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NC7SV57FHX-L22780

Onsemi

NC7SV57FHX-L22780 by Onsemi

NC7SV57FHX-L22780 by Onsemi is a CMOS logic IC with 31ns propagation delay, suitable for industrial applications. Operating at 1.2/3.3V, it features a load capacitance of 15pF and Schmitt Trigger technology. With a small outline package style and dual terminals, it offers fast response times in compact designs.

Median Price

$0.118

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$0.118

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$0.118

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Vyrian

USA . 7,329 parts In-Stock

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7,329

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Digiode

USA . 1,401 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 142 parts In-Stock

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$0.116

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$0.116

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Continental Prestige Electronics

USA . 6,593 parts In-Stock

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$0.118

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6,593

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$0.116

Argo Parts USA

USA . 2,525 parts In-Stock

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$0.118

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$0.114

2,525

$0.118

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$0.114

Netroflash

USA . 50 parts In-Stock

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$0.118

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$0.112

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$0.110

50

$0.118

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$0.112

$0.110

Microchip USA

USA . 7,497 parts In-Stock

1+ parts

$0.654

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7,497

$0.654

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Ampacity Inc.

Singapore . 514 parts In-Stock

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$4.000

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514

$4.000

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AZTECH Wire

Italy . 780 parts In-Stock

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$18.024

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780

$18.024

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Semicontronic

India . 838 parts In-Stock

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$50.000

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$48.750

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$48.500

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838

$50.000

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$48.500

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QUARKTWIN TECHNOLOGY LTD

USA . 21,329 parts In-Stock

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Problanco Electronics

Mexico . 6,433 parts In-Stock

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Kulean Microsystems

USA . 4,506 parts In-Stock

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TANS Electronics

Latvia . 2,508 parts In-Stock

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UHIMA Technologies

Türkiye . 991 parts In-Stock

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SupplyDigital Components

Austria . 592 parts In-Stock

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Corphita

USA . 381 parts In-Stock

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Overview

Discover the cutting-edge NC7SV57FHX-L22780 by Onsemi, a top-tier manufacturer known for its superior quality products. This innovative Other Function Logic IC offers unmatched performance and reliability in various applications. With a fast propagation delay and low power consumption, this product provides exceptional value to customers seeking efficient solutions. Trust Onsemi to deliver excellence with the NC7SV57FHX-L22780, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 31 ns

Fast propagation delay allows for quick operation of logic functions, making this IC suitable for high-speed applications.

Surface Mount: YES

Easily mountable on a PCB, saving space and making the assembly process more efficient.

Nominal Supply Voltage / Vsup (V): 1.1

Low power consumption at a nominal supply voltage of 1.1V, leading to energy efficiency.

Load Capacitance (CL): 15 pF

Capable of driving loads with a capacitance of up to 15 pF, making it versatile for various circuit designs.

Power Supplies (V): 1.2/3.3

Compatible with multiple power supply voltages, offering flexibility in system integration.

No. of Terminals: 6

Sufficient number of terminals for connecting to external circuitry, allowing for versatile use.

Maximum I (ol): 2 Amp

High output current capability of 2A enables the IC to drive larger loads without external buffering.

Maximum Operating Temperature: 85 °C

Operational at high temperatures of up to 85°C, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operational at low temperatures of down to -40°C, making it suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Quality terminal finish for improved conductivity and corrosion resistance, ensuring reliable connections.

Minimum Supply Voltage (Vsup): 0.9 V

Capable of operating at low supply voltages down to 0.9V, suitable for battery-powered applications.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial temperature conditions, ensuring reliable operation in demanding environments.

Schmitt Trigger: YES

Incorporation of Schmitt trigger for hysteresis, improving noise immunity and signal integrity in digital circuits.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the IC efficient and reliable.

Terminal Form: NO LEAD

Lead-free terminal form for environmental sustainability and compliance with regulations.

Packing Method: TR

Tape and reel packaging method for easy handling and automated assembly in production processes.

Maximum Supply Voltage (Vsup): 3.6 V

Safe operating voltage up to 3.6V, providing protection against overvoltage conditions.

Technical Specifications

Other Function Logic ICs NC7SV57FHX-L22780 attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

AUP/ULP/V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

1 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

2 Amp

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

31 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NC7SV57FHX-L22780 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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