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SNC54LS442J

Texas Instruments

SNC54LS442J by Texas Instruments

SNC54LS442J by Texas Instruments is a MIL-STD-883 Class B (Modified) TTL logic IC with 20 terminals and a supply voltage of 5V. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications requiring reliable performance in harsh environments. The package style is IN-LINE, with a CERAMIC body material ensuring durability and stability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,391 parts In-Stock

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7,391

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Digiode

USA . 2,730 parts In-Stock

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2,730

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Distributors (Availability)

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AZTECH Wire

Italy . 442 parts In-Stock

1+ parts

$15.767

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442

$15.767

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Parana Technologies

USA . 1,617 parts In-Stock

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$16.619

100+ parts

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1k+ parts

$16.891

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1,617

$16.619

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$16.891

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ChromeModa Solutions

Germany . 5,525 parts In-Stock

1+ parts

$18.673

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$15.312

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5,525

$18.673

$15.312

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IDEA Electronic Components Group

UK . 1,921 parts In-Stock

1+ parts

$18.673

100+ parts

$17.739

1k+ parts

$16.806

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1,921

$18.673

$17.739

$16.806

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One Stop Electronics

USA . 598 parts In-Stock

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$48.000

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598

$48.000

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Corphita

USA . 4,874 parts In-Stock

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4,874

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DigiPath Technology Company

USA . 753 parts In-Stock

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$16.836

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753

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$16.836

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Overview

Elevate your circuit design with the SNC54LS442J by Texas Instruments, a top-tier manufacturer known for producing high-quality electronic components. This Other Function Logic IC offers unmatched reliability and performance in a MILITARY grade package. Perfect for applications requiring precision and durability, this IC operates flawlessly within a wide temperature range. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations, providing you with the value and advantage you need to stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal properties, allowing for efficient heat dissipation and high reliability in demanding environments.

Screening Level: MIL-STD-883 Class B (Modified)

The modified MIL-STD-883 Class B screening ensures high reliability and quality standards, making this product suitable for critical applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with a wide range of systems and makes integration easier.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows for reliable performance even in extreme conditions.

Technology: TTL

TTL technology offers fast operating speeds and low power consumption, ideal for applications requiring high-speed digital logic.

Technical Specifications

Other Function Logic ICs SNC54LS442J attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54LS442J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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