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SN74LS448NP1

Texas Instruments

SN74LS448NP1 by Texas Instruments

SN74LS448NP1 by Texas Instruments is a TTL logic IC with 20 terminals, operating at 5V. It has a rectangular package made of plastic/epoxy, suitable for commercial temperature grades. This IC is commonly used in applications requiring other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,672 parts In-Stock

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2,672

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Digiode

USA . 1,525 parts In-Stock

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1,525

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Distributors (Availability)

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AZTECH Wire

Italy . 783 parts In-Stock

1+ parts

$9.702

100+ parts

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783

$9.702

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Parana Technologies

USA . 226 parts In-Stock

1+ parts

$22.491

100+ parts

-

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$23.159

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226

$22.491

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$23.159

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DigiPath Technology Company

USA . 1,761 parts In-Stock

1+ parts

$24.766

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1,761

$24.766

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IDEA Electronic Components Group

UK . 2,276 parts In-Stock

1+ parts

$25.271

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$24.007

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$22.744

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2,276

$25.271

$24.007

$22.744

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ChromeModa Solutions

Germany . 305 parts In-Stock

1+ parts

$25.271

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$20.722

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305

$25.271

$20.722

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One Stop Electronics

USA . 869 parts In-Stock

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$56.000

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869

$56.000

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Corphita

USA . 2,105 parts In-Stock

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2,105

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Overview

Unlock endless possibilities with the SN74LS448NP1 by Texas Instruments, a cutting-edge Other Function Logic IC that promises reliability and superior performance. Manufactured by industry-leader Texas Instruments, this IC boasts a durable plastic/epoxy package body and a rectangular shape for easy integration. With a nominal supply voltage of 5V, this IC is versatile and suitable for a wide range of applications. From automation to consumer electronics, the SN74LS448NP1 offers unmatched value and benefits to customers seeking efficiency and innovation in their projects. Choose Texas Instruments for quality you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and protection for the internal components of the logic IC, making it reliable for long-term use.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power supplies, making it easy to integrate into existing circuit designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this logic IC can handle high temperature environments without compromising performance, increasing its versatility.

Technology: TTL

The use of TTL (Transistor-Transistor Logic) technology provides fast switching speeds and low power consumption, making it suitable for a wide range of applications requiring high performance.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy and secure soldering onto PCBs, ensuring stable connections and ease of assembly in electronic circuits.

Technical Specifications

Other Function Logic ICs SN74LS448NP1 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS448NP1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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