instruments is a microprocessor with 16-bit address bus, 8-bit on-chip data RAM width, and integrated cache. It operates at a max clock frequency of 26 MHz and has low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.
MCIMX6U5EVM10ACR
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
ATSAMA5D27C-LD1G-CUR
ATSAMA5D27C-LD1G-CUR by Microchip: 16-bit microprocessor with 32-bit RAM, clocked at 24 MHz. Ideal for industrial applications due to low power mode and wide temperature range (-40 to 85 °C). Features boundary scan, 51 DMA channels, and integrated cache for efficient processing.
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P1010NXE5KHB
The NXP Semiconductors P1010NXE5KHB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a max supply voltage of 1.05V.
P1010NXE5HHB
MICROPROCESSOR, RISC; No. of Terminals: 425; Package Body Material: PLASTIC/EPOXY; Terminal Finish: TIN SILVER; Package Equivalence Code: BGA425,23X23,32; Technology: CMOS;
The NXP Semiconductors P1010NXE5HHB microprocessor features 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications with a temperature range of -40 to 105°C, it offers high performance in a compact square package with 425 terminals.
P1010NXE5HFB
The NXP Semiconductors P1010NXE5HFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with a max supply voltage of 1.05V. This CMOS technology-based processor is designed for high-speed performance in various embedded systems.
P1010NXE5HFA
P1010NXE5HFA by NXP Semiconductors is a microprocessor with integrated cache and a max supply voltage of 1.05V. It has a package shape of square, with 425 terminals and a min operating temperature of -40°C. This processor is suitable for industrial applications requiring high-speed processing capabilities.
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
P1010NXE5KHA
P1010NXE5KHA by NXP Semiconductors is a microprocessor with integrated cache and surface mount capability. It has a max supply voltage of 1.05V and an address bus width of 16. This processor is commonly used in industrial applications due to its temperature grade and moisture sensitivity level.
MICROPROCESSOR, RISC; No. of Terminals: 425; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: BGA425,23X23,32; Peak Reflow Temperature (C): 260; Technology: CMOS;
P1010NXE5HHA
The NXP Semiconductors P1010NXE5HHA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a max supply voltage of 1.05V. This microprocessor is designed in a square package style with 425 terminals for surface mount assembly.
MICROPROCESSOR, RISC; No. of Terminals: 425; Power Supplies (V): 1; Bit Size: 32; Speed: 800 rpm; Technology: CMOS;
P1010NXE5FFA
MICROPROCESSOR, RISC; No. of Terminals: 425; Maximum Time At Peak Reflow Temperature (s): 40; Package Body Material: PLASTIC/EPOXY; Peak Reflow Temperature (C): 260; Qualification: Not Qualified;
The NXP Semiconductors P1010NXE5FFA microprocessor features integrated cache, 32-bit external data bus width, and 16-bit address bus width. Ideal for industrial applications requiring a high-speed RISC microprocessor with boundary scan capability.
P1010NXE5DFA
The NXP Semiconductors P1010NXE5DFA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at speeds up to 533 rpm with a temperature range of -40 to 105°C. The package style is grid array with fine pitch terminals.
MICROPROCESSOR, RISC; No. of Terminals: 425; Power Supplies (V): 1; Nominal Supply Voltage: 1 V; Maximum Time At Peak Reflow Temperature (s): 40; Bit Size: 32;
P1010NXE5DFB
NXP Semiconductors P1010NXE5DFB microprocessor features 32-bit external data bus, 16-bit address bus, and integrated cache. Ideal for industrial applications with a temperature range of -40 to 105°C, it offers high performance in a compact square package with 425 terminals.
MICROPROCESSOR, RISC; No. of Terminals: 425; Technology: CMOS; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3; Bit Size: 32;
P1014NXE5HFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 100 MHz;
P1014NXE5HFB by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 100 MHz. This processor features low power mode and boundary scan capabilities, making it ideal for applications requiring high-speed processing in compact devices. With a package style of grid array and fine pitch, this chip offers advanced performance in a small form factor.
P1011NSN2HFB
The NXP Semiconductors P1011NSN2HFB is a 32-bit microprocessor with integrated cache and a max supply voltage of 1.05V. It is used in applications requiring high-speed processing, such as networking equipment and industrial automation systems.
P1010NXN5HHA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Qualification: Not Qualified;
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