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MC14490P

Onsemi

MC14490P by Onsemi

MC14490P by Onsemi is a CMOS IC with 6 functions, 4-bit resolution, and 740ns propagation delay. It operates at supply voltages of 5/15V and has a temperature range of -55 to 125°C. Ideal for military-grade applications requiring true output polarity in an inline package style.

Median Price

$6.130

Lifecycle Status

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Overview

Upgrade your electronic designs with the MC14490P by Onsemi, a top-of-the-line Other Function Logic IC. With a trusted manufacturer like Onsemi behind it, this product offers exceptional quality and reliability. Ideal for a variety of applications, this IC provides customers with unmatched value, benefits, and advantages. Say goodbye to performance worries and hello to seamless operation with the MC14490P.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic IC, ensuring a longer lifespan.

No. of Functions: 6

Offers versatility and flexibility in performing different logic operations within a single IC.

Package Shape: RECTANGULAR

Easy to integrate into various circuit layouts and designs.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply requirement, compatible with many power sources.

Propagation Delay (tpd): 740 ns

Fast signal processing speed, ideal for time-sensitive applications.

Temperature Grade: MILITARY

Designed to withstand harsh environmental conditions, making it suitable for military or industrial applications.

Technical Specifications

Other Function Logic ICs MC14490P attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Propagation Delay (tpd):

740 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Minimum fmax:

4.5 MHz

Trade Compliance

MC14490P Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-060-6366, 5962010606366, 5962-99-256-2299, 5962992562299

NIIN

010606366, 992562299

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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