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Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.

Cordless Phone ICs

Available Parts 246

Part RoHS Manufacturer Description Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length
ST25R3916B-AQWT by STMicroelectronics

ST25R3916B-AQWT

STMicroelectronics

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

SC14CVMDECTSF02T by Renesas Electronics

SC14CVMDECTSF02T

Renesas Electronics

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3;

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

3

ST25R3917B-AQWT by STMicroelectronics

ST25R3917B-AQWT

STMicroelectronics

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

TA31161FN by Toshiba

TA31161FN

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

7.5 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-35 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TA31136F by Toshiba

TA31136F

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

4.6 mA

2 V

SMALL OUTLINE, SHRINK PITCH

85 Cel

-30 Cel

DUAL

R-PDSO-G16

Not Qualified

MC13156DWR2 by Motorola

MC13156DWR2

Motorola

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

-3 V

8 mA

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

15.395 mm

LMX3161VBHX by Texas Instruments

LMX3161VBHX

Texas Instruments

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.6 V

3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Other Telecom ICs

.5 mm

70 Cel

-10 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

e0

7 mm

LMX3161VBH by Texas Instruments

LMX3161VBH

Texas Instruments

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.6 V

3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Other Telecom ICs

.5 mm

70 Cel

-10 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

e0

7 mm

AD6190ARS by Analog Devices

AD6190ARS

Analog Devices

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BASEBAND CIRCUIT

OTHER

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

3.3

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

Other Telecom ICs

.65 mm

85 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G28

2 mm

5.3 mm

Not Qualified

e0

10.2 mm

AD6190ARSRL by Analog Devices

AD6190ARSRL

Analog Devices

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BASEBAND CIRCUIT

OTHER

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

3.3

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

Other Telecom ICs

.65 mm

85 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G28

2 mm

5.3 mm

Not Qualified

e0

10.2 mm

SAA1575HLBE by NXP Semiconductors

SAA1575HLBE

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

CORDLESS TELEPHONE BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

1.6 mm

14 mm

Not Qualified

14 mm

TEA1118M-T by NXP Semiconductors

TEA1118M-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

2.9 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

75 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

1.5 mm

4.4 mm

Not Qualified

e4

5.2 mm

PCD5090H-T by NXP Semiconductors

PCD5090H-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR; Terminal Position: QUAD;

CORDLESS TELEPHONE BASEBAND CIRCUIT

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

FLATPACK

.65 mm

QUAD

R-PQFP-G100

3.2 mm

14 mm

Not Qualified

20 mm

SA58640DK by NXP Semiconductors

SA58640DK

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

TEA1118T by NXP Semiconductors

TEA1118T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0014 mA

2.9 V

2.9

SMALL OUTLINE

SOP14,.25

Cordless Telephone ICs

1.27 mm

75 Cel

-25 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

e4

8.65 mm

935277002112 by NXP Semiconductors

935277002112

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

6.5 mm

TEA1118AT by NXP Semiconductors

TEA1118AT

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0014 mA

2.9 V

2.9

SMALL OUTLINE

SOP14,.25

Cordless Telephone ICs

1.27 mm

75 Cel

-25 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

e4

8.65 mm

UAA2077AM-T by NXP Semiconductors

UAA2077AM-T

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE SUPPORT CIRCUIT

OTHER

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

4 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

935237440112 by NXP Semiconductors

935237440112

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.9 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G16

1.5 mm

4.4 mm

Not Qualified

5.2 mm

TEA1118TD by NXP Semiconductors

TEA1118TD

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

1.6 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

8.65 mm

PCD5041H-T by NXP Semiconductors

PCD5041H-T

NXP Semiconductors

CORDLESS TELEPHONE BURST MODE CONTROLLER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BURST MODE CONTROLLER

OTHER

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

FLATPACK

1 mm

70 Cel

-25 Cel

QUAD

R-PQFP-G64

3.2 mm

14 mm

Not Qualified

20 mm

PCD50922H-T by NXP Semiconductors

PCD50922H-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Qualification: Not Qualified;

CORDLESS TELEPHONE BASEBAND CIRCUIT

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

TIN

QUAD

S-PQFP-G80

1.6 mm

12 mm

Not Qualified

e3

12 mm

PCD5041-T by NXP Semiconductors

PCD5041-T

NXP Semiconductors

CORDLESS TELEPHONE BURST MODE CONTROLLER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: RECTANGULAR; Qualification: Not Qualified;

CORDLESS TELEPHONE BURST MODE CONTROLLER

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

FLATPACK

1 mm

QUAD

R-PQFP-G64

3.2 mm

14 mm

Not Qualified

20 mm

PCD5043H-T by NXP Semiconductors

PCD5043H-T

NXP Semiconductors

CORDLESS TELEPHONE BURST MODE CONTROLLER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BURST MODE CONTROLLER

OTHER

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

FLATPACK

1 mm

70 Cel

-25 Cel

QUAD

R-PQFP-G64

3.2 mm

14 mm

Not Qualified

20 mm

935220640118 by NXP Semiconductors

935220640118

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.9 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G16

1.5 mm

4.4 mm

Not Qualified

5.2 mm

PCD50912H-T by NXP Semiconductors

PCD50912H-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Terminal Pitch: .5 mm;

CORDLESS TELEPHONE BASEBAND CIRCUIT

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

TIN

QUAD

S-PQFP-G80

1.6 mm

12 mm

Not Qualified

e3

12 mm

PCD5097H-T by NXP Semiconductors

PCD5097H-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR; No. of Functions: 1;

CORDLESS TELEPHONE BASEBAND CIRCUIT

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

FLATPACK

.65 mm

QUAD

R-PQFP-G100

3.2 mm

14 mm

Not Qualified

20 mm

935202550518 by NXP Semiconductors

935202550518

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LFQFP; Package Shape: SQUARE;

CORDLESS TELEPHONE SUPPORT CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

TIN

QUAD

S-PQFP-G32

1.6 mm

5 mm

Not Qualified

e3

5 mm

PCD5041HZ-T by NXP Semiconductors

PCD5041HZ-T

NXP Semiconductors

CORDLESS TELEPHONE BURST MODE CONTROLLER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE;

CORDLESS TELEPHONE BURST MODE CONTROLLER

OTHER

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

-25 Cel

QUAD

S-PQFP-G80

1.6 mm

12 mm

Not Qualified

12 mm

UAA2078M-T by NXP Semiconductors

UAA2078M-T

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-10 Cel

DUAL

R-PDSO-G16

1.5 mm

4.4 mm

Not Qualified

5.2 mm

935237450518 by NXP Semiconductors

935237450518

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.9 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

8.65 mm

TEA1118TD-T by NXP Semiconductors

TEA1118TD-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

1.6 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

8.65 mm

PCD5091HZ by NXP Semiconductors

PCD5091HZ

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: RECTANGULAR; Terminal Finish: TIN;

CORDLESS TELEPHONE BASEBAND CIRCUIT

GULL WING

100

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/3.3,5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

TIN

QUAD

R-PQFP-G100

1.6 mm

14 mm

Not Qualified

e3

14 mm

PCD5042H-T by NXP Semiconductors

PCD5042H-T

NXP Semiconductors

CORDLESS TELEPHONE BURST MODE CONTROLLER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BURST MODE CONTROLLER

OTHER

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

FLATPACK

1 mm

70 Cel

-25 Cel

QUAD

R-PQFP-G64

3.2 mm

14 mm

Not Qualified

20 mm

TEA1118AM-T by NXP Semiconductors

TEA1118AM-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

2.9 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G16

1.5 mm

4.4 mm

Not Qualified

5.2 mm

PCD5042HZ by NXP Semiconductors

PCD5042HZ

NXP Semiconductors

CORDLESS TELEPHONE BURST MODE CONTROLLER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE;

CORDLESS TELEPHONE BURST MODE CONTROLLER

OTHER

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.012 mA

3 V

3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

Cordless Telephone ICs

.5 mm

70 Cel

-25 Cel

QUAD

S-PQFP-G80

1.6 mm

12 mm

Not Qualified

12 mm

PCD5041HZ by NXP Semiconductors

PCD5041HZ

NXP Semiconductors

CORDLESS TELEPHONE BURST MODE CONTROLLER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE;

CORDLESS TELEPHONE BURST MODE CONTROLLER

OTHER

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

-25 Cel

QUAD

S-PQFP-G80

1.6 mm

12 mm

Not Qualified

12 mm

TEA1118AT-T by NXP Semiconductors

TEA1118AT-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

2.9 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

e4

8.65 mm

SAA1575HL/V2 by NXP Semiconductors

SAA1575HL/V2

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

CORDLESS TELEPHONE BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

1.6 mm

14 mm

Not Qualified

14 mm

935237450512 by NXP Semiconductors

935237450512

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.9 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

8.65 mm

UAA2078M by NXP Semiconductors

UAA2078M

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-10 Cel

DUAL

R-PDSO-G16

1.5 mm

4.4 mm

Not Qualified

5.2 mm

UAA2077AM by NXP Semiconductors

UAA2077AM

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE SUPPORT CIRCUIT

OTHER

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

4 V

4

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

SSOP20,.25

Other Telecom ICs

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

PCD50912H by NXP Semiconductors

PCD50912H

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Surface Mount: YES;

CORDLESS TELEPHONE BASEBAND CIRCUIT

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

Other Telecom ICs

.5 mm

TIN

QUAD

S-PQFP-G80

1.6 mm

12 mm

Not Qualified

e3

12 mm

TEA1118ATD by NXP Semiconductors

TEA1118ATD

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

1.6 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

8.65 mm

SA58640DK,112 by NXP Semiconductors

SA58640DK,112

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

CORDLESS TELEPHONE SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

6.5 mm

PCD5042HZ-T by NXP Semiconductors

PCD5042HZ-T

NXP Semiconductors

CORDLESS TELEPHONE BURST MODE CONTROLLER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE;

CORDLESS TELEPHONE BURST MODE CONTROLLER

OTHER

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

-25 Cel

QUAD

S-PQFP-G80

1.6 mm

12 mm

Not Qualified

12 mm

PCD5091H by NXP Semiconductors

PCD5091H

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR; Maximum Seated Height: 3.2 mm;

CORDLESS TELEPHONE BASEBAND CIRCUIT

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/3.3,5

FLATPACK

QFP100,.7X.9

Other Telecom ICs

.65 mm

TIN

QUAD

R-PQFP-G100

3.2 mm

14 mm

Not Qualified

e3

20 mm

PCD5092H by NXP Semiconductors

PCD5092H

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR; Package Style (Meter): FLATPACK;

CORDLESS TELEPHONE BASEBAND CIRCUIT

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/3.3,5

FLATPACK

QFP100,.7X.9

Other Telecom ICs

.65 mm

TIN

QUAD

R-PQFP-G100

3.2 mm

14 mm

Not Qualified

e3

20 mm