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MPC880ZP66

NXP Semiconductors

MPC880ZP66 by NXP Semiconductors

NXP Semiconductors' MPC880ZP66 microprocessor features 32-bit address and external data bus width, with integrated cache and low power mode. Ideal for applications requiring a RISC-based microprocessor with a max supply voltage of 1.9V, such as embedded systems and industrial automation.

Median Price

$36.938

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

MPC880ZP66 by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,716 parts In-Stock

1+ parts

-

100+ parts

$40.140

1k+ parts

-

10k+ parts

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1,716

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$40.140

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Rochester

USA . 924 parts In-Stock

1+ parts

-

100+ parts

$29.550

1k+ parts

$26.440

10k+ parts

$24.890

924

-

$29.550

$26.440

$24.890

DigiKey

USA . 924 parts In-Stock

1+ parts

-

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924

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Verical

USA . 792 parts In-Stock

1+ parts

-

100+ parts

$36.938

1k+ parts

$33.050

10k+ parts

$31.113

792

-

$36.938

$33.050

$31.113

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 76 parts In-Stock

1+ parts

$29.487

100+ parts

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76

$29.487

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Digiode

USA . 4,241 parts In-Stock

1+ parts

$31.264

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4,241

$31.264

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Zilex Electronics Inc.

Canada . 1,188 parts In-Stock

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1,188

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Vyrian

USA . 1,106 parts In-Stock

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1,106

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Anansix

USA . 1,011 parts In-Stock

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1,011

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Prism Electronics

USA . 619 parts In-Stock

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619

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Bristol Electronics

USA . 356 parts In-Stock

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356

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 991 parts In-Stock

1+ parts

$27.970

100+ parts

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991

$27.970

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One Stop Electronics

USA . 963 parts In-Stock

1+ parts

$27.970

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963

$27.970

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Semicontronic

India . 911 parts In-Stock

1+ parts

$27.970

100+ parts

$27.271

1k+ parts

$27.131

10k+ parts

-

911

$27.970

$27.271

$27.131

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Continental Prestige Electronics

USA . 1,833 parts In-Stock

1+ parts

$29.487

100+ parts

-

1k+ parts

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10k+ parts

$28.898

1,833

$29.487

-

-

$28.898

Netroflash

USA . 500 parts In-Stock

1+ parts

$29.487

100+ parts

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500

$29.487

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Corphita

USA . 2,948 parts In-Stock

1+ parts

$29.619

100+ parts

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2,948

$29.619

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Vigor

Singapore . 284 parts In-Stock

1+ parts

$31.600

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284

$31.600

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Microchip USA

USA . 1,591 parts In-Stock

1+ parts

$39.197

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1,591

$39.197

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A-Z Elektronik GmbH

Germany . 6,386 parts In-Stock

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6,386

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UNI Independent Distributors

Spain . 3,964 parts In-Stock

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3,964

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Argo Parts USA

USA . 1,609 parts In-Stock

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1,609

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Futuretech Components

Singapore . 891 parts In-Stock

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891

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Perfect Parts

USA . 693 parts In-Stock

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693

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Speed Components Ltd (Excess)

Israel . 628 parts In-Stock

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628

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Authorized Procurement Solutions

USA . 356 parts In-Stock

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356

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GreenTree Electronics

Israel . 356 parts In-Stock

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356

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Legend Electronics Inc. (Excess)

USA . 356 parts In-Stock

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356

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Overview

Elevate your device's performance with the cutting-edge MPC880ZP66 microprocessor from NXP Semiconductors. This powerhouse processor, with integrated cache and low power mode, is designed to deliver lightning-fast speeds and efficiency for a wide range of applications. With NXP's reputation for quality and innovation, you can trust that this microprocessor will exceed your expectations. Upgrade your technology today and experience the seamless operation and enhanced capabilities that the MPC880ZP66 has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring long-term reliability.

Integrated Cache: YES

Having integrated cache helps in improving the processing speed and efficiency of the microprocessor.

Maximum Supply Voltage: 1.9 V

Higher maximum supply voltage allows for better performance and stability of the microprocessor.

Address Bus Width: 32

A wider address bus allows for faster data transfer and overall better performance.

Package Shape: SQUARE

Square package shape allows for efficient use of space and easier integration into electronic devices.

Power Supplies (V): 1.8,3.3

Having multiple power supply options gives flexibility in different applications and power requirements.

No. of Terminals: 357

Higher number of terminals allow for more connectivity options and interfaces with other components.

Package Style (Meter): GRID ARRAY

Grid array package style provides better heat dissipation and allows for higher processing speeds.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture offers high performance and efficiency for processing tasks.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation of the microprocessor.

Technical Specifications

Microprocessors MPC880ZP66 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e0

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

66 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC880ZP66 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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