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TIB0801ANE

Texas Instruments

TIB0801ANE by Texas Instruments

TIB0801ANE by Texas Instruments is a 14-terminal BIPOLAR logic IC with PLASTIC/EPOXY package. It operates b/w 0-70°C, suitable for COMMERCIAL applications. Featuring RECTANGULAR shape and IN-LINE style, it's ideal for various Other Function Logic uses.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,079 parts In-Stock

1+ parts

-

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6,079

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Digiode

USA . 2,135 parts In-Stock

1+ parts

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2,135

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 507 parts In-Stock

1+ parts

$14.593

100+ parts

-

1k+ parts

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507

$14.593

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One Stop Electronics

USA . 374 parts In-Stock

1+ parts

$16.000

100+ parts

-

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374

$16.000

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Parana Technologies

USA . 1,067 parts In-Stock

1+ parts

$16.156

100+ parts

-

1k+ parts

$16.479

10k+ parts

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1,067

$16.156

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$16.479

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DigiPath Technology Company

USA . 1,910 parts In-Stock

1+ parts

$17.790

100+ parts

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1,910

$17.790

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ChromeModa Solutions

Germany . 6,749 parts In-Stock

1+ parts

$18.153

100+ parts

$14.885

1k+ parts

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10k+ parts

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6,749

$18.153

$14.885

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IDEA Electronic Components Group

UK . 2,321 parts In-Stock

1+ parts

$18.153

100+ parts

$17.245

1k+ parts

$16.338

10k+ parts

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2,321

$18.153

$17.245

$16.338

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Corphita

USA . 1,440 parts In-Stock

1+ parts

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1,440

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Overview

Unlock the potential of your electronic projects with the TIB0801ANE by Texas Instruments. Renowned for their high-quality products, Texas Instruments brings you a versatile Other Function Logic IC that is ideal for a wide range of applications. With its durable plastic/epoxy construction and dual terminal position, this IC offers reliable performance in commercial-grade temperature environments. Experience the value and benefits of Texas Instruments' advanced technology with the TIB0801ANE, providing you with the competitive edge you need to succeed in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy installation and integration into existing systems, saving space and providing efficient use of board real estate.

No. of Terminals: 14

With 14 terminals, this product offers enough connectivity options for complex circuit designs, enabling versatile functionality and compatibility.

Package Style (Meter): IN-LINE

The in-line package style makes it easier to arrange and organize multiple components on a circuit board, leading to a more streamlined and efficient overall design.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures stable performance even in demanding environmental conditions, making this product suitable for industrial applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the product to operate reliably in cold temperatures, enhancing its versatility and usability in different settings.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in circuit design and allows for easy connection to other components, enabling efficient signal routing and minimizing signal interference.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that this product meets industry standards for reliability and performance, making it a trusted choice for a wide range of commercial applications.

Technology: BIPOLAR

The use of bipolar technology in this product allows for high-speed operation and precise signal processing, making it ideal for applications that require quick response times and accurate data handling.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and provides mechanical strength to the connections, ensuring long-term stability and durability of the product.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this product offers precise and consistent spacing between terminals, facilitating easy soldering and ensuring reliable electrical connections in the circuit.

Technical Specifications

Other Function Logic ICs TIB0801ANE attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TIB0801ANE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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