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P1010NXE5FFA

NXP Semiconductors

P1010NXE5FFA by NXP Semiconductors

The NXP Semiconductors P1010NXE5FFA microprocessor features integrated cache, 32-bit external data bus width, and 16-bit address bus width. Ideal for industrial applications requiring a high-speed RISC microprocessor with boundary scan capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Anansix

USA . 2,452 parts In-Stock

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Digiode

USA . 594 parts In-Stock

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Vyrian

USA . 396 parts In-Stock

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396

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Nova Conductors

Japan . 50 parts In-Stock

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50

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One Stop Electronics

USA . 2,081 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 711 parts In-Stock

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$10.996

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Semicontronic

India . 373 parts In-Stock

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$15.000

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$14.625

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$14.550

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Ampacity Inc.

Singapore . 1,240 parts In-Stock

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$22.000

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Aztec Data Supply Inc.

USA . 1,400 parts In-Stock

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$30.030

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Corohmni

South Africa . 264 parts In-Stock

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$64.183

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Microchip USA

USA . 267 parts In-Stock

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$67.910

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Lixinc

USA . 7,513 parts In-Stock

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Continental Prestige Electronics

USA . 6,079 parts In-Stock

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UNI Independent Distributors

Spain . 4,190 parts In-Stock

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Argo Parts USA

USA . 3,233 parts In-Stock

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Corphita

USA . 1,686 parts In-Stock

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Vigor

Singapore . 720 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Unleash the power of innovation with the P1010NXE5FFA microprocessor by NXP Semiconductors. Designed with cutting-edge technology and top-quality materials, this versatile component offers seamless integration and unparalleled performance in a variety of applications. Elevate your projects with the reliability and efficiency that only NXP Semiconductors can deliver. Experience the difference and unlock endless possibilities with the P1010NXE5FFA microprocessor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having integrated cache improves the performance efficiency of the microprocessor by reducing access time to frequently used instructions and data.

Maximum Supply Voltage: 1.05V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Address Bus Width: 16

A wider address bus allows for larger memory addressing capability, enhancing the overall processing capacity of the microprocessor.

No. of Terminals: 425

The high number of terminals enable connectivity with various external components, making the product versatile and compatible with a wide range of systems.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures stable performance even in demanding industrial environments.

Technical Specifications

Microprocessors P1010NXE5FFA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B425

Length:

19 mm

Low Power Mode:

NO

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

1.9 mm

Speed:

667 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

19 mm

Peripheral IC Type:

Trade Compliance

P1010NXE5FFA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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