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SN75324N3

Texas Instruments

SN75324N3 by Texas Instruments

SN75324N3 by Texas Instruments is a 14-terminal logic IC with bipolar technology. It operates b/w 0°C to 70°C, making it suitable for commercial applications. The package style is in-line rectangular plastic/epoxy, ideal for through-hole mounting at a pitch of 2.54mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,402 parts In-Stock

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3,402

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Digiode

USA . 2,739 parts In-Stock

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2,739

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 561 parts In-Stock

1+ parts

$14.060

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561

$14.060

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Parana Technologies

USA . 429 parts In-Stock

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$26.431

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$27.015

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429

$26.431

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$27.015

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DigiPath Technology Company

USA . 2,032 parts In-Stock

1+ parts

$29.104

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2,032

$29.104

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ChromeModa Solutions

Germany . 4,820 parts In-Stock

1+ parts

$29.698

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$24.352

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4,820

$29.698

$24.352

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IDEA Electronic Components Group

UK . 2,088 parts In-Stock

1+ parts

$29.698

100+ parts

$28.213

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$26.728

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2,088

$29.698

$28.213

$26.728

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One Stop Electronics

USA . 525 parts In-Stock

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$31.000

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525

$31.000

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Corphita

USA . 1,623 parts In-Stock

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1,623

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Overview

Unlock the potential of your electronic projects with the SN75324N3 by Texas Instruments. Manufactured by a trusted industry leader, this high-quality Other Function Logic IC offers unmatched reliability and performance. From consumer electronics to industrial applications, this versatile component provides seamless integration and optimal functionality. Experience the value and benefits of superior technology with the SN75324N3, designed to exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and ensuring longevity.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into various electronic systems.

No. of Terminals: 14

With 14 terminals, this product offers flexibility in connectivity options and can accommodate multiple input/output signals.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to fit into existing circuit designs and installations.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: 0 °C

The product can operate efficiently at low temperatures down to 0°C, ensuring reliability in various environmental conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in wiring configurations, enhancing the reliability of the product.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that the product can be used in standard commercial applications without any performance issues.

Technology: BIPOLAR

Bipolar technology enables fast switching speeds and high noise immunity, making the product suitable for complex logic operations.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections to the circuit board, ensuring stable performance in demanding applications.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy soldering and connection to standard PCB layouts, facilitating quick and efficient assembly.

Technical Specifications

Other Function Logic ICs SN75324N3 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Other Logic ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN75324N3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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