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Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.

Multi-functional Peripherals

Available Parts 2,325

Part RoHS Manufacturer Description Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time
CY8C5868AXI-LP035 by Infineon Technologies

CY8C5868AXI-LP035

Infineon Technologies

MULTIFUNCTION PERIPHERAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Length: 14 mm;

MULTIFUNCTION PERIPHERAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

65536

14 mm

YES

33 MHz

14 mm

CMOS

.0255 mA

1.8 V

I2C; USB; PS/2

.5 mm

S-PQFP-G100

3

72

CY8C5888LTI-LP097 by Infineon Technologies

CY8C5888LTI-LP097

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE;

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

32768

8 mm

YES

33 MHz

30

260

8 mm

2097152 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB

.4 mm

S-XQCC-N68

3

Not Qualified

e4

38

CY8C5868AXI-LP032 by Infineon Technologies

CY8C5868AXI-LP032

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1.6 mm

32768

14 mm

YES

33 MHz

30

260

14 mm

2097152 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.5 mm

S-PQFP-G100

3

Not Qualified

e4

72

CY8C5888AXI-LP096 by Infineon Technologies

CY8C5888AXI-LP096

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1.8/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

PURE TIN

N

QUAD

1.6 mm

32768

14 mm

YES

33 MHz

14 mm

2097152 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB

.5 mm

S-PQFP-G100

3

Not Qualified

62

CY8C5888FNI-LP214T by Infineon Technologies

CY8C5888FNI-LP214T

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 99; Package Code: VFBGA; Package Shape: RECTANGULAR;

INDUSTRIAL

BALL

99

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.6 mm

32768

5.192 mm

YES

0

33 MHz

5.94 mm

CMOS

3.3 V

I2C; I2S; LIN; PS/2; SPI; UART; USB; SIO; IDE; SMBUS

.5 mm

R-PBGA-B99

1

e1

62

CY8C4247AZI-M485 by Infineon Technologies

CY8C4247AZI-M485

Infineon Technologies

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64(UNSPEC)

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

8192

10 mm

NO

48 MHz

10 mm

CMOS

13.8 mA

11

I2C; SPI; UART; IRDA; IDE; CAN; LIN

.5 mm

S-PQFP-G64

3

Not Qualified

e4

51

CY8C29466-24SXI by Infineon Technologies

CY8C29466-24SXI

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE

SOP28,.4

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.67 mm

32768

1024

7.505 mm

ALSO OPERATES AT 3V SUPPLY

NO

0

24 MHz

20

260

17.905 mm

2048

CMOS

14 mA

5 V

Microcontrollers

FLASH

1.27 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e4

24

CY8C5868LTI-LP039 by Infineon Technologies

CY8C5868LTI-LP039

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE;

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

32768

8 mm

YES

33 MHz

30

260

8 mm

2097152 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.4 mm

S-XQCC-N68

3

Not Qualified

e4

48

CY8C29466-24PVXIT by Infineon Technologies

CY8C29466-24PVXIT

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

DUAL

2 mm

32768

1024

5.3 mm

ALSO OPERATES AT 3V SUPPLY

NO

0

24 MHz

20

260

10.2 mm

2048

CMOS

14 mA

5 V

Microcontrollers

FLASH

.65 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e3

24

MIMX8MM6CVTKZAA by NXP Semiconductors

MIMX8MM6CVTKZAA

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

SoC

INDUSTRIAL

BALL

486

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA486,27X27,20

.9 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

1.25 mm

288K

14 mm

24MHZ NOM CRYSTAL FREQ AVAILABLE

YES

40

260

14 mm

CMOS

.95 V

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

.5 mm

S-PBGA-B486

3

e2

16

CY8C5868LTI-LP038 by Infineon Technologies

CY8C5868LTI-LP038

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE;

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

32768

8 mm

YES

33 MHz

30

260

8 mm

2097152 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.4 mm

S-XQCC-N68

3

Not Qualified

e4

48

CY8C5888AXQ-LP096 by Infineon Technologies

CY8C5888AXQ-LP096

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

1.8/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

PURE TIN

N

QUAD

1.6 mm

32768

14 mm

YES

0

33 MHz

14 mm

2097152 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

I2C; I2S, LIN; PS/2; SPI, USB

.5 mm

S-PQFP-G100

3

Not Qualified

62

CY8C5888LTQ-LP097 by Infineon Technologies

CY8C5888LTQ-LP097

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE;

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

32768

8 mm

YES

0

33 MHz

8 mm

2097152 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

I2C; I2S, LIN; PS/2; SPI, USB

.4 mm

S-XQCC-N68

3

Not Qualified

e4

38

MIMX8ML8CVNKZAB by NXP Semiconductors

MIMX8ML8CVNKZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 548; Package Code: LFBGA; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

548

LFBGA

SQUARE

PLASTIC/EPOXY

YES

.9 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA548,29X29,20

.805 V

105 Cel

-40 Cel

BOTTOM

1.481 mm

888832

15 mm

ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE

YES

0

24 MHz

40

260

15 mm

CMOS

.85 V

16

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

.5 mm

S-PBGA-B548

3

160

CY8C27443-24PVXIT by Infineon Technologies

CY8C27443-24PVXIT

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

DUAL

2 mm

16384

256

5.3 mm

ALSO OPERATES AT 3V WITH 93KHZ

NO

0

24 MHz

20

260

10.2 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

I2C; USB

.65 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e3

24

CY8C29466-24SXIT by Infineon Technologies

CY8C29466-24SXIT

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE

SOP28,.4

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.67 mm

32768

1024

7.505 mm

ALSO OPERATES AT 3V SUPPLY

NO

0

24 MHz

20

260

17.905 mm

2048

CMOS

14 mA

5 V

Microcontrollers

FLASH

1.27 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e4

24

CY8C4245AXI-483 by Infineon Technologies

CY8C4245AXI-483

Infineon Technologies

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP44,.47SQ,32

1.71 V

105 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

2048

10 mm

NO

48 MHz

20

260

10 mm

CMOS

13.8 mA

3.3 V

3

I2C; IDE; IRDA; LIN; SPI; UART

.8 mm

S-PQFP-G44

3

Not Qualified

e3

36

MIMX8ML8DVNLZAB by NXP Semiconductors

MIMX8ML8DVNLZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 548; Package Code: LFBGA; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

OTHER

BALL

548

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA548,29X29,20

.95 V

95 Cel

0 Cel

BOTTOM

1.481 mm

888832

15 mm

YES

0

24 MHz

40

260

15 mm

CMOS

2200 mA

1 V

16

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

.5 mm

S-PBGA-B548

3

136

CY8C24423A-24PVXIT by Infineon Technologies

CY8C24423A-24PVXIT

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

2.7/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

DUAL

2 mm

4096

256

5.3 mm

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

NO

0

24.6 MHz

20

260

10.2 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

USB

.65 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e3

24

MIMX8MQ6CVAHZAB by NXP Semiconductors

MIMX8MQ6CVAHZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, FINE PITCH

.9 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

2.18 mm

81920

17 mm

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

40 MHz

40

260

17 mm

CMOS

1 V

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

.65 mm

S-PBGA-B621

3

e2

16

CY8C24423A-24PVXI by Infineon Technologies

CY8C24423A-24PVXI

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

2.7/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

DUAL

2 mm

4096

256

5.3 mm

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

NO

0

24.6 MHz

20

260

10.2 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

USB

.65 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e3

24

CY8C29466-24PVXI by Infineon Technologies

CY8C29466-24PVXI

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

DUAL

2 mm

32768

1024

5.3 mm

ALSO OPERATES AT 3V SUPPLY

NO

0

24 MHz

20

260

10.2 mm

2048

CMOS

14 mA

5 V

Microcontrollers

FLASH

.65 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e3

24

MIMX8MM5CVTKZAA by NXP Semiconductors

MIMX8MM5CVTKZAA

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

SoC

INDUSTRIAL

BALL

486

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA486,27X27,20

.9 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

1.25 mm

288K

14 mm

24MHZ NOM CRYSTAL FREQ AVAILABLE

YES

40

260

14 mm

CMOS

.95 V

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

.5 mm

S-PBGA-B486

3

e2

16

MCIMX535DVV2C by NXP Semiconductors

MCIMX535DVV2C

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B529;

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.4 V

GRID ARRAY, FINE PITCH

1.3 V

TIN SILVER

BOTTOM

1.85 mm

19 mm

40

260

19 mm

CMOS

1.35 V

.8 mm

S-PBGA-B529

3

e2

CY8C4245LQI-483T by Infineon Technologies

CY8C4245LQI-483T

Infineon Technologies

Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

NOT SPECIFIED

NOT SPECIFIED

MIMX8MQ5CVAHZAB by NXP Semiconductors

MIMX8MQ5CVAHZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, FINE PITCH

.9 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

2.18 mm

81920

17 mm

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

40 MHz

40

260

17 mm

CMOS

1 V

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

.65 mm

S-PBGA-B621

3

e2

16

CY8C27443-24PVXI by Infineon Technologies

CY8C27443-24PVXI

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

DUAL

2 mm

16384

256

5.3 mm

ALSO OPERATES AT 3V WITH 93KHZ

NO

0

24 MHz

20

260

10.2 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

I2C; USB

.65 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e3

24

CY8C4245LQI-483 by Infineon Technologies

CY8C4245LQI-483

Infineon Technologies

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.71 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

2048

6 mm

NO

48 MHz

6 mm

CMOS

13.8 mA

3.3 V

3

I2C; IDE; IRDA; LIN; SPI; UART

.5 mm

S-XQCC-N40

3

Not Qualified

e4

34

MIMX8MM4CVTKZAA by NXP Semiconductors

MIMX8MM4CVTKZAA

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

SoC

INDUSTRIAL

BALL

486

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA486,27X27,20

.9 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

1.25 mm

288K

14 mm

24MHZ NOM CRYSTAL FREQ AVAILABLE

YES

40

260

14 mm

CMOS

.95 V

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

.5 mm

S-PBGA-B486

3

e2

16

MIMX8QP5AVUFFAB by NXP Semiconductors

MIMX8QP5AVUFFAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 1313; Package Code: FBGA; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

AUTOMOTIVE

BALL

1313

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

0

GRID ARRAY, FINE PITCH

1.05 V

125 Cel

-40 Cel

BOTTOM

2.52 mm

524288

29 mm

lsio contains 8 GPIO lines

YES

0

24 MHz

40

260

29 mm

CMOS

5000 mA

1.1 V

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

.75 mm

S-PBGA-B1313

3

1

MCIMX6Q5EYM10ADR by NXP Semiconductors

MCIMX6Q5EYM10ADR

NXP Semiconductors

Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

TIN SILVER COPPER

40

260

3

CY8C5468AXI-LP106 by Infineon Technologies

CY8C5468AXI-LP106

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2/5

FLATPACK, LOW PROFILE, FINE PITCH

BGA99,9X11,20

1.71 V

85 Cel

-40 Cel

MATTE TIN

N

QUAD

1.6 mm

32768

14 mm

YES

33 MHz

30

260

14 mm

2097152 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.5 mm

S-PQFP-G100

3

Not Qualified

e3

72

MIMX8ML3CVNKZAB by NXP Semiconductors

MIMX8ML3CVNKZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 548; Package Code: LFBGA; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

548

LFBGA

SQUARE

PLASTIC/EPOXY

YES

.9 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA548,29X29,20

.805 V

105 Cel

-40 Cel

BOTTOM

1.481 mm

888832

15 mm

ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE

YES

0

24 MHz

40

260

15 mm

CMOS

.85 V

16

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

.5 mm

S-PBGA-B548

3

160

CY8C5866AXI-LP020 by Infineon Technologies

CY8C5866AXI-LP020

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

MATTE TIN

N

QUAD

1.6 mm

8192

14 mm

YES

33 MHz

30

260

14 mm

524288 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.5 mm

S-PQFP-G100

3

Not Qualified

e3

72

CY8C24894-24LTXI by Infineon Technologies

CY8C24894-24LTXI

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

QUAD

1 mm

16384

512

8 mm

IT ALSO OPERATES AT 3 V MINIMUM SUPPLY

NO

0

24 MHz

20

260

8 mm

1024

CMOS

27 mA

5 V

Microcontrollers

FLASH

I2C; USB

.5 mm

S-XQCC-N56

3

Not Qualified

24.96 rpm

e3

50

CY8C4124PVI-432 by Infineon Technologies

CY8C4124PVI-432

Infineon Technologies

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

2048

5.3 mm

NO

0

24 MHz

10.2 mm

CMOS

7.2 mA

1.8 V

0

I2C, I2S, SPI, UART

.65 mm

R-PDSO-G28

3

Not Qualified

e4

24

CY8C5467AXI-LP108 by Infineon Technologies

CY8C5467AXI-LP108

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2/5

FLATPACK, LOW PROFILE, FINE PITCH

BGA99,9X11,20

1.71 V

85 Cel

-40 Cel

PURE TIN

N

QUAD

1.6 mm

16384

14 mm

YES

33 MHz

14 mm

1048576 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.5 mm

S-PQFP-G100

3

Not Qualified

72

MIMX8ML4DVNLZAB by NXP Semiconductors

MIMX8ML4DVNLZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 548; Package Code: LFBGA; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

OTHER

BALL

548

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA548,29X29,20

.95 V

95 Cel

0 Cel

BOTTOM

1.481 mm

888832

15 mm

YES

0

24 MHz

40

260

15 mm

CMOS

2200 mA

1 V

16

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

.5 mm

S-PBGA-B548

3

136

CY8C3866PVI-021 by Infineon Technologies

CY8C3866PVI-021

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: SSOP; Package Shape: RECTANGULAR;

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

2/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

DUAL

2.794 mm

4096

7.505 mm

YES

0

67 MHz

20

260

15.875 mm

65536 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

.635 mm

R-PDSO-G48

3

Not Qualified

e4

31

CY8C4245PVI-482 by Infineon Technologies

CY8C4245PVI-482

Infineon Technologies

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

1.8 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

4K

7.8 mm

NO

30

260

10.2 mm

CMOS

13.8 mA

3.3 V

I2C; IDE; IRDA; LIN; SPI; UART

.65 mm

R-PDSO-G28

3

Not Qualified

e4

24

CY8C5866LTI-LP022 by Infineon Technologies

CY8C5866LTI-LP022

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE;

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

16K

8 mm

YES

33 MHz

30

260

8 mm

524288 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.4 mm

S-XQCC-N68

3

Not Qualified

e4

48

CY8C24894-24LTXIT by Infineon Technologies

CY8C24894-24LTXIT

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

QUAD

1 mm

16384

512

8 mm

IT ALSO OPERATES AT 3 V MINIMUM SUPPLY

NO

0

24 MHz

20

260

8 mm

1024

CMOS

27 mA

5 V

Microcontrollers

FLASH

I2C; USB

.5 mm

S-XQCC-N56

3

Not Qualified

24.96 rpm

e3

50

MIMX8ML4CVNKZAB by NXP Semiconductors

MIMX8ML4CVNKZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 548; Package Code: LFBGA; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

548

LFBGA

SQUARE

PLASTIC/EPOXY

YES

.9 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA548,29X29,20

.805 V

105 Cel

-40 Cel

BOTTOM

1.481 mm

888832

15 mm

ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE

YES

0

24 MHz

40

260

15 mm

CMOS

.85 V

16

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

.5 mm

S-PBGA-B548

3

160

CY8C4248AZI-L485 by Infineon Technologies

CY8C4248AZI-L485

Infineon Technologies

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.71 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

32K

10 mm

YES

0

48 MHz

10 mm

CMOS

14.5 mA

1.8 V

I2C; USB; LPC

.5 mm

S-PQFP-G64

3

53

CY8C3866PVI-021T by Infineon Technologies

CY8C3866PVI-021T

Infineon Technologies

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: SSOP; Package Shape: RECTANGULAR;

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

2/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

85 Cel

-40 Cel

PURE TIN

N

DUAL

2.794 mm

4096

7.505 mm

YES

0

67 MHz

15.875 mm

65536 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2; 8051

.635 mm

R-PDSO-G48

3

Not Qualified

31

MIMX8MQ6CVAHZAA by NXP Semiconductors

MIMX8MQ6CVAHZAA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, FINE PITCH

.9 V

105 Cel

-40 Cel

BOTTOM

2.18 mm

81920

17 mm

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

40 MHz

260

17 mm

CMOS

1 V

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

.65 mm

S-PBGA-B621

3

16

MIMX8ML6CVNKZAB by NXP Semiconductors

MIMX8ML6CVNKZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 548; Package Code: LFBGA; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

548

LFBGA

SQUARE

PLASTIC/EPOXY

YES

.9 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA548,29X29,20

.805 V

105 Cel

-40 Cel

BOTTOM

1.481 mm

888832

15 mm

ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE

YES

0

24 MHz

40

260

15 mm

CMOS

.85 V

16

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

.5 mm

S-PBGA-B548

3

160

MIMX8QM6AVUFFAB by NXP Semiconductors

MIMX8QM6AVUFFAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 1313; Package Code: FBGA; Package Shape: SQUARE;

MULTIFUNCTION PERIPHERAL

AUTOMOTIVE

BALL

1313

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

0

GRID ARRAY, FINE PITCH

1.05 V

125 Cel

-40 Cel

TIN

BOTTOM

2.52 mm

524288

29 mm

lsio contains 8 GPIO lines

YES

0

24 MHz

40

260

29 mm

CMOS

5000 mA

1.1 V

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

.75 mm

S-PBGA-B1313

3

e3

1