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NLSF457MU3TCG

Onsemi

NLSF457MU3TCG by Onsemi

NLSF457MU3TCG by Onsemi is an 8-terminal logic IC with a supply voltage range of 1.65V to 5.5V, operating b/w -55 °C to 125°C. It features a small outline package style, suitable for military-grade applications requiring high-temperature resistance and compact design. This surface-mount device has a nickel palladium gold finish and dual terminal position, making it ideal for space-constrained electronic systems.

Median Price

$0.184

Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.220

3,000

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$0.220

Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

1+ parts

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3,000

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-

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Rochester

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

$0.148

1k+ parts

$0.123

10k+ parts

$0.110

2,400

-

$0.148

$0.123

$0.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 551 parts In-Stock

1+ parts

$0.220

100+ parts

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551

$0.220

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Flip Electronics

USA . 6,000 parts In-Stock

1+ parts

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6,000

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Digiode

USA . 1,651 parts In-Stock

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1,651

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Distributors (Availability)

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Corohmni

South Africa . 86 parts In-Stock

1+ parts

$0.220

100+ parts

-

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86

$0.220

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Component Stockers USA

USA . 415 parts In-Stock

1+ parts

$99.990

100+ parts

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415

$99.990

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-

Authorized Procurement Solutions

USA . 80,000 parts In-Stock

1+ parts

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80,000

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Kulean Microsystems

USA . 6,305 parts In-Stock

1+ parts

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6,305

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TANS Electronics

Latvia . 4,594 parts In-Stock

1+ parts

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4,594

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SupplyDigital Components

Austria . 4,304 parts In-Stock

1+ parts

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4,304

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Problanco Electronics

Mexico . 1,886 parts In-Stock

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1,886

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UHIMA Technologies

Türkiye . 685 parts In-Stock

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685

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Microchip USA

USA . 376 parts In-Stock

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376

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Corphita

USA . 261 parts In-Stock

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261

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Overview

Unlock endless possibilities with the NLSF457MU3TCG by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in every product. This versatile logic IC is perfect for a wide range of applications, offering seamless integration and superior performance. Experience the value of efficiency and innovation with this cutting-edge solution. Elevate your projects today with the NLSF457MU3TCG by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mountable makes the installation process easier and more efficient, saving time and effort in assembling the product into electronic systems.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V is a common standard in many electronic systems, ensuring compatibility with a wide range of devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows the product to maintain performance even in demanding thermal conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures the product can function reliably in cold environments without any issues.

Width: 1 mm

The small width of 1mm allows for compact and space-efficient designs, ideal for applications where size constraints are a concern.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the product can withstand harsh conditions and operate reliably in rugged environments.

Technical Specifications

Other Function Logic ICs NLSF457MU3TCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

NLSF457

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NLSF457MU3TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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