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Other Function Logic ICs

Other function logic ICs are electronic circuits that perform various logic functions beyond the basic logic gates and flip-flops. These ICs are designed to perform specific functions, such as encoding, decoding, multiplexing, demultiplexing, and signal conditioning.

Some of the commonly used other function logic ICs include:

1. Encoders: Encoders are digital circuits that convert a set of input signals into a coded output. They are commonly used in digital systems to encode data for transmission or storage. Encoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

2. Decoders: Decoders are digital circuits that convert a coded input into a set of output signals. They are commonly used in digital systems to decode data for processing or display. Decoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

3. Multiplexers: Multiplexers, also known as MUXs, are digital circuits that can select one of several input signals and transmit it to a single output line based on a control signal. They are commonly used in digital systems to reduce the number of transmission lines required to transmit multiple signals. Multiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

4. Demultiplexers: Demultiplexers, also known as DEMUXs, are digital circuits that can distribute a single input signal to one of several output lines based on a control signal. They are commonly used in digital systems to receive multiple signals transmitted over a single line. Demultiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

5. Comparators: Comparators are digital circuits that compare two input signals and produce a binary output signal indicating the relationship between the two inputs. They are commonly used in digital systems to compare digital values for control and decision-making purposes. Comparators can be designed using various technologies, including TTL, CMOS, and FPGAs.

Other function logic ICs are used in various applications, including digital signal processing, telecommunications, and data storage systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.

Other Function Logic ICs

Available Parts 1,462

Part RoHS Manufacturer Description Logic IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Schmitt Trigger Surface Mount No. of Functions Maximum Frequency At Nominal Supply Technology Screening Level No. of Inputs No. of Bits Packing Method Nominal Supply Voltage / Vsup (V) Power Supplies (V) Load Capacitance (CL) Package Style (Meter) Package Equivalence Code Propagation Delay (tpd) Maximum I (ol) Sub-Category Terminal Pitch Maximum Operating Temperature Count Direction Output Characteristics Trigger Type Minimum Operating Temperature Terminal Finish Terminal Position Minimum fmax JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Output Polarity Minimum Supply Voltage (Vsup) Maximum Power Supply Current (ICC) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Family
SN74LVC1G97DCKR by Texas Instruments

SN74LVC1G97DCKR

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

3

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

16.4 ns

32 Amp

Gates

.65 mm

125 Cel

3-STATE

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

.01 mA

e4

NOT SPECIFIED

260

2 mm

LVC/LCX/Z

NTE74LS259 by Nte Electronics

NTE74LS259

Nte Electronics

Other Logic ICs;

MAX6816EUS-T by Maxim Integrated

MAX6816EUS-T

Maxim Integrated

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: LSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

4

LSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5

3/5

SMALL OUTLINE, LOW PROFILE

TO-253

Other Logic ICs

1.92 mm

125 Cel

3-STATE

-40 Cel

TIN LEAD

DUAL

R-PDSO-G4

1

5.5 V

1.22 mm

1.3 mm

Not Qualified

2.7 V

e0

20

240

2.92 mm

6816

MAX6816EUS+T by Analog Devices

MAX6816EUS+T

Analog Devices

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: LSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

4

LSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5

3/5

SMALL OUTLINE, LOW PROFILE

TO-253

Other Logic ICs

1.92 mm

125 Cel

3-STATE

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G4

1

5.5 V

1.22 mm

1.3 mm

Not Qualified

2.7 V

e3

30

260

2.92 mm

6816

SN74LVC1G97DCKRG4 by Texas Instruments

SN74LVC1G97DCKRG4

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

3

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

16.4 ns

32 Amp

Gates

.65 mm

125 Cel

3-STATE

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

.01 mA

e4

NOT SPECIFIED

260

2 mm

LVC/LCX/Z

SN74LVC1G97DCKRE4 by Texas Instruments

SN74LVC1G97DCKRE4

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

3

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

16.4 ns

32 Amp

Gates

.65 mm

125 Cel

3-STATE

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

.01 mA

e4

NOT SPECIFIED

260

2 mm

LVC/LCX/Z

SN74LVC1G97DBVR by Texas Instruments

SN74LVC1G97DBVR

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

3

TR

1.8

3.3

50 pF

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

16.4 ns

32 Amp

Gates

.95 mm

125 Cel

3-STATE

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G6

1

5.5 V

1.45 mm

1.6 mm

Not Qualified

1.65 V

.01 mA

e4

NOT SPECIFIED

260

2.9 mm

LVC/LCX/Z

SN74LVC1G97DCKT by Texas Instruments

SN74LVC1G97DCKT

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

3

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

16.4 ns

32 Amp

Gates

.65 mm

125 Cel

3-STATE

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

.01 mA

e4

NOT SPECIFIED

260

2 mm

LVC/LCX/Z

MAX6816EUS-TG48 by Analog Devices

MAX6816EUS-TG48

Analog Devices

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: LSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

4

LSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5

SMALL OUTLINE, LOW PROFILE

1.92 mm

125 Cel

3-STATE

-40 Cel

DUAL

R-PDSO-G4

5.5 V

1.22 mm

1.3 mm

2.7 V

NOT SPECIFIED

NOT SPECIFIED

2.92 mm

6816

SN74LVC1G97DBVRE4 by Texas Instruments

SN74LVC1G97DBVRE4

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

3

TR

1.8

3.3

50 pF

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

16.4 ns

32 Amp

Gates

.95 mm

125 Cel

3-STATE

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G6

1

5.5 V

1.45 mm

1.6 mm

Not Qualified

1.65 V

.01 mA

e4

NOT SPECIFIED

260

2.9 mm

LVC/LCX/Z

SN74LVC1G97DBVRG4 by Texas Instruments

SN74LVC1G97DBVRG4

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

3

TR

1.8

3.3

50 pF

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

16.4 ns

32 Amp

Gates

.95 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G6

1

5.5 V

1.45 mm

1.6 mm

Not Qualified

1.65 V

.01 mA

e4

NOT SPECIFIED

260

2.9 mm

LVC/LCX/Z

MAX6817EUT-T by Maxim Integrated

MAX6817EUT-T

Maxim Integrated

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

BICMOS

5

3/5

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

Other Logic ICs

.95 mm

125 Cel

3-STATE

-40 Cel

TIN LEAD

DUAL

R-PDSO-G6

1

5.5 V

1.45 mm

1.625 mm

Not Qualified

2.7 V

e0

20

240

2.9 mm

6817

MAX6817EUT+T by Analog Devices

MAX6817EUT+T

Analog Devices

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

BICMOS

5

3/5

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

Other Logic ICs

.95 mm

125 Cel

3-STATE

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G6

1

5.5 V

1.45 mm

1.625 mm

Not Qualified

2.7 V

e3

30

260

2.9 mm

6817

SN74LVC1G97DCKTG4 by Texas Instruments

SN74LVC1G97DCKTG4

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

3

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

16.4 ns

32 Amp

Gates

.65 mm

125 Cel

3-STATE

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

.01 mA

e4

NOT SPECIFIED

260

2 mm

LVC/LCX/Z

SN74LVC1G97DBVT by Texas Instruments

SN74LVC1G97DBVT

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

3

TR

1.8

3.3

50 pF

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

16.4 ns

32 Amp

Gates

.95 mm

125 Cel

3-STATE

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G6

1

5.5 V

1.45 mm

1.6 mm

Not Qualified

1.65 V

.01 mA

e4

NOT SPECIFIED

260

2.9 mm

LVC/LCX/Z

SN74LVC1G97QDCKRQ1 by Texas Instruments

SN74LVC1G97QDCKRQ1

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

AEC-Q100

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

32 Amp

Gates

.65 mm

125 Cel

3-STATE

-40 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

TRUE

1.65 V

e3

30

260

2 mm

LVC/LCX/Z

74LVC1G97GW,125 by NXP Semiconductors

74LVC1G97GW,125

NXP Semiconductors

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

24 Amp

Gates

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e3

30

260

2 mm

LVC/LCX/Z

SN74LVC1G97DCKTE4 by Texas Instruments

SN74LVC1G97DCKTE4

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

24 Amp

Gates

.65 mm

85 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e4

30

260

2 mm

LVC/LCX/Z

4329 by Princeton Advanced Components

4329

Princeton Advanced Components

Other Logic ICs;

SN74LVC1G57DCKRE4 by Texas Instruments

SN74LVC1G57DCKRE4

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

24 Amp

Gates

.65 mm

85 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e4

30

260

2 mm

LVC/LCX/Z

SN74LVC1G97DCK3 by Texas Instruments

SN74LVC1G97DCK3

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

3

TR

1.8

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

16.4 ns

32 Amp

.65 mm

125 Cel

-40 Cel

Tin/Bismuth (Sn/Bi)

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

1.65 V

.01 mA

e6

30

260

2 mm

LVC/LCX/Z

74LVC1G57GW,125 by NXP Semiconductors

74LVC1G57GW,125

NXP Semiconductors

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

24 Amp

Gates

.65 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e3

30

260

2 mm

LVC/LCX/Z

MAX6817EUT-TG1K by Maxim Integrated

MAX6817EUT-TG1K

Maxim Integrated

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: SOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

BICMOS

5

SMALL OUTLINE

125 Cel

-40 Cel

DUAL

R-PDSO-G6

5.5 V

2.7 V

NOT SPECIFIED

NOT SPECIFIED

6817

SN74LS624N by Texas Instruments

SN74LS624N

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

TTL

5

IN-LINE

24 Amp

2.54 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T14

1

5.25 V

5.08 mm

7.62 mm

Not Qualified

4.75 V

55 mA

e4

19.305 mm

LS

SN74LVC1G97DRLR by Texas Instruments

SN74LVC1G97DRLR

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: FLAT; No. of Terminals: 6; Package Code: VSOF; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

FLAT

6

VSOF

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

3

TR

1.8

3.3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

FL6,.047,20

16.4 ns

32 Amp

Gates

.5 mm

125 Cel

3-STATE

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

DUAL

R-PDSO-F6

1

5.5 V

.6 mm

1.2 mm

Not Qualified

1.65 V

.01 mA

e4

NOT SPECIFIED

260

1.6 mm

LVC/LCX/Z

74LVC1G57GW-Q100H by Nexperia

74LVC1G57GW-Q100H

Nexperia

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

TR, 7 INCH

1.8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

1.65 V

e3

30

260

2 mm

LVC/LCX/Z

74LVC1G58GW,125 by NXP Semiconductors

74LVC1G58GW,125

NXP Semiconductors

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

24 Amp

Gates

.65 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e3

30

260

2 mm

LVC/LCX/Z

MAX6818EAP-T by Maxim Integrated

MAX6818EAP-T

Maxim Integrated

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

8

BICMOS

5

3/5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

Other Logic ICs

.65 mm

125 Cel

3-STATE

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

5.5 V

1.99 mm

5.29 mm

Not Qualified

2.7 V

e0

7.2 mm

6818

MAX6818EAP+T by Analog Devices

MAX6818EAP+T

Analog Devices

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5

3/5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

Other Logic ICs

.65 mm

125 Cel

3-STATE

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G20

1

5.5 V

1.99 mm

5.29 mm

Not Qualified

2.7 V

e3

30

260

7.2 mm

6816

NL7SZ97DFT2G by Onsemi

NL7SZ97DFT2G

Onsemi

LOGIC CIRCUIT; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

MILITARY

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

7

CMOS

TR

2.3

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

24 Amp

Gates

.65 mm

125 Cel

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e3

30

260

2 mm

674

74LVC1G57GW-Q100,125 by NXP Semiconductors

74LVC1G57GW-Q100,125

NXP Semiconductors

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G6

5.5 V

1.1 mm

1.25 mm

1.65 V

2 mm

LVC/LCX/Z

74LVC1G57GW by NXP Semiconductors

74LVC1G57GW

NXP Semiconductors

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

24 Amp

Gates

.65 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e3

30

260

2 mm

LVC/LCX/Z

74LVC1G97DW-7 by Diodes Incorporated

74LVC1G97DW-7

Diodes Incorporated

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

3.3

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

24 Amp

Gates

.65 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e3

30

260

2 mm

LVC/LCX/Z

74LVC1G97GW by NXP Semiconductors

74LVC1G97GW

NXP Semiconductors

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

PURE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

2 mm

LVC/LCX/Z

NL7SZ57DFT2G by Onsemi

NL7SZ57DFT2G

Onsemi

LOGIC CIRCUIT; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

MILITARY

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

7

CMOS

TR

2.3

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

24 Amp

Gates

.65 mm

125 Cel

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e3

30

260

2 mm

7S

SN74LVC1G97DRYR by Texas Instruments

SN74LVC1G97DRYR

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

3

TR, 7 INCH

3.3

3.3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

16.4 ns

32 Amp

Gates

.5 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-N6

1

5.5 V

.6 mm

1 mm

Not Qualified

1.65 V

.01 mA

e4

NOT SPECIFIED

260

1.45 mm

LVC/LCX/Z

SN74LVC1G97QDBVRQ1 by Texas Instruments

SN74LVC1G97QDBVRQ1

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

AEC-Q100

TR

1.8

3.3

50 pF

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

32 Amp

Gates

.95 mm

125 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G6

1

5.5 V

1.45 mm

1.6 mm

Not Qualified

TRUE

1.65 V

e4

30

260

2.9 mm

LVC/LCX/Z

74LVC1G57GV,125 by NXP Semiconductors

74LVC1G57GV,125

NXP Semiconductors

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSOP6,.11,37

24 Amp

Gates

.95 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.5 mm

Not Qualified

1.65 V

e3

30

260

2.9 mm

LVC/LCX/Z

74LVC1G58GW-Q100H by Nexperia

74LVC1G58GW-Q100H

Nexperia

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

TR, 7 INCH

1.8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

1.65 V

e3

30

260

2 mm

LVC/LCX/Z

609-4 by Datatronics

609-4

Datatronics

Other Logic ICs;

5495 by Teledyne E2v (Uk)

5495

Teledyne E2v (Uk)

Other Logic ICs;

SN74LVC1G97DBVTE4 by Texas Instruments

SN74LVC1G97DBVTE4

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

24 Amp

Gates

.95 mm

85 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G6

1

5.5 V

1.45 mm

1.6 mm

Not Qualified

1.65 V

e4

30

260

2.9 mm

LVC/LCX/Z

SN74LVC1G97DBVTG4 by Texas Instruments

SN74LVC1G97DBVTG4

Texas Instruments

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

3

TR

1.8

3.3

50 pF

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

16.4 ns

32 Amp

Gates

.95 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G6

1

5.5 V

1.45 mm

1.6 mm

Not Qualified

1.65 V

.01 mA

e4

NOT SPECIFIED

260

2.9 mm

LVC/LCX/Z

74LVC1G58GW-Q100,125 by NXP Semiconductors

74LVC1G58GW-Q100,125

NXP Semiconductors

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G6

5.5 V

1.1 mm

1.25 mm

1.65 V

2 mm

LVC/LCX/Z

MC14490DWG by Onsemi

MC14490DWG

Onsemi

LOGIC CIRCUIT; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

MILITARY

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6

CMOS

4

RAIL

5

5/15

SMALL OUTLINE

SOP16,.4

740 ns

Other Logic ICs

1.27 mm

125 Cel

RIGHT

POSITIVE EDGE

-55 Cel

MATTE TIN

DUAL

4.5 MHz

R-PDSO-G16

3

18 V

2.65 mm

7.5 mm

Not Qualified

TRUE

3 V

e3

30

260

10.3 mm

4000/14000/40000

74LVC1G58GW by NXP Semiconductors

74LVC1G58GW

NXP Semiconductors

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

24 Amp

Gates

.65 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e3

30

260

2 mm

LVC/LCX/Z

MAX6816EUS by Maxim Integrated

MAX6816EUS

Maxim Integrated

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: LSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

4

LSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5

3/5

SMALL OUTLINE, LOW PROFILE

TO-253

Other Logic ICs

1.92 mm

125 Cel

3-STATE

-40 Cel

TIN LEAD

DUAL

R-PDSO-G4

1

5.5 V

1.22 mm

1.3 mm

Not Qualified

2.7 V

e0

2.92 mm

6816

MAX6816EUS+ by Analog Devices

MAX6816EUS+

Analog Devices

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: SOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

4

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5

3/5

SMALL OUTLINE

TO-253

Other Logic ICs

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G4

1

5.5 V

Not Qualified

2.7 V

e3

30

260

6816