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Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.

Cordless Phone ICs

Available Parts 4

Part# Info Specs
Part RoHS Manufacturer Description JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Functions No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
SA58640DK,112 by NXP Semiconductors

SA58640DK,112

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

5 V

YES

CORDLESS TELEPHONE SUPPORT CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA58641DK,118 by NXP Semiconductors

SA58641DK,118

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

5 V

YES

CORDLESS TELEPHONE SUPPORT CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA58641DK,112 by NXP Semiconductors

SA58641DK,112

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

5 V

YES

CORDLESS TELEPHONE SUPPORT CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA58640DK,118 by NXP Semiconductors

SA58640DK,118

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

5 V

YES

CORDLESS TELEPHONE SUPPORT CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm