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CD74HC670M

Texas Instruments

CD74HC670M by Texas Instruments

CD74HC670M by Texas Instruments is a 4-bit Other Function Logic IC with 42ns propagation delay, operating b/w -55 to 125°C. It features a small outline package style, true output polarity, and 3-STATE output characteristics. Ideal for military-grade applications requiring low power consumption and high-speed data processing.

Median Price

$1.475

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,385 parts In-Stock

1+ parts

-

100+ parts

$1.420

1k+ parts

$1.180

10k+ parts

$1.050

9,385

-

$1.420

$1.180

$1.050

DigiKey

USA . 9,385 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.780

10k+ parts

-

9,385

-

-

$1.780

-

Verical

USA . 4,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.475

10k+ parts

$1.313

4,080

-

-

$1.475

$1.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$0.801

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$0.801

-

-

-

TME

Poland . 195 parts In-Stock

1+ parts

$0.900

100+ parts

$0.715

1k+ parts

-

10k+ parts

-

195

$0.900

$0.715

-

-

Digiode

USA . 4,188 parts In-Stock

1+ parts

$0.950

100+ parts

-

1k+ parts

-

10k+ parts

-

4,188

$0.950

-

-

-

DigiKey Marketplace

USA . 10,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10,720

-

-

-

-

Vyrian

USA . 7,895 parts In-Stock

1+ parts

-

100+ parts

-

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7,895

-

-

-

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Bristol Electronics

USA . 143 parts In-Stock

1+ parts

-

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-

1k+ parts

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143

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.801

100+ parts

-

1k+ parts

$0.761

10k+ parts

$0.745

1,000

$0.801

-

$0.761

$0.745

Corphita

USA . 1,929 parts In-Stock

1+ parts

$0.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,929

$0.900

-

-

-

Parana Technologies

USA . 556 parts In-Stock

1+ parts

$22.283

100+ parts

$2,069.308

1k+ parts

$20.055

10k+ parts

-

556

$22.283

$2,069.308

$20.055

-

DigiPath Technology Company

USA . 251 parts In-Stock

1+ parts

$24.536

100+ parts

-

1k+ parts

-

10k+ parts

-

251

$24.536

-

-

-

ChromeModa Solutions

Germany . 1,985 parts In-Stock

1+ parts

$25.037

100+ parts

$20.530

1k+ parts

-

10k+ parts

-

1,985

$25.037

$20.530

-

-

IDEA Electronic Components Group

UK . 1,421 parts In-Stock

1+ parts

$25.037

100+ parts

$23.785

1k+ parts

$22.533

10k+ parts

-

1,421

$25.037

$23.785

$22.533

-

Microchip USA

USA . 1,152 parts In-Stock

1+ parts

$52.800

100+ parts

$52.050

1k+ parts

$51.670

10k+ parts

$51.300

1,152

$52.800

$52.050

$51.670

$51.300

QUARKTWIN TECHNOLOGY LTD

USA . 17,517 parts In-Stock

1+ parts

-

100+ parts

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17,517

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-

-

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Supply Digital

USA . 2,472 parts In-Stock

1+ parts

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100+ parts

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2,472

-

-

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Perfect Parts

USA . 404 parts In-Stock

1+ parts

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404

-

-

-

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Assy Fe

Spain . 19 parts In-Stock

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19

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Overview

Elevate your electronic projects with the high-quality CD74HC670M logic IC from Texas Instruments. Designed for reliability and performance, this versatile component offers 4 bits of functionality in a small outline package, making it ideal for a variety of applications. Whether you're a hobbyist or a professional, this product provides value and benefits with its true output polarity, 3-STATE characteristics, and wide temperature range. Trust Texas Instruments to deliver top-notch components that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the inner components of the IC, making it reliable for long-term use.

Propagation Delay At Nominal Supply: 42 ns

The low propagation delay ensures fast signal processing, making this IC suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 4.5

The moderate supply voltage requirement makes this IC compatible with a wide range of power sources, enhancing its versatility.

Maximum I (ol): 7.8 Amp

High output current capability allows this IC to drive larger loads, expanding its potential use cases.

Output Characteristics: 3-STATE

The 3-STATE output feature provides flexibility in controlling the output signal, enabling efficient communication between multiple devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of this IC.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures stable performance even in challenging environmental conditions, making this IC suitable for various applications.

Technical Specifications

Other Function Logic ICs CD74HC670M attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

7.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

42 ns

Propagation Delay (tpd):

42 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HC670M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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