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SNC55327SB

Texas Instruments

SNC55327SB by Texas Instruments

SNC55327SB by Texas Instruments is a MIL-STD-883 Class B (Modified) rated TTL logic IC with 16 terminals in a flatpack package. Operating temperature range from -55°C to 125°C makes it suitable for military applications. This surface-mount device features a rectangular metal body and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,527 parts In-Stock

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Digiode

USA . 4,224 parts In-Stock

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4,224

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Distributors (Availability)

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AZTECH Wire

Italy . 614 parts In-Stock

1+ parts

$12.657

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614

$12.657

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One Stop Electronics

USA . 737 parts In-Stock

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$14.000

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737

$14.000

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Parana Technologies

USA . 1,108 parts In-Stock

1+ parts

$29.873

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$2,774.147

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$26.886

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1,108

$29.873

$2,774.147

$26.886

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DigiPath Technology Company

USA . 1,193 parts In-Stock

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$32.894

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1,193

$32.894

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ChromeModa Solutions

Germany . 2,334 parts In-Stock

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$33.565

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$27.523

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2,334

$33.565

$27.523

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IDEA Electronic Components Group

UK . 826 parts In-Stock

1+ parts

$33.565

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$31.887

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$30.208

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826

$33.565

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Corphita

USA . 3,781 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the SNC55327SB by Texas Instruments. This high-quality Other Function Logic IC boasts MILITARY-grade performance, making it ideal for a wide range of applications. With its durable METAL body and MIL-STD-883 Class B screening level, this product offers unmatched reliability and longevity. Perfect for demanding environments, the SNC55327SB delivers exceptional value and benefits to customers seeking top-tier performance in their projects. Experience the advantages of Texas Instruments' expertise and innovation today.

Feature Benefit Bullets

Package Body Material: METAL

The metal package body provides excellent durability and heat dissipation, making this product suitable for harsh environments and high temperature applications.

Surface Mount: YES

Being surface mountable enables easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Screening Level: MIL-STD-883 Class B (Modified)

The modified MIL-STD-883 Class B screening level ensures high reliability and performance consistency, making this product suitable for critical applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing circuit layouts and facilitates efficient use of space on the PCB.

No. of Terminals: 16

With 16 terminals, this product offers versatility and flexibility in connecting to various other components in a circuit.

Package Style (Meter): FLATPACK

The flatpack package style provides a low profile and compact design, ideal for applications where space is limited.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this product to perform reliably in elevated temperature environments without risk of overheating.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures reliable operation even in extremely cold conditions, making this product versatile in different environments.

Terminal Position: DUAL

The dual terminal position offers enhanced connectivity options and allows for easy connection to other components, enhancing the versatility of this product.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, this product offers high reliability, durability, and performance required for mission-critical applications.

Technology: TTL

Utilizing TTL technology ensures high-speed operation and low power consumption, making this product suitable for applications requiring fast signal processing and minimal energy usage.

Terminal Form: FLAT

The flat terminal form allows for easy soldering and secure connections to the PCB, ensuring stable operation of the product in various operating conditions.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product offers compatibility with standard PCB layouts and easy integration into existing circuit designs.

Technical Specifications

Other Function Logic ICs SNC55327SB attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-MDFP-F16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

METAL

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNC55327SB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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