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SN74LVC1G57DCKRE4

Texas Instruments

SN74LVC1G57DCKRE4 by Texas Instruments

SN74LVC1G57DCKRE4 by Texas Instruments is a CMOS logic IC with 6.3 ns propagation delay, 50 pF load capacitance, and 24 Amp max I (ol). It is used in industrial applications for its Schmitt Trigger feature and operates at temperatures ranging from -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,245 parts In-Stock

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Vyrian

USA . 2,873 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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Parana Technologies

USA . 2,017 parts In-Stock

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$7.338

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$7.830

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$7.338

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$7.830

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Ampacity Inc.

Singapore . 836 parts In-Stock

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$8.000

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836

$8.000

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DigiPath Technology Company

USA . 1,896 parts In-Stock

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$8.080

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$8.080

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ChromeModa Solutions

Germany . 4,997 parts In-Stock

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$8.245

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$6.761

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$8.245

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IDEA Electronic Components Group

UK . 2,281 parts In-Stock

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$8.245

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$7.420

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AZTECH Wire

Italy . 241 parts In-Stock

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$10.273

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Corohmni

South Africa . 81 parts In-Stock

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$13.318

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$20.785

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$19.746

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One Stop Electronics

USA . 923 parts In-Stock

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$51.000

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Semicontronic

India . 1,569 parts In-Stock

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$55.000

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$53.625

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$53.350

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Continental Prestige Electronics

USA . 5,150 parts In-Stock

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Argo Parts USA

USA . 4,621 parts In-Stock

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Corphita

USA . 3,938 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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$19.075

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$19.075

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$19.075

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Unlock the power of innovation with the SN74LVC1G57DCKRE4 by Texas Instruments. Known for their superior quality and reliable performance, Texas Instruments delivers cutting-edge solutions in the Other Function Logic ICs category. This versatile IC offers a wide range of applications, providing customers with unparalleled value and flexibility. Experience faster processing speeds and enhanced efficiency with this compact and durable product. Elevate your designs with Texas Instruments and discover a world of endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic IC, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay allows for fast signal processing, making the IC suitable for high-speed applications.

Surface Mount: YES

Ease of installation and compatibility with modern PCB assembly techniques.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low voltage, reducing power consumption and heat generation.

Maximum I (ol): 24 Amp

High output current capability ensures the IC can drive heavy loads without issues.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments where temperature and environmental conditions can be harsh.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Other Function Logic ICs SN74LVC1G57DCKRE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74LVC1G57DCKRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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