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NLX1G98CMX1TCG

Onsemi

NLX1G98CMX1TCG by Onsemi

NLX1G98CMX1TCG by Onsemi is a CMOS Schmitt Trigger IC with 6.3ns propagation delay, 50pF load capacitance, and 24A max I (ol). Ideal for military applications due to its small outline package and wide operating temperature range from -55 °C to 125°C.

Median Price

$0.110

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 150,000 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

150,000

-

$0.119

$0.099

$0.088

DigiKey

USA . 150,000 parts In-Stock

1+ parts

-

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$0.100

150,000

-

-

-

$0.100

Verical

USA . 150,000 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.110

150,000

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$0.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 50 parts In-Stock

1+ parts

$0.079

100+ parts

-

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-

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50

$0.079

-

-

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Digiode

USA . 1,780 parts In-Stock

1+ parts

$0.093

100+ parts

-

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10k+ parts

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1,780

$0.093

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 417 parts In-Stock

1+ parts

$0.079

100+ parts

-

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417

$0.079

-

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Corphita

USA . 189 parts In-Stock

1+ parts

$0.088

100+ parts

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189

$0.088

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Vigor

Singapore . 939 parts In-Stock

1+ parts

$0.090

100+ parts

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939

$0.090

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Continental Prestige Electronics

USA . 150,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.085

10k+ parts

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150,000

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$0.085

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SupplyDigital Components

Austria . 6,685 parts In-Stock

1+ parts

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6,685

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Problanco Electronics

Mexico . 6,582 parts In-Stock

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6,582

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Kulean Microsystems

USA . 2,771 parts In-Stock

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2,771

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TANS Electronics

Latvia . 2,385 parts In-Stock

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2,385

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UHIMA Technologies

Türkiye . 362 parts In-Stock

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362

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Microchip USA

USA . 275 parts In-Stock

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275

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Overview

Experience the next level of performance with the NLX1G98CMX1TCG by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This innovative Other Function Logic IC offers unmatched speed with a propagation delay of just 6.3 ns, making it ideal for applications requiring quick response times. With a low nominal supply voltage of 2.3V and a maximum I (ol) of 24 Amp, this product provides exceptional value and efficiency. Upgrade your projects with the NLX1G98CMX1TCG and see the difference for yourself!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay ensures fast performance and efficient operation.

Surface Mount: YES

Easier to mount on PCBs, saving time and effort in assembly.

Package Shape: SQUARE

Space-efficient design for better utilization of PCB space.

Nominal Supply Voltage / Vsup (V): 2.3

Optimized supply voltage for efficient power consumption.

Load Capacitance (CL): 50 pF

Suitable for driving typical loads in logic circuits.

Power Supplies (V): 3.3

Compatible with commonly used power supply voltages.

No. of Terminals: 6

Simplified connectivity for ease of integration.

Maximum I (ol): 24 Amp

High output current capability for driving loads effectively.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for reliable performance in various environments.

Minimum Operating Temperature: -55 °C

Suitable for operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish for extended product lifespan.

Terminal Position: DUAL

Provides flexibility in PCB layout and mounting.

Maximum Seated Height: 0.4 mm

Low profile design for space-constrained applications.

Width: 1 mm

Compact width facilitates placement in tight spaces on PCBs.

Minimum Supply Voltage (Vsup): 1.65 V

Allows for operation at lower supply voltages for power efficiency.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for robust assembly processes.

Length: 1 mm

Small footprint for efficient use of PCB real estate.

Temperature Grade: MILITARY

Suitable for rugged applications in military or harsh environments.

Schmitt Trigger: YES

Integrated Schmitt trigger for noise immunity and signal conditioning.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form for compliance with environmental regulations.

Packing Method: TR

Tape and reel packaging for efficient handling and storage.

Terminal Pitch: 0.35 mm

Fine terminal pitch for precise connections on PCBs.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a wide range of supply voltages for versatility in application.

Technical Specifications

Other Function Logic ICs NLX1G98CMX1TCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

S-XDSO-N6

JESD-609 Code:

e4

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX1G98CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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