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NLX1G99CMX1TCG

Onsemi

NLX1G99CMX1TCG by Onsemi

NLX1G99CMX1TCG by Onsemi is a CMOS Schmitt Trigger IC with 25.7ns propagation delay, 50pF load capacitance, and 8A max I (ol). Ideal for military applications due to its MIL temperature grade, it operates b/w -55°C to 125°C and supports a supply voltage range of 1.65V to 5.5V.

Median Price

$0.178

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 132,000 parts In-Stock

1+ parts

-

100+ parts

$0.185

1k+ parts

$0.153

10k+ parts

$0.137

132,000

-

$0.185

$0.153

$0.137

Verical

USA . 75,000 parts In-Stock

1+ parts

-

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$0.171

75,000

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$0.171

Distributors (In-Stock)

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Digiode

USA . 1,581 parts In-Stock

1+ parts

$0.151

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1,581

$0.151

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Vyrian

USA . 7,285 parts In-Stock

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7,285

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Distributors (Availability)

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Corphita

USA . 962 parts In-Stock

1+ parts

$0.143

100+ parts

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962

$0.143

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Vigor

Singapore . 544 parts In-Stock

1+ parts

$0.150

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544

$0.150

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Corohmni

South Africa . 109 parts In-Stock

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$0.159

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109

$0.159

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AZTECH Wire

Italy . 896 parts In-Stock

1+ parts

$8.480

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896

$8.480

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Kulean Microsystems

USA . 8,060 parts In-Stock

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8,060

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TANS Electronics

Latvia . 4,498 parts In-Stock

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4,498

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Perfect Parts

USA . 3,332 parts In-Stock

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SupplyDigital Components

Austria . 2,015 parts In-Stock

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Microchip USA

USA . 499 parts In-Stock

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499

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UHIMA Technologies

Türkiye . 139 parts In-Stock

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Problanco Electronics

Mexico . 119 parts In-Stock

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Overview

Enhance your electronic projects with the NLX1G99CMX1TCG by Onsemi! This high-quality logic IC from a trusted manufacturer offers reliable performance and versatility for a wide range of applications. With a compact package design and low power consumption, this product provides exceptional value for customers seeking efficient and durable components. Upgrade your designs today with the NLX1G99CMX1TCG and experience the benefits of top-notch technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various operating conditions.

Propagation Delay At Nominal Supply: 25.7 ns

Low propagation delay ensures fast operation and responsiveness of the logic IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Nominal Supply Voltage / Vsup (V): 2.5

Optimal supply voltage ensures stable and reliable performance of the IC.

Load Capacitance (CL): 50 pF

Suitable load capacitance for efficient signal transfer and processing.

Power Supplies (V): 1.8/5

Support for multiple power supply voltages offers flexibility in design and integration.

No. of Terminals: 8

Sufficient number of terminals for connecting to external circuits and components.

Maximum I (ol): 8 Amp

High output current capability allows for driving external loads without additional circuitry.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliability in harsh environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enhancing flexibility in circuit design.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for reliable electrical connections and corrosion resistance.

Terminal Position: DUAL

Dual terminal position for enhanced stability and mechanical support.

Width: 1 mm

Compact width for space-saving integration in electronic devices.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage for energy-efficient operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable soldering during assembly.

Temperature Grade: MILITARY

Military-grade temperature range for reliable operation in rugged environments.

Schmitt Trigger: YES

Schmitt trigger input for noise immunity and signal shaping, ensuring reliable data transmission.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity in operation.

Terminal Form: NO LEAD

Lead-free terminal form for environmental and health safety compliance.

Terminal Pitch: 0.35 mm

Fine terminal pitch for compact design and high-density PCB layout.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage for compatibility with a wide range of power sources.

Technical Specifications

Other Function Logic ICs NLX1G99CMX1TCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

25.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX1G99CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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