Loading...

STM32MP131CAE3

STMicroelectronics

STM32MP131CAE3 by STMicroelectronics

STM32MP131CAE3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It operates at a max clock frequency of 48 MHz, suitable for low power applications in various industries like IoT, automotive, and consumer electronics. With a wide address bus width of 26 bits and external data bus width of 16 bits, it offers high performance in a compact square package shape.

Median Price

$5.140

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 454 parts In-Stock

1+ parts

-

100+ parts

$5.140

1k+ parts

$5.080

10k+ parts

-

454

-

$5.140

$5.080

-

EBV Elektronik

Germany . 238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

238

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,365 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,365

-

-

-

-

Digiode

USA . 1,549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,549

-

-

-

-

Anansix

USA . 682 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

682

-

-

-

-

TME

Poland . 238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.350

10k+ parts

-

238

-

-

$6.350

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 747 parts In-Stock

1+ parts

$8.238

100+ parts

-

1k+ parts

-

10k+ parts

-

747

$8.238

-

-

-

Ampacity Inc.

Singapore . 80 parts In-Stock

1+ parts

$17.000

100+ parts

-

1k+ parts

-

10k+ parts

-

80

$17.000

-

-

-

Continental Prestige Electronics

USA . 4,799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,799

-

-

-

-

Argo Parts USA

USA . 3,626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,626

-

-

-

-

Corphita

USA . 2,914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,914

-

-

-

-

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Elevate your projects with the STM32MP131CAE3 by STMicroelectronics, a high-quality microprocessor designed to deliver top-notch performance. With its integrated cache and advanced technology, this product offers unparalleled value to customers across various applications. Whether you're working on IoT devices or industrial automation systems, this microprocessor's low power mode and maximum clock frequency of 48 MHz ensure efficient operations. Trust in the expertise of STMicroelectronics to provide you with a reliable and versatile solution for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product affordable yet reliable.

Integrated Cache: YES

The integrated cache enhances performance by storing frequently accessed data, speeding up processing time.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on circuit boards, saving space and reducing costs.

Maximum Supply Voltage: 1.38 V

The high maximum supply voltage ensures stable operation and allows for flexibility in power requirements.

On Chip Data RAM Width: 8

The wide data RAM width enables fast data processing, improving overall performance.

Address Bus Width: 26

With a wide address bus width, the processor can access a large memory space, enhancing its capabilities.

Package Shape: SQUARE

The square package shape is compact and efficient, making it suitable for space-constrained applications.

Bit Size: 32

The 32-bit architecture allows for processing large amounts of data at high speeds, making the product ideal for performance-driven tasks.

No. of Terminals: 289

The high number of terminals provides ample connectivity options, making the processor versatile in various applications.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high-density packaging with improved electrical performance, making it suitable for high-performance applications.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage ensures energy efficiency and extends battery life in portable devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the processor to function in cold environments without issues.

Terminal Position: BOTTOM

The bottom terminal position simplifies connections and allows for easier integration into circuit boards.

Maximum Seated Height: 1.7 mm

The low seated height saves space in compact designs while maintaining functionality.

RAM Words: 172032

The large RAM capacity enhances multitasking capabilities and supports complex calculations.

Width: 14 mm

The compact width makes the processor suitable for smaller devices without compromising performance.

Boundary Scan: YES

The boundary scan feature aids in testing and debugging, improving product reliability and ease of maintenance.

External Data Bus Width: 16

The wide external data bus width enables high-speed data transfer between the processor and other components.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency allows for fast data processing and supports real-time applications.

Length: 14 mm

The compact length of the processor saves space in device designs without sacrificing functionality.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture offers efficient and streamlined processing, making the product suitable for high-performance computing.

Technology: CMOS

The CMOS technology ensures low power consumption and high reliability, making the processor energy-efficient and durable.

Terminal Form: BALL

The ball terminal form provides secure connections and simplifies the assembly process.

Maximum Supply Current: 239 mA

The high maximum supply current allows for robust performance under heavy workloads.

Nominal Supply Voltage: 1.25 V

The nominal supply voltage provides a stable power source for consistent performance.

No. of DMA Channels: 56

The high number of DMA channels allows for efficient data transfer and multitasking capabilities.

No. of Serial I/Os: 8

The multiple serial I/Os enhance connectivity and data transfer options for various devices.

Terminal Pitch: 0.8 mm

The small terminal pitch saves space on circuit boards and supports high-density integration.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances processing speed.

Speed: 650 rpm

The high speed of the processor enables quick data processing and enhances overall system responsiveness.

Low Power Mode: YES

The low power mode conserves energy and extends battery life, making the processor suitable for portable devices.

Technical Specifications

Microprocessors STM32MP131CAE3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

8

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.7 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20