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NL7SZ58DBVT1G

Onsemi

NL7SZ58DBVT1G by Onsemi

NL7SZ58DBVT1G by Onsemi is a CMOS logic IC with 6 terminals, operating b/w -55 to 125 °C. It has a supply voltage range of 1.65V to 5.5V and peak reflow temp of 260°C. Ideal for military-grade applications requiring small outline, thin profile packages in surface-mount technology.

Median Price

$0.158

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 8,416 parts In-Stock

1+ parts

$0.270

100+ parts

$0.105

1k+ parts

$0.064

10k+ parts

$0.044

8,416

$0.270

$0.105

$0.064

$0.044

Rochester

USA . 189,000 parts In-Stock

1+ parts

-

100+ parts

$0.046

1k+ parts

$0.038

10k+ parts

$0.034

189,000

-

$0.046

$0.038

$0.034

Flip Electronics (Authorized)

USA . 189,000 parts In-Stock

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-

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189,000

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Distributors (In-Stock)

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Digiode

USA . 1,422 parts In-Stock

1+ parts

$0.036

100+ parts

-

1k+ parts

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10k+ parts

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1,422

$0.036

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Vyrian

USA . 1,077 parts In-Stock

1+ parts

$0.038

100+ parts

-

1k+ parts

-

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1,077

$0.038

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Flip Electronics

USA . 182,998 parts In-Stock

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182,998

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 134 parts In-Stock

1+ parts

$0.030

100+ parts

-

1k+ parts

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10k+ parts

-

134

$0.030

-

-

-

Corphita

USA . 955 parts In-Stock

1+ parts

$0.034

100+ parts

-

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-

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955

$0.034

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-

Corohmni

South Africa . 134 parts In-Stock

1+ parts

$0.038

100+ parts

-

1k+ parts

-

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134

$0.038

-

-

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SupplyDigital Components

Austria . 7,563 parts In-Stock

1+ parts

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7,563

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Problanco Electronics

Mexico . 7,513 parts In-Stock

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7,513

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Kulean Microsystems

USA . 6,856 parts In-Stock

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6,856

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TANS Electronics

Latvia . 1,854 parts In-Stock

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1,854

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Microchip USA

USA . 313 parts In-Stock

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313

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UHIMA Technologies

Türkiye . 192 parts In-Stock

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192

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Overview

Unlock the power of innovation with the NL7SZ58DBVT1G by Onsemi. As a leader in the industry, Onsemi delivers unparalleled quality and reliability in their products. This versatile logic IC is perfect for a wide range of applications, providing customers with exceptional value and benefits. Whether you're looking to enhance your electronic projects or streamline your manufacturing processes, the NL7SZ58DBVT1G offers the perfect solution. Trust Onsemi to deliver cutting-edge technology that exceeds expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving space and reducing overall product size.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage ensures compatibility with a wide range of systems and devices, making it versatile for different applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this IC can withstand harsh environmental conditions and operate reliably in demanding situations.

Technology: CMOS

The CMOS technology used in this IC provides low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Technical Specifications

Other Function Logic ICs NL7SZ58DBVT1G attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

NL7SZ58DBVT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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