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SN74ALVCH162260DGG

Texas Instruments

SN74ALVCH162260DGG by Texas Instruments

SN74ALVCH162260DGG by Texas Instruments is a CMOS logic IC with 56 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and comes in a small outline package suitable for industrial applications requiring high temperature tolerance. The Gull Wing terminals make it ideal for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,063 parts In-Stock

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4,063

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Digiode

USA . 2,625 parts In-Stock

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2,625

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 520 parts In-Stock

1+ parts

$13.119

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520

$13.119

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Parana Technologies

USA . 1,026 parts In-Stock

1+ parts

$15.805

100+ parts

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1k+ parts

$16.165

10k+ parts

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1,026

$15.805

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$16.165

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ChromeModa Solutions

Germany . 3,851 parts In-Stock

1+ parts

$17.758

100+ parts

$14.562

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3,851

$17.758

$14.562

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IDEA Electronic Components Group

UK . 1,105 parts In-Stock

1+ parts

$17.758

100+ parts

$16.870

1k+ parts

$15.982

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1,105

$17.758

$16.870

$15.982

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One Stop Electronics

USA . 224 parts In-Stock

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$24.000

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224

$24.000

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Corphita

USA . 2,132 parts In-Stock

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2,132

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DigiPath Technology Company

USA . 420 parts In-Stock

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$16.011

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420

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$16.011

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Overview

Unlock the power of innovative technology with Texas Instruments' SN74ALVCH162260DGG, a high-quality logic IC designed for various applications. With a focus on reliability and performance, this product offers customers unparalleled value and benefits. Whether you're working on industrial automation, communications equipment, or other electronic devices, this versatile component ensures seamless operation and efficiency. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Allows for easy and efficient placement on circuit boards for automated assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage which is widely available, ensuring compatibility with other components.

Maximum Operating Temperature: 85 °C

Capable of withstanding high temperatures, making it suitable for industrial applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Other Function Logic ICs SN74ALVCH162260DGG attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G56

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALVCH162260DGG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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