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SN74LVC1G97DCKRE4

Texas Instruments

SN74LVC1G97DCKRE4 by Texas Instruments

SN74LVC1G97DCKRE4 by Texas Instruments is a CMOS logic IC with 3 inputs, 9.3 ns propagation delay, and 16.4 ns tpd. It operates at a voltage of 1.8V to 5.5V and is ideal for automotive applications due to its Schmitt Trigger feature and small form factor (2x1.25 mm).

Median Price

$0.940

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 31,258 parts In-Stock

1+ parts

$0.940

100+ parts

$0.356

1k+ parts

$0.239

10k+ parts

$0.158

31,258

$0.940

$0.356

$0.239

$0.158

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.163

100+ parts

-

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-

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100

$0.163

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Digiode

USA . 1,517 parts In-Stock

1+ parts

$0.646

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-

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1,517

$0.646

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Chip Stock

USA . 125,840 parts In-Stock

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-

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125,840

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Vyrian

USA . 63,871 parts In-Stock

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63,871

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Distributors (Availability)

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Corohmni

South Africa . 1,042 parts In-Stock

1+ parts

$0.163

100+ parts

-

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1,042

$0.163

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Continental Prestige Electronics

USA . 6,224 parts In-Stock

1+ parts

$0.163

100+ parts

-

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$0.160

6,224

$0.163

-

-

$0.160

Argo Parts USA

USA . 4,268 parts In-Stock

1+ parts

$0.163

100+ parts

-

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-

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$0.158

4,268

$0.163

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-

$0.158

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.163

100+ parts

-

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1,000

$0.163

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Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$0.168

100+ parts

$0.159

1k+ parts

$0.159

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-

900

$0.168

$0.159

$0.159

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Modulus Dynamics

Lithuania . 900 parts In-Stock

1+ parts

$0.181

100+ parts

$0.179

1k+ parts

$0.174

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-

900

$0.181

$0.179

$0.174

-

Ampacity Inc.

Singapore . 63,915 parts In-Stock

1+ parts

$0.590

100+ parts

-

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63,915

$0.590

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Semicontronic

India . 63,831 parts In-Stock

1+ parts

$0.590

100+ parts

$0.575

1k+ parts

$0.572

10k+ parts

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63,831

$0.590

$0.575

$0.572

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Corphita

USA . 1,733 parts In-Stock

1+ parts

$0.612

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1,733

$0.612

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Parana Technologies

USA . 23 parts In-Stock

1+ parts

$18.278

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$18.410

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23

$18.278

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$18.410

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DigiPath Technology Company

USA . 324 parts In-Stock

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$20.126

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324

$20.126

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ChromeModa Solutions

Germany . 2,696 parts In-Stock

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$20.537

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$16.840

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2,696

$20.537

$16.840

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IDEA Electronic Components Group

UK . 1,086 parts In-Stock

1+ parts

$20.537

100+ parts

$19.510

1k+ parts

$18.483

10k+ parts

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1,086

$20.537

$19.510

$18.483

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Infinite Electronics LLP (Excess)

. 12,154 parts In-Stock

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Formix International (Excess)

India . 10,000 parts In-Stock

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Microchip USA

USA . 2,220 parts In-Stock

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Perfect Parts

USA . 1,660 parts In-Stock

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1,660

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

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$6.784

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$6.784

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$6.784

100

-

$6.784

$6.784

$6.784

Overview

Unleashing the power of innovation, Texas Instruments presents the SN74LVC1G97DCKRE4 - a cutting-edge logic IC designed to elevate your projects to new heights. With a focus on quality and precision, this product boasts a versatile range of applications in various industries. From automotive to consumer electronics, this compact yet powerful device offers unparalleled performance and reliability. Experience the value of Texas Instruments' expertise and revolutionize your designs with the SN74LVC1G97DCKRE4 today.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and protection for the internal components, making it suitable for various applications.

Propagation Delay At Nominal Supply

9.3 ns - Offers fast signal processing, ensuring efficient operation in time-sensitive applications.

Surface Mount

YES - Allows for easy installation on PCBs, saving space and simplifying the assembly process.

No. of Inputs

3 - Offers versatility in design by allowing multiple input signals to be processed simultaneously.

Nominal Supply Voltage / Vsup (V)

1.8 - Operates efficiently at a low voltage, reducing power consumption and heat generation.

Load Capacitance (CL)

50 pF - Supports the connection of external components without compromising signal integrity.

Power Supplies (V)

3.3 - Compatible with common power sources, ensuring ease of integration into existing systems.

No. of Terminals

6 - Facilitates simple interfacing with external devices, enhancing connectivity options.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Enables compact and space-saving design layouts for tightly constrained environments.

Maximum I (ol)

32 Amp - Allows for high output current, supporting robust signal transmission and driving capability.

Propagation Delay (tpd)

16.4 ns - Offers quick response times, crucial for time-critical applications that require rapid decision-making.

Maximum Operating Temperature

125 °C - Ensures reliable operation even in high-temperature environments, making it suitable for a wide range of applications.

Output Characteristics

3-STATE - Provides flexibility in controlling the output status, enabling efficient signal routing and management.

Minimum Operating Temperature

40 °C - Can operate in extreme cold conditions, making it suitable for both indoor and outdoor applications.

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au) - Offers corrosion resistance and high conductivity for reliable performance over time.

Terminal Position

DUAL - Allows for versatile mounting options to suit different PCB layouts and configurations.

Maximum Seated Height

1.1 mm - Offers a low-profile design, ideal for applications with height constraints or where space is limited.

Width

1.25 mm - Compact dimensions enable efficient use of PCB space and support miniaturization of electronic devices.

Minimum Supply Voltage (Vsup)

1.65 V - Supports operation at low voltages, extending battery life and reducing power consumption.

Peak Reflow Temperature °C

260 - Withstands high-temperature reflow soldering processes, ensuring reliable and secure connections during manufacturing.

Length

2 mm - Compact size and dimensions make it suitable for applications with space constraints or where size reduction is crucial.

Temperature Grade

AUTOMOTIVE - Meets automotive industry standards for reliability, durability, and performance in harsh environmental conditions.

Schmitt Trigger

YES - Provides hysteresis for noise immunity, ensuring stable and reliable operation in noisy environments.

Technology

CMOS - Offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form

GULL WING - Facilitates easy soldering onto PCBs, ensuring secure and reliable electrical connections.

Packing Method

TR - Provides convenient packaging for handling, transportation, and storage, protecting the product from damage or contamination.

Terminal Pitch

0.65 mm - Allows for precise and reliable connections on PCBs, ensuring signal integrity and electrical performance.

Maximum Supply Voltage (Vsup)

5.5 V - Accommodates a wide range of input voltage levels, making it versatile for various power supply configurations.

Maximum Power Supply Current (ICC)

0.01 mA - Provides low power consumption, ideal for battery-operated or energy-efficient devices.

Technical Specifications

Other Function Logic ICs SN74LVC1G97DCKRE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

9.3 ns

Propagation Delay (tpd):

16.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G97DCKRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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