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MC14549BCP

Onsemi

MC14549BCP by Onsemi

MC14549BCP by Onsemi is a CMOS IC with 16 terminals, operating at -55 to 125 °C. It has a supply voltage range of 3-18V and max frequency of 800kHz. Widely used in military applications due to its MILITARY grade and through-hole terminal form.

Median Price

$14.700

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Forefront Electronics and Design

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Digiode

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Jameco Electronics

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R&J Components

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Prism Electronics

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Flex Direct, LLC

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Bristol Electronics

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Fibra_Brandt Electronic GMBH

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Corohmni

South Africa . 122 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

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TANS Electronics

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Overview

Unleash the power of innovation with the MC14549BCP from Onsemi. This top-of-the-line Other Function Logic IC boasts unparalleled quality and reliability, setting it apart from the competition. Whether you're in the automotive, industrial, or consumer electronics industry, this product is your go-to solution for all your logic IC needs. With a package style that ensures ease of integration and a wide operating temperature range, the MC14549BCP delivers exceptional value and performance. Trust Onsemi to provide cutting-edge technology that exceeds expectations and drives success in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the IC, ensuring a longer lifespan.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard voltage, making it compatible with a wide range of electronic devices.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial and military applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, improving overall performance.

Maximum Frequency At Nominal Supply: 800000 Hz

Capable of operating at high frequencies, making it ideal for applications requiring fast signal processing.

Technical Specifications

Other Function Logic ICs MC14549BCP attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Additional Features:

SERIAL OUTPUT, ALL CONTROL INPUTS POSITIVE-EDGE TRIGGERED

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

800000 Hz

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Trade Compliance

MC14549BCP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-155-0866, 5962011550866, 5962-01-083-0557, 5962010830557

NIIN

011550866, 010830557

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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