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MC14490L

Onsemi

MC14490L by Onsemi

MC14490L by Onsemi is a CMOS IC with 16 terminals, operating from -55 to 125 °C. It has dual tin/lead finish and supports power supplies of 5/15V. This rectangular ceramic package is ideal for military applications requiring reliable logic functions.

Median Price

$2.600

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

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Vyrian

USA . 1,280 parts In-Stock

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Digiode

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Pegasus Components GmbH

Germany . 34 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

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ComSIT Distribution GmbH

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R&J Components

USA . 7 parts In-Stock

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Florida Circuit

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Resion

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Sogenti Electronics

Canada . 5 parts In-Stock

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Speed Components Ltd

Israel . 4 parts In-Stock

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First Choice Components Inc.

USA . 3 parts In-Stock

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ECAB

Sweden . 2 parts In-Stock

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Manoshevitz Elec. Sales

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Mil-Aero Solutions, Inc.

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PAR Electronics

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Odintec Ltd.

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MISTER SPROCKETS

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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SupplyDigital Components

Austria . 4,702 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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Corphita

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UHIMA Technologies

Türkiye . 939 parts In-Stock

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TANS Electronics

Latvia . 658 parts In-Stock

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Kepictronics

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Corohmni

South Africa . 116 parts In-Stock

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Perfect Parts

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A-Plus Industry Inc.

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Overview

Upgrade your electronic projects with the MC14490L from Onsemi, a top-tier manufacturer known for its quality and innovation. This versatile logic IC offers a wide range of applications in various industries, providing unparalleled reliability and performance. With a MILITARY temperature grade and CMOS technology, this product ensures superior functionality even in harsh conditions. Elevate your designs with the MC14490L and experience the unbeatable value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers excellent thermal conductivity and stability, making it suitable for high temperature environments.

Power Supplies (V): 5/15

Offers flexibility in power supply options, allowing compatibility with a range of systems that operate at either 5V or 15V.

No. of Terminals: 16

Sufficient number of terminals for connecting to various external components and peripherals, enhancing the versatility of the product.

Package Style (Meter): IN-LINE

In-line package style allows for easy integration into circuits and saves space on PCBs, aiding in compact designs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -55 °C

Wide operating temperature range ensures functionality in both extreme cold and hot conditions, increasing the product's reliability.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and conductivity, simplifying the assembly process for electronics manufacturers.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for various applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, reducing the risk of loose connections or solder joint failures in challenging environments.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54mm allows for easy alignment and soldering on PCBs, facilitating the manufacturing and assembly processes.

Technical Specifications

Other Function Logic ICs MC14490L attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

MC14490L Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-142-0566, 5962011420566, 5962-01-060-6366, 5962010606366

NIIN

011420566, 010606366

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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