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NBSG86ABA

Onsemi

NBSG86ABA by Onsemi

NBSG86ABA by Onsemi is a high-speed logic IC with a propagation delay of 0.22 ns, suitable for applications requiring fast signal processing. Operating at a nominal voltage of 2.5V, it features a low profile grid array package style and surface mount capability, making it ideal for compact electronic designs. With a max operating temperature of 70 °C and moisture sensitivity level of 3, this ECL technology-based IC offers reliable performance in various environments.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 1,534 parts In-Stock

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Elcom Components

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Prism Electronics

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AZTECH Wire

Italy . 134 parts In-Stock

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$16.720

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Component Stockers USA

USA . 591 parts In-Stock

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$99.990

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Authorized Procurement Solutions

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Problanco Electronics

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SupplyDigital Components

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TANS Electronics

Latvia . 2,694 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 820 parts In-Stock

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Kulean Microsystems

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Corphita

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Microchip USA

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Overview

Discover the cutting-edge NBSG86ABA by Onsemi, a top-of-the-line Other Function Logic IC that guarantees superior performance and reliability. With a lightning-fast propagation delay of just 0.22 ns and a wide operating temperature range, this product is perfect for a variety of applications. Onsemi's reputation for quality and innovation ensures that you're getting the best in the industry. Elevate your projects with the NBSG86ABA and experience the value, benefits, and advantages it brings to you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to environmental factors, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 0.22 ns

With a low propagation delay of 0.22 ns, this product ensures fast response times and efficient signal processing.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 2.5

A nominal supply voltage of 2.5V provides a stable operating voltage that is commonly used in electronics, ensuring compatibility with various systems.

Power Supplies (V): +-2.5/+-3.3

Having multiple power supply options of +-2.5V and +-3.3V allows for versatile usage in different power environments.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for interfacing with other components and devices in a circuit.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand high temperature conditions, enhancing its reliability in various applications.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40 °C ensures this product can function in cold environments without any issues.

Terminal Finish: TIN LEAD

TIN LEAD terminal finish provides excellent solderability, making it easy to install and maintain the product on circuit boards.

Maximum Seated Height: 1.4 mm

With a low seated height of 1.4mm, this product is suitable for space-constrained applications where height is a critical factor.

Width: 4 mm

Having a compact width of 4mm allows for efficient use of board space and easier integration into compact electronic designs.

Minimum Supply Voltage (Vsup): 2.375 V

A minimum supply voltage of 2.375V ensures the product can operate even in low voltage conditions, expanding its range of applications.

Length: 4 mm

A length of 4mm provides a compact form factor for the product, enabling it to fit seamlessly into small electronic devices and systems.

Technology: ECL

Utilizing Emitter-Coupled Logic (ECL) technology offers high-speed operation and low power consumption, making this product suitable for applications requiring fast signal processing.

Terminal Form: BALL

Having a ball terminal form simplifies the connection process and ensures reliable electrical contact, enhancing the overall performance of the product.

Packing Method: TRAY

Packaged in trays for convenient handling and storage, making it easy to manage inventory and streamline production processes.

Terminal Pitch: 1 mm

A terminal pitch of 1mm allows for precise positioning and alignment of terminals, facilitating accurate soldering during assembly.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product can withstand moderate exposure to moisture during handling and assembly processes.

Maximum Supply Voltage (Vsup): 3.465 V

A maximum supply voltage of 3.465V ensures the product can operate safely within specified voltage limits, protecting it from potential damage due to voltage fluctuations.

Maximum Power Supply Current (ICC): 39 mA

With a maximum power supply current of 39mA, this product consumes low power, making it energy-efficient and suitable for battery-powered devices.

Technical Specifications

Other Function Logic ICs NBSG86ABA attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

86

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e0

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Packing Method:

TRAY

Power Supplies (V):

+-2.5/+-3.3

Maximum Power Supply Current (ICC):

39 mA

Propagation Delay At Nominal Supply:

.22 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

4 mm

Trade Compliance

NBSG86ABA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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