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66AK2H14DAAW24

Texas Instruments

66AK2H14DAAW24 by Texas Instruments

The Texas Instruments 66AK2H14DAAW24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It features a CMOS technology microprocessor with 6M RAM words, suitable for applications requiring Ethernet, I2C, PCI, SPI, UART, and USB bus compatibility. The package style is grid array with 1517 terminals in a square shape measuring 40mm x 40mm.

Median Price

$885.959

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 331 parts In-Stock

1+ parts

$885.959

100+ parts

$801.946

1k+ parts

$763.758

10k+ parts

-

331

$885.959

$801.946

$763.758

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,539 parts In-Stock

1+ parts

$841.661

100+ parts

-

1k+ parts

-

10k+ parts

-

3,539

$841.661

-

-

-

Vyrian

USA . 8,862 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,862

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 238 parts In-Stock

1+ parts

$21.950

100+ parts

-

1k+ parts

-

10k+ parts

-

238

$21.950

-

-

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Parana Technologies

USA . 756 parts In-Stock

1+ parts

$64.269

100+ parts

-

1k+ parts

-

10k+ parts

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756

$64.269

-

-

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DigiPath Technology Company

USA . 1,433 parts In-Stock

1+ parts

$70.768

100+ parts

-

1k+ parts

-

10k+ parts

-

1,433

$70.768

-

-

-

ChromeModa Solutions

Germany . 1,761 parts In-Stock

1+ parts

$72.212

100+ parts

$59.214

1k+ parts

-

10k+ parts

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1,761

$72.212

$59.214

-

-

IDEA Electronic Components Group

UK . 952 parts In-Stock

1+ parts

$72.212

100+ parts

$68.601

1k+ parts

$64.991

10k+ parts

-

952

$72.212

$68.601

$64.991

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Corohmni

South Africa . 240 parts In-Stock

1+ parts

$78.395

100+ parts

-

1k+ parts

-

10k+ parts

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240

$78.395

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-

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Native Components

USA . 721 parts In-Stock

1+ parts

$165.235

100+ parts

-

1k+ parts

-

10k+ parts

$158.626

721

$165.235

-

-

$158.626

Northwest PG Solutions

USA . 453 parts In-Stock

1+ parts

$181.759

100+ parts

-

1k+ parts

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453

$181.759

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-

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Corphita

USA . 3,904 parts In-Stock

1+ parts

$797.363

100+ parts

-

1k+ parts

-

10k+ parts

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3,904

$797.363

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-

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Component Stockers USA

USA . 3 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3

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Overview

Experience the next level of performance and efficiency with the Texas Instruments 66AK2H14DAAW24. Crafted with precision and expertise, this multi-functional peripheral is designed to elevate your projects to new heights. From its cutting-edge technology to its versatile applications in various industries, this product offers unparalleled value and benefits to customers seeking top-tier solutions. Trust in Texas Instruments for quality and innovation, and unlock endless possibilities with the 66AK2H14DAAW24.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight, durable, and cost-effective, making the product easy to handle and maintain.

Maximum Supply Voltage: 1.05 V

Higher maximum supply voltage ensures stable and reliable performance of the device under varying power conditions.

RAM Words: 6M

Having 6 million RAM words allows for efficient multitasking and storage of large amounts of data, enhancing the device's functionality.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC microprocessors are known for their high performance and power efficiency, making this product suitable for multitasking and intensive computing tasks.

Bus Compatibility: ETHERNET; I2C; PCI; SPI; UART; USB

Compatibility with various bus standards ensures seamless connectivity with a wide range of devices and networks, enhancing the versatility of the product.

Technical Specifications

Multi-functional Peripherals 66AK2H14DAAW24 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

ETHERNET; I2C; PCI; SPI; UART; USB

External Data Bus Width:

128

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

32

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

RAM Words:

6M

Maximum Seated Height:

3.62 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

66AK2H14DAAW24 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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