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Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.

Multi-functional Peripherals

Available Parts 213

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
DRA725AGGABCQ1 by Texas Instruments

DRA725AGGABCQ1

Texas Instruments

The Texas Instruments DRA725AGGABCQ1 is a multi-functional peripheral with 760 terminals, 512K RAM words, and a max clock frequency of 38.4 MHz. Ideal for automotive applications, this microprocessor supports various bus compatibilities like CAN, Ethernet, and USB while operating at temperatures ranging from -40 to 125 °C.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

1176 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA725AGGABCRQ1 by Texas Instruments

DRA725AGGABCRQ1

Texas Instruments

DRA725AGGABCRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 760 terminals, and 512K RAM words. Ideal for automotive applications, this microprocessor features a max clock frequency of 38.4 MHz and operates in a temperature range from -40 to 125°C.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

1176 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

MCIMX6G1AVM05AB by NXP Semiconductors

MCIMX6G1AVM05AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

26

YES

16

FIXED POINT

YES

S-PBGA-B289

e2

14 mm

YES

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

14 mm

MULTIFUNCTION PERIPHERAL

MCIMX6G1AVM07AB by NXP Semiconductors

MCIMX6G1AVM07AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

26

YES

16

FIXED POINT

YES

S-PBGA-B289

e2

14 mm

YES

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

696 rpm

1.3 V

1.25 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

14 mm

MULTIFUNCTION PERIPHERAL

MCIMX6G2DVK05AB by NXP Semiconductors

MCIMX6G2DVK05AB

NXP Semiconductors

MCIMX6G2DVK05AB by NXP Semiconductors is a multi-functional peripheral IC with integrated cache and low power mode. It features an address bus width of 26, external data bus width of 16, and operates at a speed of 528 rpm. Ideal for applications requiring high-speed processing in compact electronic devices.

26

YES

16

FIXED POINT

YES

S-PBGA-B272

9 mm

YES

3

272

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

9 mm

MULTIFUNCTION PERIPHERAL

MCIMX6G2DVM05AB by NXP Semiconductors

MCIMX6G2DVM05AB

NXP Semiconductors

MCIMX6G2DVM05AB by NXP Semiconductors is a Multi-functional Peripherals IC with 16-bit external data bus width, integrated cache, and low power mode. It operates b/w 0-95 °C and has a max supply voltage of 1.3 V. Ideal for applications requiring high-speed processing in compact devices.

26

YES

16

FIXED POINT

YES

S-PBGA-B289

e1

14 mm

YES

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

MULTIFUNCTION PERIPHERAL

MCIMX6G3DVM05AB by NXP Semiconductors

MCIMX6G3DVM05AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

26

YES

16

FIXED POINT

YES

S-PBGA-B289

e1

14 mm

YES

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

MULTIFUNCTION PERIPHERAL

3530ECBCAMERCURY by Texas Instruments

3530ECBCAMERCURY

Texas Instruments

Texas Instruments 3530ECBCAMERCURY is a multi-functional peripheral with integrated cache and 64K RAM words. Featuring a max clock frequency of 38.4 MHz, it is ideal for industrial applications requiring high-speed processing. With compatibility for various bus types like CAN, I2C, and USB, this microprocessor offers versatile connectivity options.

26

YES

CAN; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

16

FIXED POINT

YES

S-PBGA-B515

e1

14 mm

YES

3

188

515

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

64K

1 mm

600 rpm

1.4175 V

1.2825 V

1.35 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

14 mm

MICROPROCESSOR, RISC

3530ECUSAGRM by Texas Instruments

3530ECUSAGRM

Texas Instruments

Texas Instruments 3530ECUSAGRM is a multi-functional peripheral with integrated cache and 64K RAM words. Featuring a max clock frequency of 38.4 MHz, it is ideal for industrial applications requiring low power mode and compatibility with CAN, I2C, IRDA, PCI, SPI, UART, USB buses.

26

YES

CAN; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

16

FIXED POINT

YES

S-PBGA-B423

e1

16 mm

YES

4

188

423

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

64K

1.4 mm

720 rpm

1.4175 V

1.2825 V

1.35 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.65 mm

BOTTOM

NOT SPECIFIED

16 mm

MICROPROCESSOR, RISC

OMAP3530ECBBALPD by Texas Instruments

OMAP3530ECBBALPD

Texas Instruments

OMAP3530ECBBALPD by Texas Instruments is a multi-functional peripheral with 64K RAM, 16-bit external data bus width, and 38.4 MHz clock frequency. Ideal for industrial applications requiring a microprocessor with low power mode, it supports various bus compatibilities like CAN, I2C, IRDA, PCI, SPI, UART, and USB.

26

YES

CAN; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

16

FIXED POINT

YES

S-PBGA-B515

e1

12 mm

YES

3

188

515

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

64K

.9 mm

720 rpm

1.4175 V

1.2825 V

1.35 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12 mm

MICROPROCESSOR, RISC

OMAP3530ECBBLPD by Texas Instruments

OMAP3530ECBBLPD

Texas Instruments

OMAP3530ECBBLPD by Texas Instruments features 64K RAM, 16-bit external data bus, and 38.4 MHz clock frequency. Ideal for microprocessor applications requiring low power mode and compatibility with CAN, I2C, IRDA, PCI, SPI, UART, and USB interfaces.

26

YES

CAN; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

16

FIXED POINT

YES

S-PBGA-B515

e1

12 mm

YES

3

188

515

90 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

64K

.9 mm

720 rpm

1.4175 V

1.2825 V

1.35 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12 mm

MICROPROCESSOR, RISC

66AK2H06DAAW24 by Texas Instruments

66AK2H06DAAW24

Texas Instruments

The Texas Instruments 66AK2H06DAAW24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It is a microprocessor suitable for applications requiring Ethernet, I2C, PCI, SPI, UART, and USB compatibility. The device operates b/w temperatures of 0 to 85°C and features a terminal pitch of 1mm.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H06DAAW2 by Texas Instruments

66AK2H06DAAW2

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H06DAAWA24 by Texas Instruments

66AK2H06DAAWA24

Texas Instruments

The Texas Instruments 66AK2H06DAAWA24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It operates in industrial temperature grades, featuring a CMOS technology microprocessor suitable for applications requiring Ethernet, I2C, PCI, SPI, UART, and USB bus compatibility. With a package style of grid array and terminal pitch of 1mm, it offers high performance in compact dimensions.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H06DAAWA2 by Texas Instruments

66AK2H06DAAWA2

Texas Instruments

The Texas Instruments 66AK2H06DAAWA2 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It operates in industrial temperature range, suitable for microprocessor applications requiring Ethernet, I2C, PCI, SPI, UART, and USB compatibility. The package style is grid array with 1517 terminals and a terminal pitch of 1mm.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H12DAAW24 by Texas Instruments

66AK2H12DAAW24

Texas Instruments

The Texas Instruments 66AK2H12DAAW24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It is a microprocessor with RISC technology, suitable for applications requiring Ethernet, I2C, PCI, SPI, UART, and USB compatibility. The package style is grid array with 1517 terminals in a square shape measuring 40mm x 40mm.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H12DAAW2 by Texas Instruments

66AK2H12DAAW2

Texas Instruments

The Texas Instruments 66AK2H12DAAW2 is a multi-functional peripheral with 32-bit address bus width and 128 external data bus width. It is a microprocessor RISC type IC suitable for applications requiring Ethernet, I2C, PCI, SPI, UART, and USB compatibility. With a package style of grid array and terminal pitch of 1mm, it operates b/w 0 to 85°C temperature range.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H12DAAWA24 by Texas Instruments

66AK2H12DAAWA24

Texas Instruments

The Texas Instruments 66AK2H12DAAWA24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It is a microprocessor suitable for industrial applications, featuring a CMOS technology and compatibility with Ethernet, I2C, PCI, SPI, UART, and USB buses. The package style is grid array with 1517 terminals in a square shape.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H12DAAWA2 by Texas Instruments

66AK2H12DAAWA2

Texas Instruments

The Texas Instruments 66AK2H12DAAWA2 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It operates in industrial temperature grades, suitable for applications requiring Ethernet, I2C, PCI, SPI, UART, and USB compatibility. The microprocessor features a CMOS technology with 6M RAM words and 32 I/O lines for versatile connectivity options.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H12DXAAWA24 by Texas Instruments

66AK2H12DXAAWA24

Texas Instruments

The Texas Instruments 66AK2H12DXAAWA24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It operates in industrial temperature grades, suitable for microprocessor applications requiring Ethernet, I2C, PCI, SPI, UART, and USB compatibility. The package style is a grid array with 1517 terminals and a terminal pitch of 1mm.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H14DAAW24 by Texas Instruments

66AK2H14DAAW24

Texas Instruments

The Texas Instruments 66AK2H14DAAW24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It features a CMOS technology microprocessor with 6M RAM words, suitable for applications requiring Ethernet, I2C, PCI, SPI, UART, and USB bus compatibility. The package style is grid array with 1517 terminals in a square shape measuring 40mm x 40mm.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H14DAAWA24 by Texas Instruments

66AK2H14DAAWA24

Texas Instruments

The Texas Instruments 66AK2H14DAAWA24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It operates in industrial temperature grades, suitable for microprocessor applications requiring Ethernet, I2C, PCI, SPI, UART, and USB compatibility. The package style is a grid array with 1517 terminals and CMOS technology.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H14DXAAWA24 by Texas Instruments

66AK2H14DXAAWA24

Texas Instruments

The Texas Instruments 66AK2H14DXAAWA24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It is a microprocessor suitable for industrial applications, featuring a CMOS technology and compatibility with Ethernet, I2C, PCI, SPI, UART, and USB buses. The package style is grid array with 1517 terminals in a square shape measuring 40mm x 40mm.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

DRA726APGABCQ1 by Texas Instruments

DRA726APGABCQ1

Texas Instruments

DRA726APGABCQ1 by Texas Instruments is a multi-functional peripheral IC with 32-bit external data bus width, 512K RAM words, and 27 MHz max clock frequency. It is designed for automotive applications, featuring a CMOS technology, AEC-Q100 screening level, and compatibility with CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB interfaces.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

27 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA726APGABCRQ1 by Texas Instruments

DRA726APGABCRQ1

Texas Instruments

DRA726APGABCRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 512K RAM words, and 27 MHz max clock frequency. Ideal for automotive applications, it supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

27 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

W83627DHG-PT by Nuvoton Technology

W83627DHG-PT

Nuvoton Technology

W83627DHG-PT by Nuvoton Technology is a multi-functional peripheral with a rectangular package shape and plastic/epoxy body material. It operates at a supply voltage range of 3.135V to 3.465V and has 128 terminals. This device is commonly used in industrial applications that require I2C, IRDA, PCI, PS/2, SMBUS, SPI, and UART bus compatibility.

MULTIPROTOCOL PARALLEL PORT TYPE

NO

I2C; IRDA; PCI; PS/2; SMBUS; SPI; UART

R-PQFP-G128

20 mm

3

40

128

85 Cel

-40 Cel

PLASTIC/EPOXY

FQFP

QFP128,.67X.93,20

RECTANGULAR

FLATPACK, FINE PITCH

260

3.3

Not Qualified

3.4 mm

Other Microprocessor ICs

25 mA

3.465 V

3.135 V

3.3 V

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

QUAD

14 mm

XS1-L4A-64-TQ48-C4 by Xmos

XS1-L4A-64-TQ48-C4

Xmos

XS1-L4A-64-TQ48-C4 by Xmos is a CMOS device with 32768 RAM words, operating at up to 100 MHz. It features 28 I/O lines, SPI and USB bus compatibility, suitable for multi-functional peripherals applications. The package style is flatpack with a thin profile and gull wing terminal form.

0

YES

SPI, USB

100 MHz

0

S-PQFP-G48

7 mm

28

48

70 Cel

0 Cel

PLASTIC/EPOXY

HTFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

32768

1.2 mm

1.05 V

.95 V

1 V

YES

CMOS

COMMERCIAL

GULL WING

.5 mm

QUAD

7 mm

LS1026ASN8P1A by NXP Semiconductors

LS1026ASN8P1A

NXP Semiconductors

LS1026ASN8P1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 1400 MHz max clock frequency, and 780 terminals. It is ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility in a compact square package with a terminal pitch of 0.8 mm.

14

YES

I2C, PCI, SPI, UART, USB

1400 MHz

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

ST2100TR by STMicroelectronics

ST2100TR

STMicroelectronics

ST2100TR by STMicroelectronics is a versatile multifunction peripheral with a max supply voltage of 1.32V and operates in extreme temps from -40 °C to 85 °C. It features a 15-bit address bus and supports various protocols like CAN, USB, and SPI. Ideal for industrial applications requiring compact design and robust performance.

15

YES

CAN; ETHERNET; I2C; I2S; IRDA; PCI; SPI; UART; USB

16

S-PBGA-B373

12 mm

40

4

373

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA373,23X23,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

8192

1.2 mm

1.32 V

1.08 V

1.2 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12 mm

MULTIFUNCTION PERIPHERAL

TDA2EGBHQCBDRQ1 by Texas Instruments

TDA2EGBHQCBDRQ1

Texas Instruments

Multifunction Peripherals; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 538; Package Code: LFBGA; Package Shape: SQUARE;

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

S-PBGA-B538

e1

17 mm

3

186

538

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

512K

AEC-Q100

1.298 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

DRA710BEGCBDQ1 by Texas Instruments

DRA710BEGCBDQ1

Texas Instruments

DRA710BEGCBDQ1 by Texas Instruments is a multi-functional peripheral with 32MHz clock frequency, 538 terminals, and 512K RAM words. Ideal for automotive applications, it supports CAN, Ethernet, I2C, IRDA, PCI, SPI, UART & USB bus compatibility.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

32 MHz

32

S-PBGA-B538

e1

17 mm

3

186

538

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

512K

AEC-Q100

1.298 mm

600 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

DRA790BAGCBDQ1 by Texas Instruments

DRA790BAGCBDQ1

Texas Instruments

DRA790BAGCBDQ1 by Texas Instruments is a multi-functional peripheral with 16-bit address bus, 32-bit external data bus width, and 512K RAM words. Ideal for automotive applications, it operates at temperatures ranging from -40 to 125 °C and supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

S-PBGA-B538

e1

17 mm

3

186

538

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

512K

AEC-Q100

1.298 mm

300 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

LS1026ASE8MQA by NXP Semiconductors

LS1026ASE8MQA

NXP Semiconductors

LS1026ASE8MQA by NXP Semiconductors is a multi-functional peripheral with a package body made of plastic/epoxy. It has a max supply voltage of 0.93V and an address bus width of 14. This versatile component is compatible with I2C, PCI, SPI, UART, and USB buses and can be used in various applications requiring high-performance peripherals.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASE8P1A by NXP Semiconductors

LS1026ASE8P1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Minimum Supply Voltage: .97 V;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASE8Q1A by NXP Semiconductors

LS1026ASE8Q1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASE8T1A by NXP Semiconductors

LS1026ASE8T1A

NXP Semiconductors

LS1026ASE8T1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility in a compact grid array package style.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASN8MQA by NXP Semiconductors

LS1026ASN8MQA

NXP Semiconductors

LS1026ASN8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is suitable for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility. The package style is grid array with fine pitch terminals and CMOS technology.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASN8Q1A by NXP Semiconductors

LS1026ASN8Q1A

NXP Semiconductors

LS1026ASN8Q1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 780 terminals. It is suitable for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASN8T1A by NXP Semiconductors

LS1026ASN8T1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Address Bus Width: 14;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXE8MQA by NXP Semiconductors

LS1026AXE8MQA

NXP Semiconductors

LS1026AXE8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width and 14-bit address bus width. It features a grid array, fine pitch package style and is compatible with I2C, PCI, SPI, UART, and USB buses. This component is suitable for applications requiring high-speed data processing in compact electronic devices.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXE8P1A by NXP Semiconductors

LS1026AXE8P1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXE8Q1A by NXP Semiconductors

LS1026AXE8Q1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 2.61 mm;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXE8T1A by NXP Semiconductors

LS1026AXE8T1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXN8MQA by NXP Semiconductors

LS1026AXN8MQA

NXP Semiconductors

LS1026AXN8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility. The package style is grid array with fine pitch terminals and a square shape measuring 23mm x 23mm.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXN8P1A by NXP Semiconductors

LS1026AXN8P1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXN8Q1A by NXP Semiconductors

LS1026AXN8Q1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXN8T1A by NXP Semiconductors

LS1026AXN8T1A

NXP Semiconductors

LS1026AXN8T1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals in a grid array package style. It supports I2C, PCI, SPI, UART, USB buses and has a max supply voltage of 1.03V. Ideal for applications requiring high-speed data processing and connectivity.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046ASE8MQA by NXP Semiconductors

LS1046ASE8MQA

NXP Semiconductors

LS1046ASE8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is suitable for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility. The package style is grid array with fine pitch terminals and CMOS technology.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm