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NLV7S98DFT2G

Onsemi

NLV7S98DFT2G by Onsemi

NLV7S98DFT2G by Onsemi is a CMOS logic IC with 6 terminals, operating b/w -55 to 125 °C. It has a supply voltage range of 1.65-5.5 V and AEC-Q100 screening for automotive applications. The small outline package with gull wing terminals makes it suitable for compact electronic designs in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,144 parts In-Stock

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Digiode

USA . 864 parts In-Stock

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Kulean Microsystems

USA . 7,040 parts In-Stock

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TANS Electronics

Latvia . 1,861 parts In-Stock

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SupplyDigital Components

Austria . 658 parts In-Stock

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Corphita

USA . 626 parts In-Stock

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Problanco Electronics

Mexico . 581 parts In-Stock

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UHIMA Technologies

Türkiye . 378 parts In-Stock

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Corohmni

South Africa . 361 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the NLV7S98DFT2G by Onsemi. Manufactured by a trusted industry leader, this cutting-edge Other Function Logic IC offers seamless integration and superior performance. Ideal for a wide range of applications, this product delivers unrivaled reliability and efficiency. Experience the value and benefits of Onsemi's innovative technology with the NLV7S98DFT2G, where quality meets affordability. Elevate your projects to new heights with this versatile component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable or industrial applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly on circuit boards, saving space and enabling automated manufacturing processes.

Screening Level: AEC-Q100

AEC-Q100 certification ensures that the product meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common standard in many electronic systems, making it compatible with a wide range of devices and applications.

No. of Terminals: 6

Having 6 terminals provides versatility in connectivity options and allows for more complex circuit designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable performance even in demanding environments with elevated temperatures.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C enables the product to function effectively in cold conditions without any performance degradation.

Technology: CMOS

The CMOS technology used in the product provides low power consumption and high noise immunity, making it energy-efficient and reliable in noisy environments.

Technical Specifications

Other Function Logic ICs NLV7S98DFT2G attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

Length:

2 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

NLV7S98DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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