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74LVC1G57GW,125

NXP Semiconductors

74LVC1G57GW,125 by NXP Semiconductors

74LVC1G57GW,125 by NXP Semiconductors is a CMOS logic IC with a propagation delay of 7.9 ns and a load capacitance of 50 pF. It is commonly used in automotive applications due to its small size (1.25mm width) and high temperature tolerance (up to 125°C).

Median Price

$0.104

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 833 parts In-Stock

1+ parts

$0.228

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$0.114

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$0.093

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833

$0.228

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Arrow

USA . 141,000 parts In-Stock

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Verical

USA . 141,000 parts In-Stock

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Rochester

USA . 96,513 parts In-Stock

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$0.087

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DigiKey

USA . 96,513 parts In-Stock

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Future Electronics

Canada . 96,000 parts In-Stock

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EBV Elektronik

Germany . 75,000 parts In-Stock

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TTI

USA . 51,000 parts In-Stock

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Chip1Stop

Japan . 12,000 parts In-Stock

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RS (Exports)

UK . 2,500 parts In-Stock

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2,500

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Element14

Singapore . 1,610 parts In-Stock

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$0.106

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Farnell

UK . 893 parts In-Stock

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893

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Distributors (In-Stock)

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Digiode

USA . 4,690 parts In-Stock

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$0.037

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$0.037

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TME

Poland . 4,705 parts In-Stock

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$0.100

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$0.055

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$0.044

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$0.043

4,705

$0.100

$0.055

$0.044

$0.043

Nova Conductors

Japan . 81 parts In-Stock

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Maritex

Poland . 5,994 parts In-Stock

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$2.278

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$0.524

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$2.278

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$0.524

IBS Electronics

USA . 534,000 parts In-Stock

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NAC Semi

USA . 189,000 parts In-Stock

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Chip Stock

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Bristol Electronics

USA . 19,595 parts In-Stock

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Vyrian

USA . 6,780 parts In-Stock

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Sensible Micro Corp

USA . 5,655 parts In-Stock

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Anansix

USA . 2,821 parts In-Stock

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VNN

France . 1,266 parts In-Stock

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Semi Source

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Prism Electronics

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Semicontronic

India . 52,012 parts In-Stock

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Ampacity Inc.

Singapore . 24,609 parts In-Stock

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Corphita

USA . 2,646 parts In-Stock

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Component Stockers USA

USA . 178,734 parts In-Stock

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AZTECH Wire

Italy . 8,298 parts In-Stock

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Argo Parts USA

USA . 4,513 parts In-Stock

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$0.097

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Netroflash

USA . 2,000 parts In-Stock

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$0.095

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$0.093

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$0.100

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$0.093

Continental Prestige Electronics

USA . 2,535 parts In-Stock

1+ parts

$0.447

100+ parts

$0.166

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$0.085

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$0.057

2,535

$0.447

$0.166

$0.085

$0.057

Aztec Data Supply Inc.

USA . 2,750 parts In-Stock

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$15.240

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$15.240

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Advanced Electronics

New Zealand . 52 parts In-Stock

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$25.852

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$24.559

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$25.852

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Corohmni

South Africa . 683 parts In-Stock

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$26.806

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Perfect Parts

USA . 433,490 parts In-Stock

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GreenTree Electronics

Israel . 51,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 19,421 parts In-Stock

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Glotronic Ltd.

UK . 12,000 parts In-Stock

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iodParts Technologies Inc.

India . 8,205 parts In-Stock

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S.R.D Solutions

India . 6,000 parts In-Stock

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UNI Independent Distributors

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Eastek

USA . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Formix International (Excess)

India . 1,252 parts In-Stock

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Supply Digital

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Robosynatics

Brazil . 175 parts In-Stock

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Lucentia Tech

USA . 175 parts In-Stock

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$32.495

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$31.832

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$31.832

175

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$31.832

$31.832

Overview

Experience superior quality and performance with the 74LVC1G57GW,125 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors ensures top-notch reliability and innovation. This versatile logic IC is perfect for various applications, offering exceptional value and benefits to customers. Its small outline and thin profile package shape make it easy to integrate into any design. With a low propagation delay and high maximum operating temperature, this product guarantees efficient and reliable operation. Whether you're in the automotive or electronics industry, the 74LVC1G57GW,125 will exceed your expectations. Upgrade your projects today with this cutting-edge solution from NXP Semiconductors!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This product's package body material ensures durability and protection for the internal components, making it a reliable choice.

Propagation Delay At Nominal Supply:

7.9 ns - With a low propagation delay, this product facilitates fast and efficient data processing, making it suitable for time-sensitive applications.

Surface Mount:

YES - The surface mount capability of this product makes it easy to integrate into circuit boards, simplifying production and assembly processes.

No. of Functions:

1 - This product features a single function, ensuring simplicity and focus in its use.

Package Shape:

RECTANGULAR - The rectangular package shape allows for efficient space utilization, making it suitable for compact electronic designs.

Nominal Supply Voltage / Vsup (V):

1.8 - The low nominal supply voltage of this product enables energy-efficient operation, reducing power consumption.

Load Capacitance (CL):

50 pF - With a moderate load capacitance, this product can handle a range of electrical loads, offering versatility in various applications.

Power Supplies (V):

3.3 - The product's power supply voltage of 3.3V ensures compatibility with commonly available power sources in many electronic devices.

No. of Terminals:

6 - With only six terminals, this product simplifies circuit connections, contributing to a streamlined and straightforward installation process.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - The small outline, thin profile, and shrink pitch package style make this product suitable for compact and space-constrained designs.

Maximum I (ol):

24 Amp - With a high maximum output current of 24 Amps, this product can handle demanding loads, making it suitable for power-intensive applications.

Maximum Operating Temperature:

125 °C - The high maximum operating temperature of 125°C ensures the product can withstand harsh environmental conditions, enhancing its reliability in diverse applications.

Minimum Operating Temperature:

40 °C - With a low minimum operating temperature of -40°C, this product remains functional even in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Finish:

Tin (Sn) - The tin terminal finish provides a reliable electrical connection and corrosion resistance, ensuring long-term performance and durability.

Terminal Position:

DUAL - The dual terminal position of this product allows for flexibility in circuit board layout and wire connections, facilitating ease of use in various applications.

Maximum Seated Height:

1.1 mm - The low maximum seated height of 1.1mm contributes to compact and space-saving designs, making it suitable for small electronic devices.

Width:

1.25 mm - The narrow width of this product enables efficient space utilization, especially in tight or limited design layouts.

Minimum Supply Voltage (Vsup):

1.65 V - The low minimum supply voltage ensures compatibility with a wide range of power sources and helps optimize energy efficiency.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time at peak reflow temperature of 30 seconds provides a sufficient timeframe for proper soldering during assembly processes, ensuring reliable connections.

Peak Reflow Temperature °C:

260 - This product's peak reflow temperature of 260°C aligns with industry standards, facilitating standardized manufacturing processes.

Length:

2 mm - The compact length of this product contributes to space-saving design options, making it suitable for miniaturized electronic devices.

Temperature Grade:

AUTOMOTIVE - The automotive temperature grade qualification ensures this product can withstand the demanding thermal conditions commonly experienced in automotive applications.

Schmitt Trigger:

YES - The presence of a Schmitt trigger in this product enhances noise immunity and signal stability, making it ideal for applications with varying signal inputs.

Technology:

CMOS - The CMOS technology employed in this product provides low power consumption, high noise immunity, and fast switching speeds, making it a reliable and efficient choice.

Terminal Form:

GULL WING - The gull wing terminal form enhances solderability and robustness, ensuring secure and reliable connections in demanding operating environments.

Packing Method:

TR - The tape and reel (TR) packing method simplifies handling, storage, and automated assembly, improving production efficiency and reducing handling errors.

Terminal Pitch:

0.65 mm - The narrow terminal pitch of 0.65mm facilitates compact designs and allows for more compact circuit board layouts, enabling space optimization.

Moisture Sensitivity Level (MSL):

1 - With a moisture sensitivity level of 1, this product has a low susceptibility to moisture-related issues, ensuring its reliability and longevity.

Maximum Supply Voltage (Vsup):

5.5 V - The high maximum supply voltage capability of 5.5V allows for compatibility with various power sources and system requirements, providing flexibility in different applications.

Technical Specifications

Other Function Logic ICs 74LVC1G57GW,125 attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1G57GW,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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