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NLV7SZ57DFT2G

Onsemi

NLV7SZ57DFT2G by Onsemi

NLV7SZ57DFT2G by Onsemi is a CMOS logic IC with 6 terminals, operating b/w -55 to 125 °C. It has a supply voltage range of 1.65V to 5.5V and AEC-Q100 screening level for automotive applications. The package style is small outline, thin profile, shrink pitch, suitable for military-grade temperature requirements.

Median Price

$0.373

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 33,000 parts In-Stock

1+ parts

$0.175

100+ parts

$0.165

1k+ parts

$0.149

10k+ parts

-

33,000

$0.175

$0.165

$0.149

-

Mouser Electronics

USA . 1,876 parts In-Stock

1+ parts

$0.560

100+ parts

$0.281

1k+ parts

$0.198

10k+ parts

$0.181

1,876

$0.560

$0.281

$0.198

$0.181

DigiKey

USA . 2,875 parts In-Stock

1+ parts

$0.920

100+ parts

$0.349

1k+ parts

$0.236

10k+ parts

$0.176

2,875

$0.920

$0.349

$0.236

$0.176

Chip1Stop

Japan . 2,780 parts In-Stock

1+ parts

$14.800

100+ parts

-

1k+ parts

-

10k+ parts

-

2,780

$14.800

-

-

-

Flip Electronics (Authorized)

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

42,000

-

-

-

-

Verical

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.186

33,000

-

-

-

$0.186

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.150

10k+ parts

$0.140

3,000

-

-

$0.150

$0.140

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,523 parts In-Stock

1+ parts

$0.150

100+ parts

-

1k+ parts

-

10k+ parts

-

1,523

$0.150

-

-

-

Digiode

USA . 1,864 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

-

1,864

$0.166

-

-

-

Flip Electronics

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

42,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 278 parts In-Stock

1+ parts

$0.150

100+ parts

-

1k+ parts

-

10k+ parts

-

278

$0.150

-

-

-

Corphita

USA . 1,237 parts In-Stock

1+ parts

$0.158

100+ parts

-

1k+ parts

-

10k+ parts

-

1,237

$0.158

-

-

-

Vigor

Singapore . 321 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

-

321

$0.500

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 19,737 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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19,737

-

-

-

-

Perfect Parts

USA . 9,817 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,817

-

-

-

-

Problanco Electronics

Mexico . 7,739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,739

-

-

-

-

SupplyDigital Components

Austria . 5,976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,976

-

-

-

-

TANS Electronics

Latvia . 3,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,053

-

-

-

-

Eastek

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.240

10k+ parts

-

3,000

-

-

$0.240

-

GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Authorized Procurement Solutions

USA . 2,855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,855

-

-

-

-

Kulean Microsystems

USA . 2,289 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,289

-

-

-

-

UHIMA Technologies

Türkiye . 653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

653

-

-

-

-

Microchip USA

USA . 601 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

601

-

-

-

-

Overview

Elevate your electronic projects with the NLV7SZ57DFT2G by Onsemi, a high-quality Other Function Logic IC that promises reliability and precision. Manufactured by Onsemi, a renowned industry leader known for their cutting-edge technology and innovative solutions, this IC is perfect for a wide range of applications. With a small outline, thin profile design, and military-grade temperature rating, this IC offers unmatched performance and durability. Experience seamless integration and enhanced functionality with the NLV7SZ57DFT2G, making it the ideal choice for customers looking for top-notch quality and exceptional value in their electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable packaging for the IC, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 2.3

Operates at a moderate voltage level, balancing performance and power efficiency.

No. of Terminals: 6

Provides sufficient connection points for interfacing with external components or circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and space-saving design that is ideal for applications with limited board space.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, ensuring reliable operation in various conditions.

Minimum Operating Temperature: -55 °C

Can operate in extremely cold conditions, suitable for outdoor or industrial applications.

Terminal Finish: MATTE TIN

Provides good electrical conductivity and solderability for secure connections.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing performance and efficiency.

Technical Specifications

Other Function Logic ICs NLV7SZ57DFT2G attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLV7SZ57DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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