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SN74AUP1G99YEPR

Texas Instruments

SN74AUP1G99YEPR by Texas Instruments

SN74AUP1G99YEPR by Texas Instruments is a CMOS logic IC with 36.1ns propagation delay at 1.2V, suitable for industrial applications. It features a 3-STATE output, operates b/w -40 to 85°C, and has a max supply voltage of 3.6V. With a very thin profile and fine pitch package style, it offers Schmitt Trigger functionality and can handle up to 30pF load capacitance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,574 parts In-Stock

1+ parts

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5,574

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Digiode

USA . 525 parts In-Stock

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525

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,061 parts In-Stock

1+ parts

$10.072

100+ parts

-

1k+ parts

$10.625

10k+ parts

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1,061

$10.072

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$10.625

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AZTECH Wire

Italy . 679 parts In-Stock

1+ parts

$10.837

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-

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679

$10.837

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DigiPath Technology Company

USA . 2,001 parts In-Stock

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$11.091

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2,001

$11.091

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IDEA Electronic Components Group

UK . 1,616 parts In-Stock

1+ parts

$11.317

100+ parts

$10.751

1k+ parts

$10.185

10k+ parts

-

1,616

$11.317

$10.751

$10.185

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ChromeModa Solutions

Germany . 1,444 parts In-Stock

1+ parts

$11.317

100+ parts

$9.280

1k+ parts

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1,444

$11.317

$9.280

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One Stop Electronics

USA . 152 parts In-Stock

1+ parts

$22.000

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152

$22.000

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Corphita

USA . 3,124 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the SN74AUP1G99YEPR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. This versatile logic IC is perfect for a wide range of applications, offering unmatched performance and reliability. With a low nominal supply voltage of 1.2V and advanced features like Schmitt Trigger and 3-STATE output characteristics, this product provides exceptional value to customers looking for high-quality solutions. Trust Texas Instruments to bring innovation to your projects and take them to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and heat resistance, ensuring the reliability of the product.

Propagation Delay At Nominal Supply: 36.1 ns

The low propagation delay allows for fast response times in logic operations, making this product suitable for applications requiring quick signal processing.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving space on the PCB and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 1.2

The low supply voltage requirement of 1.2V makes this product energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With an industrial temperature grade and high maximum operating temperature, this product can withstand harsh environmental conditions and extended use.

Technical Specifications

Other Function Logic ICs SN74AUP1G99YEPR attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PBGA-B8

Length:

1.9 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

36.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.5 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

SN74AUP1G99YEPR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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