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NBSG86AMA1TBG

Onsemi

NBSG86AMA1TBG by Onsemi

NBSG86AMA1TBG by Onsemi is a high-speed logic IC with a propagation delay of 0.22ns, suitable for applications requiring fast signal processing. Operating at temperatures from -40 to 70 °C, it has a supply voltage range of ±2.5/±3.3V and consumes up to 39mA of power. With its compact square package and thin profile, it is ideal for space-constrained designs in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,741 parts In-Stock

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Digiode

USA . 771 parts In-Stock

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771

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 8,219 parts In-Stock

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8,219

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TANS Electronics

Latvia . 7,572 parts In-Stock

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7,572

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SupplyDigital Components

Austria . 5,533 parts In-Stock

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5,533

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Kulean Microsystems

USA . 4,504 parts In-Stock

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Corphita

USA . 1,492 parts In-Stock

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1,492

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UHIMA Technologies

Türkiye . 769 parts In-Stock

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769

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Corohmni

South Africa . 158 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the NBSG86AMA1TBG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and innovation in every product. This logic IC is perfect for a wide range of applications, offering lightning-fast propagation delay and versatile power supplies. Customers can trust in the value and benefits that this product delivers, making it a must-have for all their electronic needs. Elevate your projects with the NBSG86AMA1TBG and enjoy seamless functionality like never before.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.22 ns

The extremely low propagation delay ensures fast and efficient operation of the product.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation of the product on PCBs.

Nominal Supply Voltage / Vsup (V): 2.5

The consistent supply voltage of 2.5V ensures stable performance and reliable operation.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting the product to other components.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70 °C, the product can withstand demanding environmental conditions.

Technology: ECL

Emitter-Coupled Logic (ECL) technology offers high-speed performance and low power consumption.

Technical Specifications

Other Function Logic ICs NBSG86AMA1TBG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

86

JESD-30 Code:

S-XBGA-B16

JESD-609 Code:

e3

Length:

4 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Power Supplies (V):

+-2.5/+-3.3

Maximum Power Supply Current (ICC):

39 mA

Propagation Delay At Nominal Supply:

.22 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.03 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

4 mm

Trade Compliance

NBSG86AMA1TBG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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