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MPC8358ECZQAGDGA

NXP Semiconductors

MPC8358ECZQAGDGA by NXP Semiconductors

NXP Semiconductors' MPC8358ECZQAGDGA microprocessor features 32-bit address and external data bus width, with a max clock frequency of 66.67 MHz. Ideal for applications requiring low power mode, it comes in a grid array package style with 668 terminals for easy surface mount installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 5,000 parts In-Stock

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Vyrian

USA . 1,391 parts In-Stock

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Digiode

USA . 987 parts In-Stock

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Anansix

USA . 602 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 806 parts In-Stock

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$13.848

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One Stop Electronics

USA . 2,850 parts In-Stock

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$24.000

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Ampacity Inc.

Singapore . 392 parts In-Stock

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$35.000

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Corohmni

South Africa . 87 parts In-Stock

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$38.043

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Vigor

Singapore . 266 parts In-Stock

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$58.410

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Aztec Data Supply Inc.

USA . 266 parts In-Stock

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$67.490

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Microchip USA

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$121.750

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A-Z Elektronik GmbH

Germany . 6,926 parts In-Stock

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UNI Independent Distributors

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Continental Prestige Electronics

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Corphita

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Bastille Electronics

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Authorized Procurement Solutions

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Kepictronics

USA . 700 parts In-Stock

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Futuretech Components

Singapore . 500 parts In-Stock

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Argo Parts USA

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Overview

Discover the cutting-edge MPC8358ECZQAGDGA by NXP Semiconductors, a high-quality microprocessor that offers unparalleled performance and reliability. With NXP's reputation for excellence in semiconductor manufacturing, this product is designed to exceed expectations in a wide range of applications. From enhanced processing power to efficient energy consumption, this microprocessor delivers exceptional value and benefits to customers seeking top-notch performance in their electronic devices. Unleash the full potential of your projects with the MPC8358ECZQAGDGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable electronic devices.

Integrated Cache: YES

The integrated cache helps improve overall performance by storing frequently accessed data, making this microprocessor efficient for multitasking.

Surface Mount: YES

Being surface mountable, this microprocessor is easy to install and saves space on the circuit board, making it ideal for compact electronic devices.

Maximum Supply Voltage: 1.26 V

With a high maximum supply voltage, this microprocessor can handle power fluctuations reliably, ensuring stable performance.

Address Bus Width: 32

The 32-bit address bus width allows this microprocessor to access a large amount of memory, making it suitable for processing complex data.

Package Shape: SQUARE

The square shape of the package provides efficient heat dissipation, keeping the microprocessor cool during operation for enhanced longevity.

Bit Size: 32

The 32-bit architecture of this microprocessor allows for faster data processing and improved performance in demanding applications.

No. of Terminals: 668

With a high number of terminals, this microprocessor offers extensive connectivity options for interfacing with other components, making it versatile in various applications.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style with a heat sink/slug design enhances thermal management, ensuring optimal performance even under high processing loads.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage requirement of this microprocessor helps in conserving power, making it energy-efficient for battery-operated devices.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent solderability, making installation hassle-free and reliable for high-quality connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier PCB layout and routing, simplifying the overall design process for electronic systems.

Maximum Seated Height: 2.46 mm

The low maximum seated height of this microprocessor allows for a slim profile, making it suitable for applications with space constraints.

Width: 29 mm

With a moderate width, this microprocessor can fit into compact electronic devices while still offering powerful processing capabilities.

Boundary Scan: YES

The inclusion of boundary scan capability enables easy testing and debugging of the microprocessor during manufacturing, ensuring product quality and reliability.

External Data Bus Width: 32

The 32-bit external data bus width enables fast data transfer rates between the microprocessor and peripherals, enhancing overall system performance.

Maximum Clock Frequency: 66.67 MHz

The high maximum clock frequency allows for quick data processing and responsiveness, making this microprocessor suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40 seconds at peak temperature, this microprocessor can undergo soldering processes efficiently, ensuring proper assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature tolerance of 260°C ensures the microprocessor's reliability in harsh operating conditions, making it suitable for industrial environments.

Length: 29 mm

The moderate length of this microprocessor provides a balance between performance and space-saving design, making it versatile for a wide range of applications.

Peripheral IC Type: MICROPROCESSOR, RISC

As a RISC-based microprocessor with dedicated peripheral ICs, this product offers streamlined processing for specific tasks, enhancing efficiency in targeted applications.

Technology: CMOS

The CMOS technology used in this microprocessor ensures low power consumption and high performance, making it suitable for energy-efficient and reliable electronic devices.

Terminal Form: BALL

The ball terminal form offers reliable connections and easy installation, contributing to the overall durability and longevity of the microprocessor.

Nominal Supply Voltage: 1.2 V

With a stable nominal supply voltage of 1.2V, this microprocessor ensures consistent performance and power efficiency, ideal for a wide range of applications.

Terminal Pitch: 1 mm

The 1mm terminal pitch allows for compact and efficient PCB design, enabling space-saving layouts for electronic devices with tight dimensional constraints.

Format: FLOATING POINT

Supporting floating-point calculations, this microprocessor is optimized for handling complex mathematical operations, making it suitable for computational tasks.

Moisture Sensitivity Level (MSL): 3

With an MSL level of 3, this microprocessor is less susceptible to moisture damage, ensuring reliability in various environmental conditions.

Speed: 400 rpm

The speed rating of 400 rpm ensures efficient data processing and responsiveness, making this microprocessor suitable for high-performance applications.

Low Power Mode: YES

The low power mode feature allows this microprocessor to conserve energy during idle periods, prolonging battery life and enhancing overall efficiency.

Technical Specifications

Microprocessors MPC8358ECZQAGDGA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.67 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B668

JESD-609 Code:

e0

Length:

29 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

668

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.46 mm

Speed:

400 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

29 mm

Peripheral IC Type:

Trade Compliance

MPC8358ECZQAGDGA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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