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SN75430N3

Texas Instruments

SN75430N3 by Texas Instruments

SN75430N3 by Texas Instruments is a 14-terminal IC with bipolar technology. It operates b/w 0°C to 70°C, making it suitable for commercial applications. The package style is in-line rectangular plastic/epoxy, ideal for various other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,407 parts In-Stock

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4,407

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Digiode

USA . 3,412 parts In-Stock

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3,412

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 815 parts In-Stock

1+ parts

$16.553

100+ parts

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815

$16.553

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One Stop Electronics

USA . 1,612 parts In-Stock

1+ parts

$17.000

100+ parts

-

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1,612

$17.000

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Parana Technologies

USA . 1,865 parts In-Stock

1+ parts

$17.100

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$17.316

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1,865

$17.100

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$17.316

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DigiPath Technology Company

USA . 1,838 parts In-Stock

1+ parts

$18.829

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1,838

$18.829

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ChromeModa Solutions

Germany . 1,887 parts In-Stock

1+ parts

$19.213

100+ parts

$15.755

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1,887

$19.213

$15.755

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IDEA Electronic Components Group

UK . 99 parts In-Stock

1+ parts

$19.213

100+ parts

$18.252

1k+ parts

$17.292

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99

$19.213

$18.252

$17.292

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Corphita

USA . 3,258 parts In-Stock

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3,258

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Overview

Enhance the performance of your electronic projects with the SN75430N3 by Texas Instruments. This high-quality logic IC offers reliable functionality and durability, thanks to its superior manufacturing standards. Ideal for a wide range of applications in the electronics industry, this product provides unparalleled value and benefits to customers seeking top-notch performance at an affordable price. Upgrade your projects today with the SN75430N3 and experience the advantages of working with a trusted brand like Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and resistant to damage, ensuring the product's longevity.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs and PCB layouts.

No. of Terminals: 14

Having 14 terminals provides ample connection options for various components and configurations.

Package Style (Meter): IN-LINE

In-line package style makes it convenient to position and connect within a circuit layout.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can operate reliably in various environments.

Minimum Operating Temperature: 0 °C

Ability to operate in temperatures as low as 0°C ensures versatility and performance in different conditions.

Terminal Position: DUAL

Dual terminal positions offer flexibility and convenience for connecting the product to other components.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates performance and reliability for standard commercial applications.

Technology: BIPOLAR

Bipolar technology ensures efficient operation and compatibility with a wide range of systems and circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and stable connections to the circuit board.

Terminal Pitch: 2.54 mm

With a pitch of 2.54mm, it allows for easy mounting and soldering on a standard PCB.

Technical Specifications

Other Function Logic ICs SN75430N3 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Other Logic ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN75430N3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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