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MC14559BCP

Onsemi

MC14559BCP by Onsemi

MC14559BCP by Onsemi is a CMOS IC with 16 terminals, operating at -55 to 125 °C. It has a supply voltage range of 3-18V and can handle frequencies up to 800kHz. Widely used in military-grade applications due to its high reliability and performance.

Median Price

$0.670

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

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Rochester

USA . 7 parts In-Stock

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$0.670

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$0.660

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$0.640

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7

$0.670

$0.660

$0.640

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Digiode

USA . 762 parts In-Stock

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$0.636

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TEDSS.com

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Vyrian

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ComSIT Distribution GmbH

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ACDS - Activité Composants Distribution Service

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ECAB

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Chip Stock

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Rotakorn

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Bristol Electronics

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R&J Components

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Electronic Expediters

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Electronics Depot

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GES GmbH

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Fibra_Brandt Electronic GMBH

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LIBRA Elektronik GmbH

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Corphita

USA . 1,701 parts In-Stock

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$0.603

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Corohmni

South Africa . 333 parts In-Stock

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$0.670

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Problanco Electronics

Mexico . 8,325 parts In-Stock

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A-Z Elektronik GmbH

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TANS Electronics

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Kulean Microsystems

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SupplyDigital Components

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UHIMA Technologies

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Microchip USA

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Overview

Discover the superior quality and reliability of the MC14559BCP by Onsemi, a leading manufacturer in the industry. This innovative Other Function Logic IC offers unmatched performance and versatility for a wide range of applications. With its durable plastic/epoxy package body material and advanced CMOS technology, this product ensures optimal functionality and efficiency. Experience the value and benefits of the MC14559BCP, providing customers with seamless operation and enhanced productivity. Choose Onsemi for cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the IC, ensuring durability and reliability.

Nominal Supply Voltage / Vsup (V): 5

The IC operates at a commonly used supply voltage, making it compatible with a wide range of circuits and power sources.

Maximum Operating Temperature: 125 °C

The IC can withstand high temperatures, making it suitable for a variety of industrial and automotive applications where heat may be a factor.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable in noisy environments.

Maximum Frequency At Nominal Supply: 800000 Hz

The high frequency capability of the IC allows for fast operation and processing of signals, making it ideal for applications requiring quick response times.

Technical Specifications

Other Function Logic ICs MC14559BCP attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Additional Features:

SERIAL OUTPUT, ALL CONTROL INPUTS POSITIVE-EDGE TRIGGERED

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

800000 Hz

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Trade Compliance

MC14559BCP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-484-0949, 5962014840949

NIIN

014840949

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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